A medical device includes a body and at least one electrode disposed thereon. The electrode includes a metallic substrate, such as a platinum group metal, an alloy of platinum group metals, or gold. The surface of the substrate is modified in a manner that increases its effective surface area without inducing bulk heating. For example, the surface of the substrate can be laser textured and/or coated, such as with titanium nitride or iridium oxide.

A medical device includes a body and at least one electrode disposed thereon. The electrode includes a metallic substrate, such as a platinum group metal, an alloy of platinum group metals, or gold. The surface of the substrate is modified in a manner that increases its effective surface area without inducing bulk heating. For example, the surface of the substrate can be laser textured and/or coated, such as with titanium nitride or iridium oxide.

A field device for processing and automation technology includes a first and a second component that can each be mechanically connected at a joining surface by means of a joining point. Two metal surface layers are each applied at least to the joining surface of the first component and the joining surface of the second component. The metal of the surface layers is different from the metal of the first and/or the metal of the second component. A joining material is applied between the respective joining surfaces of the two components, wherein the joining material includes particles at least partially consisting of a metal that corresponds with the metal of the surface layers The joining of the two components occurs at a joining temperature below 300° C.

Provided are a dissimilar metal welded body and a method of manufacturing the same, capable of preventing galvanic corrosion in a connection portion between dissimilar metals in the dissimilar metal welded body and of sufficient insulation coating being applied even when the insulation coating is applied to the dissimilar metal welded body. The dissimilar metal welded body includes a first member made of a metal containing aluminum as a main component, a second member made of a metal containing copper as a main component, a welded portion formed by pressure-welding an end face of the first member and an end face of the second member to each other, and a metal film that continuously covers a substantially entire part of the first member and at least a part of the second member. The metal film is a film made of a metal containing copper as a main component.

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying liquid resist on the seed layer formed on the surface of the resin insulating layer, drying the liquid resist applied on the seed layer such that a resist layer is formed on the seed layer, applying pressure and heat simultaneously to an entire surface of the resist layer formed on the seed layer, forming a plating resist on the seed layer from the resist layer formed on the seed layer using a photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the plating resist, removing the plating resist from the seed layer, and removing part of the seed layer exposed from the electrolytic plating film.

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying liquid resist on the seed layer formed on the surface of the resin insulating layer, drying the liquid resist applied on the seed layer such that a resist layer is formed on the seed layer, applying pressure and heat simultaneously to an entire surface of the resist layer formed on the seed layer, forming a plating resist on the seed layer from the resist layer formed on the seed layer using a photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the plating resist, removing the plating resist from the seed layer, and removing part of the seed layer exposed from the electrolytic plating film.

A porous carbon material composite formed of a porous carbon material and a functional material and equipped with high functionality. The porous carbon material composite is formed of (A) a porous carbon material obtainable from a plant-derived material having a silicon (Si) content of 5 wt % or higher as a raw material; and (B) a functional material adhered on the porous carbon material, and has a specific surface area of 10 m.sup.2/g or greater as determined by the nitrogen BET method and a pore volume of 0.1 cm.sup.3/g or greater as determined by the BJH method and MP method.

The present invention provides a nickel-plated heat-treated steel sheet for a battery can (1), having a nickel layer with a nickel amount of 4.4 to 26.7 g/m.sup.2 on a steel sheet (11), wherein when the Fe intensity and the Ni intensity are continuously measured along the depth direction from the surface of the nickel-plated heat-treated steel sheet for a battery can, by using a high frequency glow discharge optical emission spectrometric analyzer, the difference (D2-D1) between the depth (D1) at which the Fe intensity exhibits a first predetermined value and the depth (D2) at which the Ni intensity exhibits a second predetermined value is less than 0.04 μm.

The present invention provides a nickel-plated heat-treated steel sheet for a battery can (1), having a nickel layer with a nickel amount of 4.4 to 26.7 g/m.sup.2 on a steel sheet (11), wherein when the Fe intensity and the Ni intensity are continuously measured along the depth direction from the surface of the nickel-plated heat-treated steel sheet for a battery can, by using a high frequency glow discharge optical emission spectrometric analyzer, the difference (D2-D1) between the depth (D1) at which the Fe intensity exhibits a first predetermined value and the depth (D2) at which the Ni intensity exhibits a second predetermined value is less than 0.04 μm.

A method for assembling a stone on a setting support, the stone being cut to exhibit a table, a crown, a girdle and a pavilion, including the steps of: providing a substrate coated with a pattern including an electrically conductive layer covered with a resin layer, the pattern having an inner contour delimiting a hole through the coated substrate and an outer contour corresponding to the outer contour of the desired setting support; removing the resin layer; after dissolution of the resin layer, positioning the stone in the through hole, the stone resting on the electrically conductive layer; and electrodepositing a metal layer on the electrically conductive layer to form the setting support, in order to make the stone integral with the metal layer.