Patent classifications
G01R3/00
PROBE CARD FOR TESTING SEMICONDUCTOR WAFERS
A probe card is disclosed. The probe card includes a first disc, a second disc, an alignment plate and multiple micro probes. One of the micro probes includes a linear segment and a curved segment connected to each other at an angle stop. The first disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the linear segment of the micro probe. The second disc includes s a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe. Placed within the recessed area of the second disc, the alignment plate includes multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe.
PROBE CARD FOR TESTING SEMICONDUCTOR WAFERS
A probe card is disclosed. The probe card includes a first disc, a second disc, an alignment plate and multiple micro probes. One of the micro probes includes a linear segment and a curved segment connected to each other at an angle stop. The first disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the linear segment of the micro probe. The second disc includes s a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe. Placed within the recessed area of the second disc, the alignment plate includes multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe.
Deep-etched multipoint probe
A multipoint probe for establishing an electrical connection between a test apparatus and a test sample, the multipoint probe comprising a base defining a top surface and a plurality of traces provided on the top surface, each trace individually interconnecting a contact pad and a contact electrode for establishing the electrical connection to the test sample, each trace comprising a wide portion connected to the contact pad and a narrow portion connected to the contact electrode; the first top surface comprising first intermediate surfaces, each interconnecting a pair of neighboring traces at their respective wide portions, and second intermediate surfaces, each interconnecting a pair of neighboring traces at their respective narrow portions, and the first intermediate surfaces being provided on a first level and the second intermediate surfaces being provided on a second level above the first level relative to the base.
Deep-etched multipoint probe
A multipoint probe for establishing an electrical connection between a test apparatus and a test sample, the multipoint probe comprising a base defining a top surface and a plurality of traces provided on the top surface, each trace individually interconnecting a contact pad and a contact electrode for establishing the electrical connection to the test sample, each trace comprising a wide portion connected to the contact pad and a narrow portion connected to the contact electrode; the first top surface comprising first intermediate surfaces, each interconnecting a pair of neighboring traces at their respective wide portions, and second intermediate surfaces, each interconnecting a pair of neighboring traces at their respective narrow portions, and the first intermediate surfaces being provided on a first level and the second intermediate surfaces being provided on a second level above the first level relative to the base.
Test socket for testing semiconductor chip package and method of manufacturing the same
A test socket is provided that includes a base material including an insulating elastic material and a conductive portion extending through the base material in a thickness direction of the base material, wherein the conductive portion includes a plurality of conductive particle structures arranged in the thickness direction of the base material, and each of the plurality of conductive particle structures includes a plurality of conductive particles having at least one insulating wire and/or at least one conductive wire extending from a surface of the conductive particle, bonded with a material having a functional group.
CONNECTOR
A connector includes a plurality of aligned contact sets, each of the contact sets including a signal contact for signal transmission, and a plurality of ground contacts provided around the signal contact such that to surround the signal contact by shield portions respectively provided to the ground contacts.
CIRCUIT STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
A circuit structure, an electronic device, and a manufacturing method of the electronic device are provided. The circuit structure includes a support layer, a base layer, and a circuit layer. The base layer is disposed on the support layer. The circuit layer is disposed on the base layer and includes a first conductive layer, a first insulating layer, and a second conductive layer. The first conductive layer is disposed on the base layer. The first insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the first insulating layer. The elongation of the support layer is smaller than the elongation of the base layer.
CIRCUIT STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
A circuit structure, an electronic device, and a manufacturing method of the electronic device are provided. The circuit structure includes a support layer, a base layer, and a circuit layer. The base layer is disposed on the support layer. The circuit layer is disposed on the base layer and includes a first conductive layer, a first insulating layer, and a second conductive layer. The first conductive layer is disposed on the base layer. The first insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the first insulating layer. The elongation of the support layer is smaller than the elongation of the base layer.
MEMBRANE PROBE CARD, METHOD OF MAKING THE SAME AND METHOD OF MAKING TESTED SEMICONDUCTOR CHIP BY USING THE SAME
A membrane probe card includes probes each having a base electrically connected with a trace of a membrane wiring structure, and a probe tip protruding from the base. The base has a tip placement section and an extension section, which extend from a first side edge to a second side edge of the base in order. The probe tip is made by laser processing and electroplating, located at the tip placement section, and provided with a fixed end portion connected with the base in a way that the width of the tip placement section is greater than the width of the fixed end portion. A distance from a center of the probe tip to the first side edge is less than a distance from the center of the probe tip to the second side edge. As such, requirements of fine pitch and probe height may be achieved.
MEMBRANE PROBE CARD, METHOD OF MAKING THE SAME AND METHOD OF MAKING TESTED SEMICONDUCTOR CHIP BY USING THE SAME
A membrane probe card includes probes each having a base electrically connected with a trace of a membrane wiring structure, and a probe tip protruding from the base. The base has a tip placement section and an extension section, which extend from a first side edge to a second side edge of the base in order. The probe tip is made by laser processing and electroplating, located at the tip placement section, and provided with a fixed end portion connected with the base in a way that the width of the tip placement section is greater than the width of the fixed end portion. A distance from a center of the probe tip to the first side edge is less than a distance from the center of the probe tip to the second side edge. As such, requirements of fine pitch and probe height may be achieved.