C09K5/00

NITROGEN AND DIOXOLANE-CONTAINING HYDROFLUOROETHERS AND METHODS OF USING THE SAME

Described herein is dioxolane-containing compound of formula (I) wherein (i) Rf.sup.1 and Rf.sup.2 are independently linear or branched perfluoroalkyi groups having with 1-8 carbon atoms and optionally comprise at least one catenated heteroatom, or (ii) Rf.sup.1 and Rf.sup.2 are bonded together to form a ring structure having 4-6 carbon atoms and optionally comprise one or more catenated heteroatoms; Rf.sup.2 is a linear or branched perfluoroalkyi groups having with 1-3 carbon atoms; and R.sup.4 and R.sup.5 are independently selected from H, F, Cl, a linear or branched alkyl group having 1-3 carbon atoms, optionally wherein the alkyl group comprises at least one of: fluorine, chlorine, a hydroxyl group, or a catenated heteroatom; for use in cleaning compositions, as an electrolyte solvent, as a heat transfer fluid, or a vapor phase soldering fluid. There is also provided a method of making the dioxolane-containing compound, comprising: contacting a 1,2-diol compound with a fluorinated ethylenically unsaturated compound in the presence of a base.

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Adhesive composition, and seal structure body and method for manufacturing the same
10675847 · 2020-06-09 · ·

An adhesive composition includes a coupling agent composed of a compound having a first functional group that reacts with an inorganic material and a second functional group that reacts with an organic material, and a crosslinking agent capable of crosslinking with a crosslinking site of a fluorine-based elastomer. A seal structure body includes a metallic support, fluorine-based elastomer and adhesive composition that causes fluorine-based elastomer to adhere to metallic support. A method for manufacturing seal structure body includes the steps of providing metallic support and fluorine-based elastomer, and causing fluorine-based elastomer to adhere to metallic support by using adhesive composition. Accordingly, an adhesive composition with high adhesion strength as well as a seal structure body and a method for manufacturing the same are provided at low cost.

Encapsulation of Thermal Energy Storage Media

In one embodiment, a metal-plated polymer object includes a polymer surface, a first metal layer that has been applied to the polymer surface to render it electrically conductive, and a second metal layer that has been deposited on the first metal layer.

Encapsulation of Thermal Energy Storage Media

In one embodiment, a metal-plated polymer object includes a polymer surface, a first metal layer that has been applied to the polymer surface to render it electrically conductive, and a second metal layer that has been deposited on the first metal layer.

Spectral and angular emission control based temperature sensitive radiative cooling device

The present disclosure relates to a radiative cooling device which is sensitive to the ambient temperature and in which the emissivity changes depending on the infrared wavelength range and emission angle, and a method of cooling an object using the radiative cooling device.

Spectral and angular emission control based temperature sensitive radiative cooling device

The present disclosure relates to a radiative cooling device which is sensitive to the ambient temperature and in which the emissivity changes depending on the infrared wavelength range and emission angle, and a method of cooling an object using the radiative cooling device.

THERMAL COMPENSATION LAYERS WITH CORE-SHELL PHASE CHANGE PARTICLES AND POWER ELECTRONICS ASSEMBLIES INCORPORATING THE SAME

A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100 C. to 250 C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.

Method for preparing freezing point depressant composition
20200115607 · 2020-04-16 · ·

A method for preparing a composition with low corrosive effect and low freezing point including mixing an ammonium cation source with a carboxyl anion source in an appropriate molar or weight ratio for obtaining an organic ammonium carboxylate of formula [NR.sup.1R.sup.2R.sup.3R.sup.4].sup.+.sub.n [R.sup.5(COO).sub.n].sup.n in which R.sup.1, R.sup.2, and R.sup.3 are selected from the group comprising hydrogen, substituted and unsubstituted alkyls containing 1-6 carbon atoms, R.sup.4 is a substituted or unsubstituted alkyl containing 1-6 carbon atoms, R.sup.5 is hydrogen, a substituted or unsubstituted hydrocarbon containing 1-6 carbon atoms and n is an integral of 1-6, and thereafter adding possible solvent and at the same time keeping alkali or alkali-earth metal content of the composition in a range of 0.001-30 wt % and halide content in a range of 0.001-1 wt %.

Method for preparing freezing point depressant composition
20200115607 · 2020-04-16 · ·

A method for preparing a composition with low corrosive effect and low freezing point including mixing an ammonium cation source with a carboxyl anion source in an appropriate molar or weight ratio for obtaining an organic ammonium carboxylate of formula [NR.sup.1R.sup.2R.sup.3R.sup.4].sup.+.sub.n [R.sup.5(COO).sub.n].sup.n in which R.sup.1, R.sup.2, and R.sup.3 are selected from the group comprising hydrogen, substituted and unsubstituted alkyls containing 1-6 carbon atoms, R.sup.4 is a substituted or unsubstituted alkyl containing 1-6 carbon atoms, R.sup.5 is hydrogen, a substituted or unsubstituted hydrocarbon containing 1-6 carbon atoms and n is an integral of 1-6, and thereafter adding possible solvent and at the same time keeping alkali or alkali-earth metal content of the composition in a range of 0.001-30 wt % and halide content in a range of 0.001-1 wt %.

BORON NITRIDE POWDER, HEAT DISSIPATION SHEET, AND METHOD FOR PRODUCING HEAT DISSIPATION SHEET
20240026198 · 2024-01-25 · ·

A boron nitride powder, containing at least an aggregated boron nitride particle formed by an aggregation of hexagonal boron nitride primary particles, the powder having a particle size distribution including at least a first maximum point, a second maximum point at which a particle size is larger than at the first maximum point, and a third maximum point at which a particle size is larger than at the second maximum point. The heat dissipation sheet is obtained by molding a heat conductive resin composition containing the boron nitride powder and a resin. The method for producing a heat dissipation sheet includes blending the boron nitride powder and a resin to prepare a heat conductive resin composition, molding the heat conductive resin composition into a sheet shape to prepare a heat conductive resin composition sheet, and heating and pressurizing the heat conductive resin composition sheet under a vacuum.