The purpose of the present disclosure is to provide a conductor part protecting member for a signal transmitting connector and a manufacturing method therefor, and a signal transmitting connector having same and a manufacturing method therefor, the conductor part protecting member being capable of protecting an electro-conductive part so as to be able to minimize deformation of and damage to the electro-conductive part coming into contact with the terminals of an electronic component such as a semiconductor package.

A test probe assembly for use in testing a semiconductor wafer includes a probe card, a plurality of test probes mounted to the probe card and one or more piezoelectric elements mounted to each test probe. The piezoelectric elements are configured to move respective probe ends of the individual test probes in at least one direction to facilitate realignment of the probe ends for semiconductor wafer testing.

An embodiment of a magnetic-field sensor includes a magnetic-field sensor arrangement and a magnetic body which has, for example, a non-convex cross-sectional area with regard to a cross-sectional plane running through the magnetic body, the magnetic body having an inhomogeneous magnetization.

An embodiment of a magnetic-field sensor includes a magnetic-field sensor arrangement and a magnetic body which has, for example, a non-convex cross-sectional area with regard to a cross-sectional plane running through the magnetic body, the magnetic body having an inhomogeneous magnetization.

It is described a contact probe for a testing head of an apparatus for testing electronic devices including a body essentially extended along a longitudinal direction between a contact tip and a contact head, that contact probe comprising at least one multilayer structure, in turn including a superposition of at least one inner layer or core and a first inner coating layer, and an outer coating layer that completely covers the multilayer structure and made of a material having a higher hardness than a material realizing the core.

It is described a contact probe for a testing head of an apparatus for testing electronic devices including a body essentially extended along a longitudinal direction between a contact tip and a contact head, that contact probe comprising at least one multilayer structure, in turn including a superposition of at least one inner layer or core and a first inner coating layer, and an outer coating layer that completely covers the multilayer structure and made of a material having a higher hardness than a material realizing the core.

A testing arrangement for testing Integrated Circuit (IC) interconnects is provided. In an example, the testing arrangement includes a substrate, and a first interconnect structure. The first interconnect structure may include a first member having a first end to attach to the substrate and a second end opposite the first end, and a second member having a first end to attach to the substrate and a second end opposite the first end. In some examples, the second end of the first member and the second end of the second member are to contact a second interconnect structure of a IC device under test, and the first end of the first member and the first end of the second member are coupled such that the first member and the second member are to transmit, in parallel, current to the second interconnect structure of the IC device under test.

A testing arrangement for testing Integrated Circuit (IC) interconnects is provided. In an example, the testing arrangement includes a substrate, and a first interconnect structure. The first interconnect structure may include a first member having a first end to attach to the substrate and a second end opposite the first end, and a second member having a first end to attach to the substrate and a second end opposite the first end. In some examples, the second end of the first member and the second end of the second member are to contact a second interconnect structure of a IC device under test, and the first end of the first member and the first end of the second member are coupled such that the first member and the second member are to transmit, in parallel, current to the second interconnect structure of the IC device under test.

The invention is a contacting device suitable for measurements and/or other contact tests, the device comprising a head unit comprising a plunger (14) having a broadened portion (28) at its first end, and a head element (16) being on a second end of the plunger (14); a tube element (10) having a third end and a fourth end opposite the third end, receiving the broadened portion (28) of the plunger (14) at the third end, and keeping the broadened portion (28) in its inner space by means of an inward-projecting flange portion (18) arranged at the third end; and a resilient element (20) being arranged in the inner space of the tube element (10) being supported against the end portion of the broadened portion (28) and against the closed fourth end of the tube element (10). The second end of the plunger (14) projects out from the tube element (10) in case the broadened portion (28) is abutted against the flange portion (18). In the contacting device according to the invention the head element (16) and the second end of the plunger (14) are connected to each other by shrink fitting or by press fitting. The invention is, furthermore, a head unit for a contacting device, and methods for manufacturing a contacting device and a head unit.

The invention is a contacting device suitable for measurements and/or other contact tests, the device comprising a head unit comprising a plunger (14) having a broadened portion (28) at its first end, and a head element (16) being on a second end of the plunger (14); a tube element (10) having a third end and a fourth end opposite the third end, receiving the broadened portion (28) of the plunger (14) at the third end, and keeping the broadened portion (28) in its inner space by means of an inward-projecting flange portion (18) arranged at the third end; and a resilient element (20) being arranged in the inner space of the tube element (10) being supported against the end portion of the broadened portion (28) and against the closed fourth end of the tube element (10). The second end of the plunger (14) projects out from the tube element (10) in case the broadened portion (28) is abutted against the flange portion (18). In the contacting device according to the invention the head element (16) and the second end of the plunger (14) are connected to each other by shrink fitting or by press fitting. The invention is, furthermore, a head unit for a contacting device, and methods for manufacturing a contacting device and a head unit.