C09J2463/00

A VACUUM INSULATING GLAZING

The present invention refers to a Vacuum Insulating Glazing (VIG) able to provide excellent thermal insulation to the transparent components of curtain walling systems in buildings and to cabinets for domestic or commercial refrigerators, and to a process for its manufacture.

Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same

Disclosed are an anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and a method of connecting electronic parts using the same. The anisotropic conductive adhesives for thermo-compression bonding may include a flux activator, solder particles and polymer resin.

Roll-to-roll method of fabricating a wireless multi-layer laminate
11328201 · 2022-05-10 ·

A low-cost, multi-function tracking system with a form factor that unobtrusively integrates the components needed to implement a combination of different localization techniques and also is able to perform a useful ancillary function that otherwise would have to be performed with the attendant need for additional materials, labor, and expense. An example tracking system is implemented as an adhesive product that integrates tracking components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the components of the tracking system but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various tracking applications and workflows, including person and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.

METHOD OF FORMING FIRST PROTECTIVE FILM
20220135828 · 2022-05-05 ·

A curable resin film of the present invention forms a first protective film (la) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 μm, an average diameter of 60 to 500 μm, and an average pitch of 100 to 800 μm, heating the attached curable resin film at 100° C. to 200° C. for 0.5 to 3 hours, and curing the heated curable resin film, and when longitudinal sections thereof are observed by a scanning electron microscope, a ratio (h3/h1) of an average thickness (h3) of the first protective film (1a) at a center position between the bumps (51) to an average peak height (h1) of the bumps (51), and a ratio (h2/h1) of an average thickness (h2) of the first protective film (1a) at a position being in contact with the plurality of bumps (51) to the average peak height (h1) satisfy a relationship represented by the following expression of [{(h2/h1)−(h3/h1)}≤0.1].

Adhesive resin laminate, laminate, and method of producing same

Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.

Adhesive resin laminate, laminate, and method of producing same

Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.

VEHICULAR CAMERA WITH ADHESIVELY BONDED CONSTRUCTION

A vehicular camera includes a lens comprising a plurality of optical elements, a lens holder, and an imager printed circuit board. The plurality of optical elements includes at least one plastic optical element and at least one glass optical element. The imager printed circuit board has circuitry disposed thereat. The circuitry of the imager printed circuit board includes an imager that has an imaging array. The lens is held in optical alignment with the imaging array of the imager via an adhesive. The adhesive bonds the lens barrel to the lens holder. A flexible electrical ribbon cable electrically connects the circuitry of the imager printed circuit board with additional circuitry of the vehicular camera. The vehicular camera, when installed and used in a vehicle, captures image data for a vision system of the vehicle.

Method for manufacturing fine-pitch anisotropic conductive adhesive and fine-pitch anisotropic conductive adhesive manufactured by same method
11319465 · 2022-05-03 ·

The provided relates to a method for preparing an anisotropic conductive adhesive for fine pitch and an anisotropic conductive adhesive for fine pitch prepared by the same method. Provided is a method for preparing an anisotropic conductive adhesive for a fine pitch including: (i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent; (ii) removing moisture generated in step (i); and (iii) preparing an anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed with a binder resin in steps (i) and (ii), in which step (iii) is performed in a state where a contact with oxygen is blocked.

COATING COMPOSITION FOR ELECTRICAL STEEL SHEET, ADHESIVE SURFACE-COATED ELECTRICAL STEEL SHEET AND LAMINATED CORE

This coating composition for an electrical steel sheet contains an epoxy resin, a phenolic curing agent (A) and one or more amine-based curing agents (B) selected from the group consisting of an aromatic amine and dicyandiamide, the amount of the phenolic curing agent (A) is 1 to 40 parts by mass with respect to 100 parts by mass of the epoxy resin, and the amount of the amine-based curing agents (B) is 0.5 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin.

THERMOSETTING SHEET, DICING DIE BONDING FILM, AND SEMICONDUCTOR APPARATUS
20220130790 · 2022-04-28 · ·

Provided in the present invention is a thermosetting sheet including a thermosetting resin, a thermoplastic resin, a volatile component, and conductive particles. The thermosetting sheet has an arithmetic average roughness Ra of 0.1 μm or more and 1.2 μm or less that is measured in a state before being cured.