The present invention relates to a polymer composition comprising (A) from 60 to 90 wt % of a non-elastomeric polyethylene; (B) from 9.0 to 38 wt % of an elastomer; wherein onto component (A) or components (A) and (B) an acid grafting agent (C) has been grafted in an amount of from 0.01 to 3.0 wt %, all based on the total weight of the polymer composition, and wherein the polymer composition has two distinct peaks and a valley between said peaks in the GPC curve and a Z value, determined from the areas below the two peaks of the GPC curve, of at least −0.3, wherein the Z-value is determined according to formula (I) Z=s/Abs(B−A) (I) wherein Abs(B−A) is the absolute value of (B−A); A=the area, between the tangent parallel to the MW axis going through log M (Min) and the LS15 signal, from log M of 5.1 to log M value where the LS signal is minimum log M (Min), in the log M range between 5.1 and 6; B=the area, between the tangent parallel to the MW axis going through log M (Min) and the LS 15 signal, from log M(Min) to the point where the LS signal is crossed again; and s is the slope between the two peaks of the GPC curve, defined at log M of 5.1 and 6, wherein the GPC curve is defined as the concentration normalized LS 15 signal along the molecular weight of conventional GPC, obtained from the GPC-VISC-LS analysis, a multi-layer structure such as a coated metal pipe, comprising one layer comprising said polymer composition and the use of said polymer composition as adhesive polymer composition and for the production of a multi-layer structure.

A curable adhesive that is particularly well suited for use in an injection or compression molding operation. The adhesive is based on polymeric resins having carboxylic acid and acrylate ester functionality, such as grafted phenoxy resin, and further constituents such as organic carbonates, blocked isocyanates, catalysts, maleimide compounds, hydride sources, and a carrier fluid. The curable adhesives are particularly well suited for bonding liquid injectable substrates such as liquid silicone rubber, or polyamides to rigid substrates, such as aluminum, stainless steel, or glass.

Provided are curable adhesives, along with adhesive tapes, laminates, and laminated mirror buttons that include the curable adhesive. The curable adhesive includes a (meth)acrylate polymer, a curable oxetane compound, a polymer filler, and a photoinitiator for curable oxetane compounds. The curable adhesive, when cured, can provide excellent interfacial failure resistance.

Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200° C. or higher and has no peak in an area of 160° C. or lower.

An anaerobically curable composition comprising: (a) a non-encapsulated liquid anaerobically curable monomer forming a liquid phase; (b) a solid component dispersed as a solid phase within the liquid phase formed by the non-encapsulated liquid anaerobically curable monomer; wherein the solid component has (meth)acrylate functionality and: (i) is in particulate form with the particles having a particle size in the range from about 80 μm to about 300 μm; and (ii) has a melting temperature of from about 50° C. to about 90° C.; and (c) a curing component for curing the anaerobically curable composition within the liquid phase.

The anaerobically curable composition can easily be coated onto substrates such as threaded fasteners or other parts in its flowable form and then converted to anaerobically curable composition in solid form.

The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.

The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.

The invention relates to an aqueous polymer dispersion comprising: a) an aqueous polymer dispersion comprising grafted rubber polymeric particles from rubber polymer being selected from natural or synthetic rubber, b) an aqueous polymer dispersion with polymeric particles of a second polymer comprising monomeric units derived front a monomeric composition b) comprising: b1) a (meth)acrylate of a linear or branched alcohol in C.sub.4 to C.sub.10 or a mixture of such (meth)acrylates, said (meth)acrylate having Tg.sub.b1 lower than −30° C., b2) optionally, at least one comonomer having Tg.sub.b2 higher than −30° C.,
with said grafted rubber polymeric particles being grafted in an aqueous dispersion by a part of said monomeric composition b) as defined above. The invention covers a process of preparation of said dispersion, an adhesive composition comprising said dispersion, the use of said dispersion in pressure sensitive adhesives, and the resulting adhesive.

The present invention relates to a packaging material for a power storage device, the packaging material including at least a slip agent layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer, in this order, wherein the slip agent layer contains a fatty acid amide and a fatty acid bisamide, or a fatty acid amide and silicone oil.

An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.