There is provided a polymer film which includes a base film layer having an absolute weight average molecular weight of 50,000 to 1,000,000 and an adhesive layer, and a method for manufacturing the polymer film. This film for a tire inner liner can endow an excellent gas barrier property even to tires having a relatively thin thickness so that weight of the tire can be reduced and fuel efficiency of automobiles can be improved. Further, the present film facilitates molding in a tire manufacturing process, and exhibits excellent adhesion force to a carcass layer while having excellent mechanical properties such as high durability and fatigue resistance together with excellent moldability.

The present invention provides a laminate having a high fluorohydrocarbon resistance even when used at a high temperature and suitable for use as a sealing member such as oil sealing, gasket and the like. In a laminate including a metal member, and an adhesive and a hydrogenated nitrile rubber formed article laminated on the metal member, the adhesive is formed from a cured product of a composition containing a resin containing not less than 90 mass % of a novolac type phenol resin having a gelling time, as measured by Japanese Industrial standard (JIS) K 6910:2007 gelling time C method, of 50 sec-150 sec at 150 C., and a curing agent.

In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.

In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.

A die-bonding layer formation film to be used for fixing a processed product to an adherend, includes an adhesive layer, wherein, the storage elastic modulus has a local minimum value at a temperature within a range of 80 C. to 150 C., wherein the adhesive layer has a shear strength to a peeling strength test substrate of 20 N/2 mm.sup. [N/(2 mm2 mm)] or more and 50 N/2 mm.sup. [N/(2 mm2 mm)] or less, wherein the shear strength is measured after the processed product is placed above the peeling strength test substrate via the die-bonding layer formation film and the die-bonding layer formation film on the peeling strength test substrate is heated at 175 C. for 1 hour and then further maintained under an environment of 250 C. for 30 seconds. Bubbles (voids) are unlikely to grow at the boundary between the adhesive layer and an adherend even when subjected to thermal history.

The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130-140 C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.

The disclosure provides a method for the bonding of polytetrafluoroethylene sheets of various thicknesses to various surfaces. A method may include removing contaminants from a substrate for the application of the polytetrafluoroethylene sheet; applying adhesive to an etched side of the polytetrafluoroethylene sheet; and installing the polytetrafluoroethylene sheet to the substrate.

The disclosure provides a method for the bonding of polytetrafluoroethylene sheets of various thicknesses to various surfaces. A method may include removing contaminants from a substrate for the application of the polytetrafluoroethylene sheet; applying adhesive to an etched side of the polytetrafluoroethylene sheet; and installing the polytetrafluoroethylene sheet to the substrate.

Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass. The liquid epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin. The ratio of phenol novolac type epoxy resin to the epoxy resin of component (A) is not less than 46%. The equivalent ratio of component (C) relative to component (A) is 0.25 to 0.75.

Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass. The liquid epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin. The ratio of phenol novolac type epoxy resin to the epoxy resin of component (A) is not less than 46%. The equivalent ratio of component (C) relative to component (A) is 0.25 to 0.75.