A thermosetting resin composition containing a thermosetting resin (A), boron nitride (B), and a dispersant (C) with a pH of 8 or higher.

A resin composition and an article made from the resin composition are provided. The resin composition comprises: 30 parts by weight of thermosetting resin; 50 to 125 parts by weight of maleimide resin; and 5 to 35 parts by weight of monofunctional long-chain alkyl acrylate monomer. The resin composition is capable of achieving a proper viscosity and a good filling property whiling maintaining a high glass transition temperature.

A thermosetting resin composition having improved flowability and stiffness, and a prepreg using the same. Specifically, three kinds of fillers having different average particle diameters are combined with a binder resin system including an epoxy resin, a bismaleimide resin, a diaminodiphenylsulfone resin, and a benzoxazine resin.

A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations.

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A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

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A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 μm; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, ratio of thermal expansion, copper foil peeling strength, thermal resistance after moisture absorption, dissipation factor, amount of resin cluster and appearance of cooper-free circuit board.

Provided is a resin composition that has a low melt viscosity, and is capable of being turned into a cured product having a high heat resistance, a high adhesion and a high glass-transition temperature, though having a low permittivity and a low dielectric tangent. The resin composition is a cyclic imide resin composition containing: (a) a cyclic imide compound represented by the following formula (1),

##STR00001## (b) a cyclic imide compound represented by the following formula (2),

##STR00002##

and (c) a curing catalyst.

Methods and systems, and components made according to the methods and systems, are disclosed relating to improved methods for fabricating resin-containing composite prepreg materials, wherein the prepreg plies are treated with a particulate material to achieve predetermined spatially variable shear and tack values at a predetermined location on at least one prepreg ply surface of at least one prepreg ply.

This resin composition contains a first resin and a second resin, and exhibits curability by thermal crosslinking, wherein the first resin is at least one selected from among a bifunctional epoxy resin having a weight average molecular weight of 4,000 or more, and a phenoxy resin, and the second resin is a polycarbonate resin. The content ratio, by weight, of the first resin to the second resin (the first resin:the second resin) is preferably in the range of 9:1 to 2:8. Both the first resin and the second resin preferably have a bisphenol skeleton in a molecule.

The present invention relates to an expandable polymeric composition comprising: a) a polymeric matrix containing vinyl aromatic polymers and/or copolymers; b) from 0.1% to 20% by weight, calculated on the polymeric matrix (a), of an athermanous agent; c) from 0.01% to 10% by weight, calculated on the polymeric matrix (a), of at least one non-polymeric brominated flame retardant additive; d) from 0.01% to 10% by weight, calculated on the polymeric matrix (a), of at least one brominated polymer containing at least 50% bromine; e) from 0.01% to 5% by weight, calculated on the polymeric matrix (a), of a synergistic flame retardant additive; f) from 1% by weight to 10% by weight of at least one blowing agent.