A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.

The present invention relates to an inflation film and a method for manufacturing the inflation film, wherein the inflation film includes a base film, including: a polyamide-based resin; a copolymer containing polyamide-based segments and poly-ether-based segments; and an olefin-based polymer compound, and has a small variation in physical properties between a machine direction (MD) and a transverse direction (TD) of the film.

A method for manufacturing a semiconductor device according to an aspect of the present disclosure includes a step of preparing a dicing/die-bonding integrated film including an adhesive layer formed of a heat-curable resin composition having a melt viscosity of 3100 Pa.Math.s or higher at 120° C., a tacky adhesive layer, and a base material film; a step of sticking a surface on the adhesive layer side of the dicing/die-bonding integrated film and a semiconductor wafer together; a step of dicing the semiconductor wafer; a step of expanding the base material film and thereby obtaining adhesive-attached semiconductor elements; a step of picking up the adhesive-attached semiconductor element from the tacky adhesive layer; a step of laminating this semiconductor element to another semiconductor element, with the adhesive interposed therebetween; and a step of heat-curing the adhesive.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

The present invention relates to a method for manufacturing a wet glued wood article, as well as a wet glued article obtainable by said method and also uses of a wet glued article, wherein the method comprises the following steps: a) providing two actively never-dried or slightly dried wood pieces comprising at least one surface each which has a superficial layer having a thickness of least 2-3 wood cells; b) drying said surfaces of said wood pieces so that the moisture content of said superficial layer is below the fibre saturation point, providing a dried surface on each of the said wood pieces; c) applying a gluing agent on said dried surface of one of the wood pieces, thus providing a glue surface; d) bringing the dried surfaces together so that said glue surface touches the dried surface on the other wood piece, thus providing a wet glued wood article.

An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and optionally a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications and is designed to fail cohesively.

The invention relates to structural adhesives and in particular to structural adhesives which are heat activated and which can be used for the bonding of components, particularly metal components, employed in the automotive industry.

The invention relates to a textile bonding composition comprising a salt of lignosulfonate, an aldehyde hardener thereof, and an elastomer latex. The lignosulfonate salt may be sodium, potassium, magnesium, ammonium, or calcium lignosulfonate. The invention also relates to the use of such a composition for imparting adhesion properties to a reinforcement textile, with regard to a rubber, a reinforcement textile, in particular yarn, cord or textile structure, at least partially coated and/or impregnated with this composition, and a part made of rubber or comprising a rubber, in which the rubber comprises at least one reinforcement textile, on the surface and/or integrated inside the rubber.

A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.

A thermosetting sheet according to the present invention includes, as essential components, a thermosetting resin and inorganic particles, and, as an optional component, a volatile component, in which a ratio of a packing ratio P.sub.2 of the inorganic particles in the thermosetting sheet after being cured to a packing ratio Pi of the inorganic particles in the thermosetting sheet before being cured is P2/P1≥1.3.