The present invention relates to a manufacturing method of a semiconductor test device. A semiconductor test device according to an embodiment of the present invention, which is a semiconductor test device for testing an electrical connection of a semiconductor, may include: a first membrane portion comprising a first surface and a second surface opposite to the first surface and including a plurality of first aperture patterns extending from the first surface toward a direction of the second surface; and a second membrane portion comprising a third surface, connected to the first surface of the first membrane portion, and a fourth surface opposite to the third surface and including a plurality of second aperture patterns extending from the fourth surface toward a direction of the third surface.

The present invention relates to a manufacturing method of a semiconductor test device. A semiconductor test device according to an embodiment of the present invention, which is a semiconductor test device for testing an electrical connection of a semiconductor, may include: a first membrane portion comprising a first surface and a second surface opposite to the first surface and including a plurality of first aperture patterns extending from the first surface toward a direction of the second surface; and a second membrane portion comprising a third surface, connected to the first surface of the first membrane portion, and a fourth surface opposite to the third surface and including a plurality of second aperture patterns extending from the fourth surface toward a direction of the third surface.

Embodiments of the invention are directed to apparatuses and methods for cleaning and disinfecting probes. A cleaner is utilized to remove foreign materials (e.g., bioburden, soil, and other like material) from the probe after it is removed from the patient by soaking and/or flushing the foreign materials from the probe. The cleaner may be an enzymatic detergent that has bacteriostatic properties to inhibit bacterial growth within the apparatus. The multiple enzymes in the cleaner attack the foreign material, and include low-foam properties for effective recirculation across cycles within the cleaning step. The probe is rinsed after the cleaning step, and after rinsing a disinfectant process is applied to the probe. The disinfectant soaks and/or flushes the probe for a specified amount of time across cycles of recirculation to disinfect the surface of the probe, and afterwards the probe is rinsed thoroughly to remove the disinfectant from the probe.

Embodiments of the invention are directed to apparatuses and methods for cleaning and disinfecting probes. A cleaner is utilized to remove foreign materials (e.g., bioburden, soil, and other like material) from the probe after it is removed from the patient by soaking and/or flushing the foreign materials from the probe. The cleaner may be an enzymatic detergent that has bacteriostatic properties to inhibit bacterial growth within the apparatus. The multiple enzymes in the cleaner attack the foreign material, and include low-foam properties for effective recirculation across cycles within the cleaning step. The probe is rinsed after the cleaning step, and after rinsing a disinfectant process is applied to the probe. The disinfectant soaks and/or flushes the probe for a specified amount of time across cycles of recirculation to disinfect the surface of the probe, and afterwards the probe is rinsed thoroughly to remove the disinfectant from the probe.

The objective of the present disclosure is to provide a semiconductor package test apparatus for testing a semiconductor package by means of connecting a semiconductor package and a test board. The test apparatus according to the present disclosure comprises: a conductive part mounted on a test board providing a test signal, formed at each of positions corresponding to a pad of the test board, and having a plurality of conductive particles aligned in a thickness direction in an elastic insulating material; a test socket made of an elastic insulating material and including an insulating part insulating the conductive part from another adjacent conductive part while supporting the conductive part; a multi-layer organic product closely disposed on the upper side of the test socket and having a lower land formed at each of positions corresponding to the conductive part, an upper land formed at each of positions corresponding to a terminal of the semiconductor package, and a wiring pattern connecting the lower land and the upper land formed in a substrate; and a pitch converter deposited on the upper land and having conductive contact pins contacting the terminals of the semiconductor package, wherein the lower end of the conductive part is connected to the pad of the test board, and the upper end of the conductive part is connected to the lower land, such that the semiconductor package and the test board having different pitches can be tested.

A flexible probe for microLED defect detection includes: a flexible base and a flexible circuit film layer. The flexible base includes a flexible substrate and flexible protrusions located on the flexible substrate. A circuit for illuminating a microLED to be detected is provided inside the flexible circuit film layer. The flexible circuit film layer is attached to a surface on a side of the flexible base on which the flexible protrusions are provided, at least a portion of the circuit of the flexible circuit film layer is located on the flexible protrusions, and when the flexible probe for MicroLED defect detection is placed on the MicroLED, the circuit on the flexible protrusions abuts against pins of the MicroLED to be detected and is electrically connected to the pins.

A flexible probe for microLED defect detection includes: a flexible base and a flexible circuit film layer. The flexible base includes a flexible substrate and flexible protrusions located on the flexible substrate. A circuit for illuminating a microLED to be detected is provided inside the flexible circuit film layer. The flexible circuit film layer is attached to a surface on a side of the flexible base on which the flexible protrusions are provided, at least a portion of the circuit of the flexible circuit film layer is located on the flexible protrusions, and when the flexible probe for MicroLED defect detection is placed on the MicroLED, the circuit on the flexible protrusions abuts against pins of the MicroLED to be detected and is electrically connected to the pins.

Provided is a current detection resistor, such as a shunt resistor, wherein a. low specific resistance and a small thermal electromotive force with respect to copper are achieved, while maintaining a low TCR. A resistance alloy for use in a current detection shunt resistor includes 4.5 to 5.5 mass % of manganese, 0.05 to 0.30 mass % of silicon, 0.10 to 0.30 mass % of iron, and a balance being copper, and has a specific resistance of 15 to 25 .Math.m.

A probe card system is provided. The probe card system, including a tester assembly, a probe head body configured to couple with the tester assembly, a first interconnection structure on a first side of the probe head body, and a probe layer structure on the first interconnection structure on the first side of the probe head body which is configured to engage with a wafer under test (WUT). The probe layer structure includes a sacrificial layer in connection with the first interconnection structure, a bonding layer in connection with the sacrificial layer, and a plurality of probe tips each in connection with respective conductive patterns exposed from the bonding layer and electrically coupled to the first interconnection structure. The sacrificial layer allows removal of the bonding layer and the plurality of probe tips via an etching operation. A method of manufacturing a probe card system is also provided.

A probe card system is provided. The probe card system, including a tester assembly, a probe head body configured to couple with the tester assembly, a first interconnection structure on a first side of the probe head body, and a probe layer structure on the first interconnection structure on the first side of the probe head body which is configured to engage with a wafer under test (WUT). The probe layer structure includes a sacrificial layer in connection with the first interconnection structure, a bonding layer in connection with the sacrificial layer, and a plurality of probe tips each in connection with respective conductive patterns exposed from the bonding layer and electrically coupled to the first interconnection structure. The sacrificial layer allows removal of the bonding layer and the plurality of probe tips via an etching operation. A method of manufacturing a probe card system is also provided.