Patent classifications
C08J2463/00
Methods and systems for coating and sealing inside piping systems
Methods and systems for cleaning, coating and sealing leaks in existing pipes, in a single operation. A piping system can be cleaned in one pass by dry particulates forced and pulled by air throughout the piping system by a generator and a vacuum. Pipes can be protected from water corrosion, erosion and electrolysis, extending the life of pipes such as copper, steel, lead, brass, cast iron piping and composite materials. Coatings can be applied to pipes having diameters up to approximately 6″. Leak sealants of at least approximately 4 mils thick can cover insides of pipes, and can include novel mixtures of fillers and epoxy materials, and viscosity levels. A positive pressure can be maintained within the pipes during applications. Piping systems can be returned to service within approximately 96 hours.
METHOD FOR PRODUCING PREPREG, AND PREPREG
Disclosed is a method for producing a prepreg, the prepreg having: a reinforcing fiber layer including reinforcing fibers and a resin composition containing component (A), component (B), and component (C), the reinforcing fibers being impregnated with the resin composition in between the fibers; and a surface fiber layer provided on the surface of the reinforcing fiber layer and including a fabric including polyamide fibers and a resin composition containing component (A), component (B), and component (C), the polyamide fibers being impregnated with the resin composition in between the fibers. The method for producing a prepreg includes a disposition step of disposing the fabric on the surface of a reinforcing fiber base material and an impregnation step of supplying a resin composition to the reinforcing fiber base material and impregnating the reinforcing fibers with the resin composition in between the fibers.
Golf club shaft
An object of the present invention is to provide a golf club shaft having excellent strength. The present invention provides a golf club shaft made of a fiber-reinforced epoxy resin material comprising a cured product of an epoxy resin composition and a reinforcing fiber, wherein the epoxy resin composition comprises at least one selected from the group consisting of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin and a novolac type epoxy resin, and a tetraglycidyl type epoxy resin as an epoxy resin component, and the cured product of the epoxy resin composition has a swelling ratio in a range from 20 mass % to 44 mass % in methyl ethyl ketone.
Methods involving oxygen plasma exposure to improve adhesion of silicate thermal coatings
A method of making a thermal control coating is provided. A primer layer can be applied to a substrate to form an exposed surface. The primer layer can include an epoxy binder and a silica filler. The exposed surface can be treated with an oxygen plasma to form a treated surface. A silicate-based thermal control coating can be applied to the treated surface, for example, by spraying, to form a thermal control coating on the substrate. Spacecraft and spacecraft hardware components coated with the thermal control coating, are also provided.
SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM
A soft magnetic resin composition contains flat soft magnetic particles, and a resin component containing an epoxy resin, a phenol resin, and an acrylic resin. The epoxy resin consists of only an epoxy resin having three or more functional groups, the phenol resin consists of only a phenol resin having three or more functional groups, and the content ratio of the acrylic resin in the resin component is 25 mass % or more.
RESIN MOLDED ARTICLE AND METHOD FOR MANUFACTURING THE SAME
A resin molded article includes an insert component and a synthetic resin member sealing the insert component. The insert component is provided by a primary molded product of a thermosetting resin, or a metal component, and has a functional group. The synthetic resin member is provided by a synthetic resin including a base polymer of a thermoplastic resin and a bonding component bonding with the functional group included in the insert component. The synthetic resin member has a sea structure formed of a continuous phase including the base polymer, and at least a part of the bonding component is present as a dispersed component in the sea structure. The dispersed component bonds with the functional group included in the insert component.
RESIN COMPOSITION AND USES OF THE SAME
A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (DO of not higher than 0.006 at 10 GHz; and (b) a metal hypophosphite of formula (I),
##STR00001## wherein a, R, and M.sup.a+ are as defined in the specification, and wherein the amount of the metal hypophosphite (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the metal hypophosphite (b).
THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATED BOARD PREPARED THEREFROM
A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.
FILLER-CONTAINING FILM
A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 μm, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.
Two-Component Phosphate Ester Cavity Filling Semi Rigid Foam
The present teachings provide a method and composition related to two component epoxy phosphate ester based foam materials. The present teachings provide a method comprising: providing a two component system, the two component system including an A side and a B side, the A side including epoxy and the B side including phosphate ester and phosphoric acid; mixing the A side and the B side to form a resulting reaction product; wherein the resulting reaction product of the A side and the B side cures at a temperature of less than 50° C. The present teachings provide a composition comprising: a) a first component including epoxy; b) a second component including phosphate ester and phosphoric acid; and wherein a resulting reaction product of the first component and second component cures at a temperature of less than 50° C.