A vapor chamber having a housing that includes a first metal sheet and a second metal sheet which face each other and respective outer edges thereof are joined to each other to form a welded portion; a bead portion in a region of at least one of the first metal sheet and the second metal sheet surrounded by the welded portion in a plan view of the vapor chamber, the bead portion comprising melted and solidified metal from the at least one of the first metal sheet and the second metal sheet; a working fluid encapsulated in the housing; and a wick in or on an inner wall surface of the first metal sheet or the second metal sheet.

In one embodiment, a metal-plated polymer object includes a polymer surface, a first metal layer that has been applied to the polymer surface to render it electrically conductive, and a second metal layer that has been deposited on the first metal layer.

A thin-type two-phase fluid device includes a first plate body, a second plate body and a polymer layer. The first plate body has a first face, a second face and multiple bosses. The bosses are disposed on the first face and raised therefrom. The second plate body has a nanometer capillary layer on one face. The nanometer capillary layer is formed from a mixture of multiple kinds of powders with different sizes. The nanometer capillary layer is attached to a surface of the second plate body opposite to the first face of the first plate body. The polymer layer is selectively connected with the first plate body or the second plate body. The total thickness of the thin-type two-phase fluid device is equal to or smaller than 0.25 mm, whereby the object of thinning the heat dissipation device is achieved.

A vapor chamber structure includes an upper plate, a lower plate, a middle layer and a polymer layer. The polymer layer is selectively connected with any of the upper and lower plates. The lower plate and the upper plate are mated with each other to together define a chamber. A working fluid is filled in the chamber. The middle layer is disposed in the chamber. The middle layer has a first face, a second face, multiple perforations and multiple channels. The multiple perforations pass through the first and second faces. The multiple channels are disposed on one of the first and second faces. By means of the above arrangement, the total thickness of the vapor chamber structure is equal to or smaller than 0.25 mm, whereby the vapor chamber can be extremely thinned.

In one embodiment, a phase change material is encapsulated by forming a phase change material pellet, coating the pellet with flexible material, heating the coated pellet to melt the phase change material, wherein the phase change materials expands and air within the pellet diffuses out through the flexible material, and cooling the coated pellet to solidify the phase change material.

A vapor chamber and a manufacturing method thereof are disclosed. The vapor chamber includes a first housing, multiple supporting columns, a capillary structure, a second housing, a bonding layer, and a working fluid. The first housing includes an inner surface. Each supporting column is disposed on the inner surface of the first housing and includes an end surface. The capillary structure is disposed on the inner surface of the first housing. The second housing is sealed with the first housing correspondingly to jointly define a chamber. The bonding layer is formed between the inner surface of the first housing and the end surfaces of the supporting columns. The working fluid is arranged inside the chamber. Accordingly, it is able to swiftly changing the positions of the supporting columns according to the actual cooling needs, thereby significantly reducing the manufacturing time required.

The invention relates to an air heat exchanger 1 for cooling a power electronics component 2, comprising: a carrier plate 3 having an accommodating region 4 for accommodating the power electronics component 2; a heat exchanger plate 7 which is coupled to the carrier plate 3, wherein at least one hermetically sealed cavity 10 for accommodating a working medium 13 is formed and delimited by the carrier plate 3 and the heat exchanger plate 7, wherein the cavity 10 comprises an evaporator 11 and a condenser 12, wherein the evaporator 11 is arranged so as to be spaced apart from the condenser 12 in a heat transport direction 14; cooling ribs 15 which are coupled to the heat exchanger plate 7.

A protection element for vapor chamber includes a main body and a protection element. The main body is divided into a working zone and a sealing zone. The sealing zone is located around an outer periphery of the working zone and is provided with a notch area, to which a fluid-adding and air-evacuating pipe is connected. The protection element is correspondingly mounted to the notch area to contact with the sealing zone of the main body. With the arrangement of the protection element, the fluid-adding and air-evacuating pipe is protected against collision and impact and accordingly, the main body of the vapor chamber is protected against vacuum and working fluid leakage.

A heat exchanger assembly comprising a frame (10) and a heat exchanger (20), wherein the heat exchanger (20) comprises a core of plates (21) stacked in a first direction, with edges (22) protruding along their outline, characterized in that the frame (10) comprises a retaining element (30) configured to engage plate edges (22) so that the retaining element (30) restricts movement of the heat exchanger (20) with respect to the frame (10) in the first direction, wherein the retaining element (30) comprises an elongated core (31) attached to the frame (10) and plurality of protrusions (32) protruding from this core (31), said protrusions (32) configured to protrude between plate edges (22).

A heat transfer element, a method for manufacturing the same and a semiconductor structure including the same are provided. The heat transfer element includes a housing, a chamber, a dendritic layer and a working fluid. The chamber is defined by the housing. The dendritic layer is disposed on an inner surface of the housing. The working fluid is located within the chamber.