A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

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High temperature lubricants for magnetic media are provided. One such lubricant includes fluoroalkyl, fluoroalkenyl, perfluoroalkyl, or perfluoroalkyl ether segments, anchoring functional groups engageable with a protective overcoat of a magnetic recording media, and cyclic functional groups. The lubricants can be used in conjunction with a magnetic recording medium and/or a magnetic data storage system.

Some variations provide a sensing system configured to measure the concentration of an antimicrobial agent in a polymer, comprising: a polymer containing (i) a discrete solid structural phase comprising a solid structural polymer and (ii) a continuous transport phase comprising a solid transport polymer and capable of containing the antimicrobial agent; and an antimicrobial-agent sensor that chemically senses the antimicrobial agent. The antimicrobial-agent sensor is disposed on a surface of, and in mass transport with, the polymer. The antimicrobial-agent sensor contains a responsive material disposed on or within a carrier material. The responsive material is chemically reactive with the antimicrobial agent and exhibits an observable and quantifiable property change upon chemically reacting with the antimicrobial agent. The observable and quantifiable property change may involve chromaticity, optical transparency, ionic conductivity, or electronic conductivity, for example. Some variations provide methods of making and/or using the sensing system.

Some variations provide a sensing system configured to measure the concentration of an antimicrobial agent in a polymer, comprising: a polymer containing (i) a discrete solid structural phase comprising a solid structural polymer and (ii) a continuous transport phase comprising a solid transport polymer and capable of containing the antimicrobial agent; and an antimicrobial-agent sensor that chemically senses the antimicrobial agent. The antimicrobial-agent sensor is disposed on a surface of, and in mass transport with, the polymer. The antimicrobial-agent sensor contains a responsive material disposed on or within a carrier material. The responsive material is chemically reactive with the antimicrobial agent and exhibits an observable and quantifiable property change upon chemically reacting with the antimicrobial agent. The observable and quantifiable property change may involve chromaticity, optical transparency, ionic conductivity, or electronic conductivity, for example. Some variations provide methods of making and/or using the sensing system.

An aromatic polyether including structural units represented by the following formulas (1A) to (4A):

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Magnet wire included extruded insulation formed from a blend of two or more different polymeric materials is described. A magnet wire may include a conductor and insulation formed around the conductor. The insulation may include at least one layer of extruded insulation formed from a blend of a first polymeric material and a second polymeric material different than the first polymeric material. The first polymeric material may include one of polyetheretherketone, polyaryletherketone, polyetherketoneketone, polyphenylsulfone, polyphenylene sulfide, or polybenzimidazole. The second polymeric material may include one of polyphenylsulfone, polyetherimide, polyethersulfone, polyphenylene sulfide, polycarbonate, or polyester.

Magnet wire included extruded insulation formed from a blend of two or more different polymeric materials is described. A magnet wire may include a conductor and insulation formed around the conductor. The insulation may include at least one layer of extruded insulation formed from a blend of a first polymeric material and a second polymeric material different than the first polymeric material. The first polymeric material may include one of polyetheretherketone, polyaryletherketone, polyetherketoneketone, polyphenylsulfone, polyphenylene sulfide, or polybenzimidazole. The second polymeric material may include one of polyphenylsulfone, polyetherimide, polyethersulfone, polyphenylene sulfide, polycarbonate, or polyester.

There is provided a pre-applied semiconductor sealing film for curing under pressure atmosphere as a non conductive film (NCF) suitable for pressure mounting. This NCF includes (A) a solid epoxy resin, (B) an aromatic amine which is liquid at room temperature and contains at least one of structures represented by formulae 1 and 2 below, (C) a silica filler, and (D) a polymer resin having a mass average molecular weight (Mw) of 6000 to 100000. The epoxy resin of the component (A) has an epoxy equivalent weight of 220 to 340. The component (B) is included in an amount of 6 to 27 parts by mass relative to 100 parts by mass of the component (A). The component (C) is included in an amount of 20 to 65 parts by mass relative to 100 parts by mass in total of the components. A content ratio ((A):(D)) between the component (A) and the component (D) is 99:1 to 65:35. This NCF further has a melt viscosity at 120° C. of 100 Pa.Math.s or less, and has a melt viscosity at 120° C., after heated at 260° C. or more for 5 to 90 seconds, of 200 Pa.Math.s or less.

There is provided a pre-applied semiconductor sealing film for curing under pressure atmosphere as a non conductive film (NCF) suitable for pressure mounting. This NCF includes (A) a solid epoxy resin, (B) an aromatic amine which is liquid at room temperature and contains at least one of structures represented by formulae 1 and 2 below, (C) a silica filler, and (D) a polymer resin having a mass average molecular weight (Mw) of 6000 to 100000. The epoxy resin of the component (A) has an epoxy equivalent weight of 220 to 340. The component (B) is included in an amount of 6 to 27 parts by mass relative to 100 parts by mass of the component (A). The component (C) is included in an amount of 20 to 65 parts by mass relative to 100 parts by mass in total of the components. A content ratio ((A):(D)) between the component (A) and the component (D) is 99:1 to 65:35. This NCF further has a melt viscosity at 120° C. of 100 Pa.Math.s or less, and has a melt viscosity at 120° C., after heated at 260° C. or more for 5 to 90 seconds, of 200 Pa.Math.s or less.

A composition based on poly(ether ether ketone) (PEEK) including poly(ether ketone ketone) (PEKK), wherein the poly(ether ketone ketone) (PEKK) includes a mixture of terephthalic and isophthalic units, the percentage by weight of terephthalic units, with respect to the sum of the terephthalic and isophthalic units, being between 55 and 85%, limits included, and preferably between 55 and 70%, the composition including between 1 and 40%, limits included, preferably between 5 and 40% and more preferably still between 10 and 30% by weight of PEKK, with respect to the total weight of the composition.