Disclosed herein are compositions comprising from about 0.01 wt. % to about 98 wt. % of a polycarbonate polymer component; and from greater than 1 wt. % to about 10 wt. % of a perfluorinated polyether additive, wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition. The composition exhibits a viscosity less than that of a substantially identical composition in the absence of the perfluorinated polyether additive when tested in accordance with ASTM D3835 at a shear rate of 500 s.sup.−1. The composition may comprise a wear factor K of less than 200×10-10 in 5-min/ft-lb-hr as measured at 50 fpm and 40 psi compared to steel in accordance with a modified ASTM D-3702.

Disclosed herein are compositions comprising from about 0.01 wt. % to about 98 wt. % of a polycarbonate polymer component; and from greater than 1 wt. % to about 10 wt. % of a perfluorinated polyether additive, wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition. The composition exhibits a viscosity less than that of a substantially identical composition in the absence of the perfluorinated polyether additive when tested in accordance with ASTM D3835 at a shear rate of 500 s.sup.−1. The composition may comprise a wear factor K of less than 200×10-10 in 5-min/ft-lb-hr as measured at 50 fpm and 40 psi compared to steel in accordance with a modified ASTM D-3702.

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

The present disclosure relates to a precursor composition of a pressure sensitive adhesive comprising: a) a (co)polymeric base component having a weight-average molecular weight (M.sub.w) no greater than 500,000 g/mol and comprising at least one reactive functional group (X); and b) a multi-functional oligomeric branching compound comprising an oligomer backbone and having a weight-average molecular weight (M.sub.w) greater than 250 g/mol, wherein the multi-functional oligomeric branching compound comprises at least two complementary reactive functional groups (Y) which are capable of chemically reacting with the at least one reactive functional group (X) of the (co)polymeric base component.

The present disclosure relates to a precursor composition of a pressure sensitive adhesive comprising: a) a (co)polymeric base component having a weight-average molecular weight (M.sub.w) no greater than 500,000 g/mol and comprising at least one reactive functional group (X); and b) a multi-functional oligomeric branching compound comprising an oligomer backbone and having a weight-average molecular weight (M.sub.w) greater than 250 g/mol, wherein the multi-functional oligomeric branching compound comprises at least two complementary reactive functional groups (Y) which are capable of chemically reacting with the at least one reactive functional group (X) of the (co)polymeric base component.

A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

##STR00001##