Patent classifications
G01R1/00
Detect and differentiate touches from different size conductive objects on a capacitive button
Apparatuses and methods of distinguishing between a finger and a stylus proximate to a touch surface are described. One apparatus includes a first circuit to obtain capacitance measurements of sense elements when a conductive object is proximate to a touch surface. The apparatus also includes a second circuit coupled to the first circuit. The second circuit is operable to detect whether the conductive object activates the first sense element, second sense element, or both, in view of the capacitance measurements. To distinguish between a stylus and a finger as the conductive object, the second circuit determines the conductive object as being the stylus when the second sense element is activated and the first sense element is not activated and determines the conductive object as being the finger when the first sense element and the second sense element are activated.
LOCATING ELECTRICAL FAULTS IN A CIRCUIT
The present embodiments are directed to locating electrical faults in an electrical circuit, in particular electrical faults in transmission wires of an electrical circuit. Examples of the present embodiments provide a method and apparatus for opening a switch in the electrical circuit to cause an open circuit or discontinuity at the fault; transmitting a signal to be reflected from the open circuit or discontinuity and receiving the signal reflected from the open circuit or discontinuity to determine the location of the fault. Examples are particularly suitable for high voltage systems, for example over 100V.
CURRENT TRANSDUCER WITH FLUXGATE DETECTOR
Electrical current transducer (2) of a closed-loop type for measuring a primary current (I.sub.p) flowing in a primary conductor (1), comprising a fluxgate measuring head (7) and an electronic circuit (16) including a microprocessor (18) for digital signal processing. The measuring head includes a secondary coil (6) and a fluxgate detector (4) comprising an excitation coil and a magnetic material core. The electronic circuit comprises an excitation coil drive circuit (14) configured to generate an alternating excitation voltage to supply the excitation coil with an alternating excitation current (I.sub.fx), the secondary coil (6) connected in a feedback loop (12) of the electronic circuit to the excitation coil drive circuit (14), the electronic circuit further comprising a ripple compensation circuit (26, 28) configured to compensate for a ripple signal generated by the alternating excitation voltage.
Mesh network synchronous power monitoring systems and methods
A system including a transceiver that is in a first device and receives wirelessly or over a powerline and from a second device, (i) a voltage value of a voltage detected between bus bars of a power source, where the power source supplies power to a load, and where the load is distinct from the first and second devices, or (ii) a current value of a current detected by a current sensor and drawn from the power source by the load. A sensing module one of (i) if the transceiver receives the current, detects the voltage and timestamps the voltage value with a first timestamp, and (ii) if the transceiver receives the voltage, determines the current and timestamps the current value with a second timestamp. A parameter module determines a parameter of the load based on the voltage, the current, and the first and second timestamps.
Semiconductor test device and method of operating the same
A method of operating a semiconductor test device includes transferring a first device under test (DUT) from a load tray to a first load shuttle. The first DUT is transferred from the first load shuttle to a first test board and a second DUT is transferred from the load tray to a second load shuttle.
Conductive test probe
A conductive probe may include a probe body for communicating with a circuit tester or a jumper. The probe body may be formed of metal and may have a free end. A probe tip may be mounted to the end of the probe body. The probe tip may be formed of thorium-tungsten. The probe tip may be configured for contacting a circuit node.
SYSTEM AND METHOD TO TEST A CONTACT OF A CONNECTOR
A device to test a contact of a connector includes a frame and a connector adaptor coupled to the frame. The connector adaptor is configured to retain the connector. The device also includes one or more alignment actuators coupled to the frame and a piston assembly movable relative to the connector by the one or more alignment actuators. The piston assembly is configured to apply a compressive force to the contact to test a locking mechanism of the contact.
Distortion correction for tracking an object in a magnetic field
A system is configured to model a magnetic field by measuring a first value for characteristics of a magnetic field at a first position in the magnetic field. The system measures a second value characteristics of the magnetic field at a second position in the magnetic field. The system determines a distance between the first position and the second position. The system estimates a distortion component of the magnetic field at approximately the second position in the magnetic field based on each of the distance, the first value for each of the one or more characteristics, and the second value for each of the one or more characteristics. The system outputs a model of at least a region of the magnetic field.
Power semiconductor device with integrated current measurement
A package-integrated power semiconductor device is provided, which includes at least one power transistor coupled to a current path, a current measurement device and a package. The current measurement device is electrically insulated from and magnetically coupled to the current path. The current path and the current measurement device are arranged so as to enable the current measurement device to sense the magnetic field of a current flowing through the current path. The at least one power transistor, the current measurement device, and the current path are arranged inside the package. Further, a power module assembly including the package-integrated power semiconductor device as well as a method of operating the package-integrated power semiconductor device are provided.
Angle sensor with offline error correction
An angle sensor can have a plurality of magnetic field sensing elements configured to detect a magnetic field and generate a respective plurality of magnetic field signals. In response to these magnetic field signals, a processor generates an uncorrected angle signal that is indicative of an angle of the magnetic field. An error corrector generates an error value using one or more of the previous samples of the uncorrected angle signal, and a summation element applies the error value to a current sample of the uncorrected angle signal to generate a corrected angle signal. The error corrector can generate the error value by applying a correction factor to a previous sample of the uncorrected angle signal, or by applying a correction factor to a predicted current sample of the uncorrected angle signal.