Disclosed herein are curable compositions comprising an epoxide-functional polymer, a curing agent capable of reacting with the epoxide-functional polymer that is activatable by an external energy source, and a fluoropolymer that is substantially free of a reactive functional group. The epoxide-functional polymer may be a solid epoxide-functional polyurethane comprising a di-isocyanate. Also disclosed are articles comprising one of the compositions in an at least partially cured state positioned between first and second substrates. Also disclosed are methods of forming an adhesive on a substrate.

A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.

The invention relates to a resin composition containing an epoxy resin and a latent curing agent in which the epoxy resin contains an aliphatic epoxy resin containing a hydroxyl group and having a water dissolution rate of 65% or more and in which the latent curing agent has a reaction initiation temperature of 45° C. or higher and 120° C. or lower.

A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is a layer derived from a film.

Embodiments of the present application disclose an adhesive, a die attach film and a preparation method therefor, and relate to the technical field of chip packaging. The adhesive includes epoxy resin, phenoxy resin, an indene oligomer, filler and a curing agent; and 20-60 parts of the epoxy resin, 20-30 parts of the phenoxy resin, 5-10 parts of the indene oligomer, 15-30 parts of the filler and 1-5 parts of the curing agent are provided in parts by mass. The present application further provides the die attach film and the preparation method therefor. In the adhesive provided by the present application, the epoxy resin, the phenoxy resin and the indene oligomer are used as curable substrates to improve a thermal stress obtained after the adhesive is cured, so that the die attach film prepared therefrom is not easy to warp in a temperature change process.

The present invention relates to a thermosetting adhesive film and a coverlay film comprising the same, and more specifically to a thermosetting adhesive film which has excellent ion migration resistance while having a low dielectric permittivity, as well as excellent peel-off strength, and to a coverlay film comprising the thermosetting adhesive film.

The present invention relates to a thermosetting adhesive film and a coverlay film comprising the same, and more specifically to a thermosetting adhesive film which has excellent ion migration resistance while having a low dielectric permittivity, as well as excellent peel-off strength, and to a coverlay film comprising the thermosetting adhesive film.

There is provided a conductive adhesive which can suppress erosion of polycarbonate and form a cured product exhibiting excellent conductivity at a low temperature. There is also provided a conductive adhesive which can form a cured product exhibiting excellent adhesive property to plastics (particularly carbonate) at a low temperature. The conductive adhesive according to the present invention is a conductive adhesive which contains the following components (A) to (C) and is liquid at 25° C.: component (A): an alicyclic epoxy resin; component (B): a boron-based thermal cationic initiator; and component (C): a conductive filler.

The present specification relates to a method for manufacturing a polarizing plate, and an adhesive composition for a polarizing plate.

A composition including: —at least one silane group-containing polymer with a silicon content ranging from 0.6 to 2 wt. %, obtained by reacting at least one isocyanate group-containing polymer and at least one amino-, mercapto-, or hydroxysilane, —at least one liquid epoxy resin, and—at least one polyamine with at least three amine hydrogens which are reactive towards epoxy groups. The composition facilitates adhesives, coatings, or sealing compounds with a good storage stability, a fast curing time, even in the event of moisture or humidity, a surprisingly high degree of strength while having a high degree of elasticity, a high degree of resistance against further tearing, a high degree of resistance in particular against glycol/water mixtures, and a high degree of adhesion to many substrates. When used on metals such as steel or aluminum, the composition protects same against corrosion.