Patent classifications
G01K7/00
Method for evaluating a measurement result of a thermal analysis, as well as use of the method, computer unit, computer program product and system for performing the method
- Thomas Denner ,
- Juergen Blumm ,
- Otto Max Schaefer ,
- Markus Hollering ,
- Thilo Hilpert ,
- Alexander Frenzl ,
- Stefan Lauterbach ,
- Andreas Strobel ,
- Gabriele Kaiser ,
- Stephan Knappe ,
- Rolf Preuss ,
- Michael Gebhardt ,
- Elena Moukhina ,
- Alexander Schindler ,
- Matthias Gradl ,
- Gunther Herr ,
- André Nijmeh ,
- Stefan Schmoelzer ,
- Markus Meyer
A method for evaluating a measurement result of a thermal analysis. A program-controlled computer unit is used to calculate at least one probability of the agreement of the measurement result with at least one dataset previously stored in the computer unit, wherein this calculation is based on a comparison of effect data previously extracted from a measurement curve of the thermal analysis with corresponding stored effect data of the dataset. The evaluation can advantageously include, an automatic recognition and classification of measurement curves and can be carried out in particular more efficiently, more economically and more quickly than previously, with at the same time a high quality of evaluation.
Heat exchanger contamination monitoring
Embodiments relate to heat exchanger contamination monitoring in an air conditioning system. An aspect includes receiving, by a contamination monitoring logic from a primary heat exchanger outlet temperature sensor, a first temperature comprising an air temperature at an outlet of a primary heat exchanger. Another aspect includes receiving, from a secondary heat exchanger outlet temperature sensor, a second temperature comprising an air temperature at an outlet of a secondary heat exchanger. Another aspect includes receiving, from a compressor outlet temperature sensor, a third temperature comprising an air temperature at an outlet of a compressor. Another aspect includes determining, based on the first, second, and third temperature, a heat exchanger contamination value. Another aspect includes comparing the heat exchanger contamination value to a predetermined contamination threshold. Another aspect includes based on the heat exchanger contamination value being greater than the predetermined contamination threshold, sending a maintenance warning.
Health monitoring and failure prognosis of power electronics devices
A system, method and machine-readable instructions for monitoring a power electronics device. The system involves a semiconductor device, at least one sensor and a processor. The processor is configured to monitor a junction temperature of the semiconductor device by determining from the at least one sensor an on-state resistance of the semiconductor device and calculating the junction temperature of the semiconductor device according to a relationship between the on-state resistance of the semiconductor device and the junction temperature of the semiconductor device. The processor may apply an ageing coefficient to the on-state resistance.
SIGNAL PROCESSING DEVICE AND SIGNAL PROCESSING METHOD
A signal processing device (100) includes a prediction circuit (20) configured to generate V.sub.b.sub._.sub.T2 corresponding to an output signal to be obtained at T2 after T1, in accordance with V.sub.a.sub._.sub.T1 obtained at the time T1, in a transition response period before Tr or Td elapses, where Tr denotes a time period during which an output signal V.sub.a(T) of a sensor (80) changes from a converged value V.sub.c1 corresponding to a parameter P1 representing a certain property of an object to be measured to a converged value V.sub.c2 corresponding to P2, and Td denotes a time period during which V.sub.a(T) changes from V.sub.c2 to V.sub.c1. The prediction circuit generates the predicted value so that TrE<Tr, TdE<Td, |1−Td/Tr|>|1−TdE/TrE| are satisfied, where TrE denotes a time period during which the predicted value becomes a value corresponding to V.sub.c2, and TdE denotes a time period during which the predicted value becomes a value corresponding to V.sub.c1.
Light Emitting Thermometer System
A light emitting thermometer system includes a digital thermometer that has a rear end, a probe end and a display. The probe end may be placed into contact with an animal. A lighting unit is provided and the lighting unit is coupled to the digital thermometer. Thus, the lighting unit may selectively illuminate the animal when the probe end is placed into contact with the animal. The lighting unit includes a light emitter that is removably coupled to the lighting unit.
Light Emitting Thermometer System
A light emitting thermometer system includes a digital thermometer that has a rear end, a probe end and a display. The probe end may be placed into contact with an animal. A lighting unit is provided and the lighting unit is coupled to the digital thermometer. Thus, the lighting unit may selectively illuminate the animal when the probe end is placed into contact with the animal. The lighting unit includes a light emitter that is removably coupled to the lighting unit.
Temperature sensor with layered architecture
A temperature sensor includes two branches, each branch having at least a first transistor and a second transistor connected as diodes and cascaded, so that an emitter of the first transistor is connected to a collector of the second transistor of the same branch. The temperature source also includes a current source configured to provide a current to the two branches, and an analog-to-digital convertor. The analog-to-digital convertor is connected to capture a voltage between emitters of the first transistors or of the second transistors, and is configured to convert said voltage to a digital temperature signal.
Semiconductor device having variable parameter selection based on temperature and test method
A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, or a word line low voltage. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.
Carbon nanotube temperature and pressure sensors
The present invention, in one embodiment, provides a method of measuring pressure or temperature using a sensor including a sensor element composed of a plurality of carbon nanotubes. In one example, the resistance of the plurality of carbon nanotubes is measured in response to the application of temperature or pressure. The changes in resistance are then recorded and correlated to temperature or pressure. In one embodiment, the present invention provides for independent measurement of pressure or temperature using the sensors disclosed herein.
Carbon nanotube temperature and pressure sensors
The present invention, in one embodiment, provides a method of measuring pressure or temperature using a sensor including a sensor element composed of a plurality of carbon nanotubes. In one example, the resistance of the plurality of carbon nanotubes is measured in response to the application of temperature or pressure. The changes in resistance are then recorded and correlated to temperature or pressure. In one embodiment, the present invention provides for independent measurement of pressure or temperature using the sensors disclosed herein.