F25B21/00

Solid state cooler device

A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.

Solid state cooler device

A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.

Piezoelectric MEMS-based active cooling for heat dissipation in compute devices

An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

Improved Vortex Flux Generator
20220148777 · 2022-05-12 ·

Various implementations of the invention correspond to an improved vortex flux generator. In some implementations of the invention, the improved vortex flux generator includes a magnetic circuit configured to produce a magnetic field; a quench controller configured to provide a variable current; a vortex material configured to form and subsequently dissipate a vortex in response to the variable current, wherein upon formation of the vortex, a magnetic field density surrounding the vortex is urged to decrease, and wherein upon subsequent dissipation of the vortex, the urging to decrease ceases and the magnetic field density increases prior to a reformation of the vortex, and wherein the decrease of the magnetic field density and the increase of the magnetic field density correspond to a modulation of the magnetic field; an inductor disposed in a vicinity of the vortex such that the modulation of the magnetic field induces an electrical current in the inductor; and a dissipation superconductor electrically disposed in parallel with the vortex material and configured to carry, without quenching, an entirety of the variable current during dissipation of the vortex in the vortex material.

Magnetic cooling device

Provided is a magnetic cooling device including: in a hollow container, an inert gas; a material filling part containing a refrigerant and magnetic material particles having a magnetocaloric effect; gas storages containing the refrigerant at both ends of the material filling part; and material partitions between the material filling part and the gas storages, in which a volume proportion of the inert gas in the hollow container is 1 vol % or more and 12 vol % or less.

Magnetic cooling device

Provided is a magnetic cooling device including: in a hollow container, an inert gas; a material filling part containing a refrigerant and magnetic material particles having a magnetocaloric effect; gas storages containing the refrigerant at both ends of the material filling part; and material partitions between the material filling part and the gas storages, in which a volume proportion of the inert gas in the hollow container is 1 vol % or more and 12 vol % or less.

Atmospheric water generator apparatus

An atmospheric water generator apparatus. In one embodiment, the apparatus includes a fluid cooling device. A water condensing surface is thermally connected to the fluid cooling device, the water condensing surface having a superhydrophobic condensing surface, a superhydrophilic condensing surface, or a combination thereof. An air-cooled heat rejection device is in fluid communication with a fluid cooling device. An air fan is configured to induce airflow across the water condensing surface in order to condense and extract water from the atmosphere.

MOBILE PHONE AND OTHER COMPUTE DEVICE COOLING ARCHITECTURE
20220139804 · 2022-05-05 ·

A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.

Magnetocaloric alloys useful for magnetic refrigeration applications

This invention relates to magnetocaloric materials comprising alloys useful for magnetic refrigeration applications. In some embodiments, the disclosed alloys may be Cerium, Neodymium, and/or Gadolinium based compositions that are fairly inexpensive, and in some cases exhibit only 2.sup.nd order magnetic phase transitions near their curie temperature, thus there are limited thermal and structural hysteresis losses. This makes these compositions attractive candidates for use in magnetic refrigeration applications. Surprisingly, the performance of the disclosed materials is similar or better to many of the known expensive rare-earth based magnetocaloric materials.

Magnetocaloric alloys useful for magnetic refrigeration applications

This invention relates to magnetocaloric materials comprising alloys useful for magnetic refrigeration applications. In some embodiments, the disclosed alloys may be Cerium, Neodymium, and/or Gadolinium based compositions that are fairly inexpensive, and in some cases exhibit only 2.sup.nd order magnetic phase transitions near their curie temperature, thus there are limited thermal and structural hysteresis losses. This makes these compositions attractive candidates for use in magnetic refrigeration applications. Surprisingly, the performance of the disclosed materials is similar or better to many of the known expensive rare-earth based magnetocaloric materials.