According to an example aspect of the present invention, there is provided a composition comprising colloidal lignin particles and an epoxy compound.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

Two-part curable compositions capable of demonstrating substantially no phase separation at room temperature over time and improved adhesion strength retention at elevated temperature conditions.

A high-temperature-resistant insulating polymer composite is provided, including the following components in parts by mass: 3-12 parts of cyanate ester resin, 3-20 parts of epoxy resin, 5-15 parts of an inorganic filler, 0.1-2 parts of an epoxy resin curing agent, 0.0001-0.005 parts of a curing accelerant, and 0.1-2 parts of a dispersant. A glass transition temperature of the cured high-temperature-resistant insulating polymer composite is higher than 120° C.

An object of the present disclosure is to provide a composite material laminate excellent in impact resistance and vibration damping property. The present disclosure is a composite material laminate including a metal substrate, an adhesive layer formed on a surface of the metal substrate, and a foamed body layer formed on a surface of the adhesive layer, wherein a shear fracture strength (S) at an interface between the metal substrate and the adhesive layer is 1.0 MPa or more, and (S/F) determined by dividing the shear fracture strength (S) at the interface by a bending elastic modulus (F) of the foamed body layer is 0.007 or more and 0.5 or less.

An object of the present disclosure is to provide a composite material laminate excellent in impact resistance and vibration damping property. The present disclosure is a composite material laminate including a metal substrate, an adhesive layer formed on a surface of the metal substrate, and a foamed body layer formed on a surface of the adhesive layer, wherein a shear fracture strength (S) at an interface between the metal substrate and the adhesive layer is 1.0 MPa or more, and (S/F) determined by dividing the shear fracture strength (S) at the interface by a bending elastic modulus (F) of the foamed body layer is 0.007 or more and 0.5 or less.

Provided is an aminimide compound that is excellent in penetration and has excellent curability and storage stability. An aminimide compound represented by the following formula (1), (2) or (3):

##STR00001##

wherein each R.sub.1 independently represents a hydrogen atom, or a monovalent or n-valent organic group having 1 to 15 carbon atoms and optionally having a hydroxy group, a carbonyl group, an ester bond, or an ether bond; R.sub.2 and R.sub.3 each independently represent an unsubstituted or substituted alkyl group having 1 to 12 carbon atoms, aryl group, aralkyl group, or heterocyclic ring having 7 or less carbon atoms in which R.sub.2 and R.sub.3 are linked to each other; each R.sub.4 independently represents a hydrogen atom, or a monovalent or n-valent organic group having 1 to 30 carbon atoms and optionally containing an oxygen atom; and n represents an integer of 1 to 3.

Provided is an aminimide compound that is excellent in penetration and has excellent curability and storage stability. An aminimide compound represented by the following formula (1), (2) or (3):

##STR00001##

wherein each R.sub.1 independently represents a hydrogen atom, or a monovalent or n-valent organic group having 1 to 15 carbon atoms and optionally having a hydroxy group, a carbonyl group, an ester bond, or an ether bond; R.sub.2 and R.sub.3 each independently represent an unsubstituted or substituted alkyl group having 1 to 12 carbon atoms, aryl group, aralkyl group, or heterocyclic ring having 7 or less carbon atoms in which R.sub.2 and R.sub.3 are linked to each other; each R.sub.4 independently represents a hydrogen atom, or a monovalent or n-valent organic group having 1 to 30 carbon atoms and optionally containing an oxygen atom; and n represents an integer of 1 to 3.

A multilayer electronic component includes: a body and an external electrode disposed on the body, wherein the external electrode includes a conductive resin layer containing a bisphenol A-based resin and a biphenyl-based resin with a specific mixing ratio (e.g., a ratio of a content of the biphenyl-based resin with respect to a total content is 10 wt % or more and 50 wt % or less). Such a resin mixing ratio between the bisphenol A-based resin and the biphenyl-based resin can lead to 0.337≤2*C/A≤0.367 or 0.048≤B/A≤0.14, with an aromatic ring peak intensity (A), a carbonyl peak intensity (B), and an alcohol peak intensity (C) in a Fourier transform infrared spectroscopy (FT-IR) analysis. The multilayer electronic component showing such peak intensity characteristics can suppress oxidation of a conductive resin layer while also securing excellent adhesive strength of the conductive resin layer.