A heat sink structure and a manufacturing method thereof. The heat sink includes a main body and multiple radiating fins each having a folded root section. The main body has multiple connection channels formed on a circumference of the main body. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the folded root sections of the radiating fins are relatively high-speed thrust into the connection channels of the main body to tightly integrally connect with the main body.

A heat sink structure and a manufacturing method thereof. The heat sink includes a main body and multiple radiating fins each having a folded root section. The main body has multiple connection channels formed on a circumference of the main body. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the folded root sections of the radiating fins are relatively high-speed thrust into the connection channels of the main body to tightly integrally connect with the main body.

An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

A heat exchanger carries out heat exchange between a refrigerant that undergoes a phase change during heat exchange and another heating medium. The heat exchanger includes headers having the refrigerant flowing through interiors, a plurality of multi-hole first flat tubes, and a plurality of second flat tubes. The first flat tubes extend in a direction intersecting a lengthwise direction of the headers. The first flat tubes have a plurality of refrigerant flow channels with the refrigerant flowing through the refrigerant flow channels. The second flat tubes are stacked alternately with respect to the first flat tubes, with the other heating medium flowing through the second flat tubes. The headers are arranged to extend along a horizontal direction.

An apparatus and a method for indirectly cooling a superconducting quantum interference device (SQUID) are provided. The apparatus includes an outer container extending in a vertical direction; a metallic inner container inserted into the outer container to store a liquid coolant, the metal inner container including a top plate; a SQUID sensor module disposed between a bottom surface of the outer container and a bottom surface of the inner container; a heat transfer pillar adapted to cool the SQUID sensor module, the heat transfer pillar having one end connected to the bottom surface of the inner container and the other end directly or indirectly connected to the SQUID sensor module; a magnetic shield part formed of a superconductor covering a top surface of the SQUID sensor module; and a heat conduction plate being in thermal contact with the other end of the heat transfer pillar.

A heat module includes a heat receiving portion, a fluid channel, a fan, a radiator including heat dissipating fins and a radiator tube fluid channel, and a pump. The pump includes a stationary portion and a rotating portion. The rotating portion includes a rotor holder and a pump impeller. The pump further includes a casing, a pump fluid channel, a pump inlet, and a pump outlet. At least a portion of the rotor holder and at least a portion of the pump impeller are arranged to radially overlap with each other. The fluid channel includes a tube fluid channel. The tube fluid channel includes a pump inlet-side tube fluid channel, a pump outlet-side tube fluid channel, and a heat receiving portion tube fluid channel. No heat receiving portion tube fluid channel is arranged in the pump inlet-side tube fluid channel.

An electronics enclosure can be a line replaceable unit for installation in a chassis having actively cooled cold plates. The electronics enclosure has a housing, heat spreaders, and moveable heat spreaders. The electronics enclosure can be positioned in the chassis with the moveable heat spreaders close to the housing and thereafter the moveable heat spreaders can be moved away from the housing to press against the cold plates. Heat from electronics within the electronics enclosure can pass from the housing, through the heat spreaders, through the moveable heat spreaders, and into the cold plates.

A heat exchanger comprising a plurality of plates that are demountably attached to a frame is disclosed. Each plate comprises a plurality of channels for conveying a primary fluid through the heat exchanger. The frames are arranged in the frame so that spaces between adjacent frame pairs define conduits for conveying a secondary fluid through the heat exchanger. The plates are mounted in the frame so that they can be individually removed from the frame. Further, each of the channels is fluidically connected to input and output ports for the primary fluid by detachable couplings. As a result, heat exchangers in accordance with the present invention are more easily repaired or refurbished than prior-art heat exchangers.

A thermal energy transfer device attached to an object to dissipate thermal energy from the object is described. In one aspect, the device includes a non-metal base plate and first and second non-metal plate structures. The base plate includes at least one groove on one of its primary surfaces. An edge of the first plate structure is received in a first groove of the at least one groove of the base plate. An edge of the second plate structure is received in a second groove of the at least one groove of the base plate. At least the first groove or the second groove is a V-notch groove such that the edge of the first plate structure or the edge of the second plate structure that is received in the first groove or the second groove is interlockingly received in the V-notch groove.

An electric radiator is provided using calculating processors as a heat source and includes a heating body where the heat transfer between the heat source and the ambient air takes place; a number of processors distributed over a number of printed circuit boards forming the heat source of the radiator and a power resource carrying out calculations by external computer systems; a man-machine interface enabling the control of the calculating and calorific power supplied by the radiator; a power source stabilized for the different electrical components; and a network interface for connecting the radiator to the external networks.