A contact probe can be easily mass-produced, reduce manufacturing cost, and obtain a stable contact state with an electrode such as a land of an inspection substrate. An inspection socket can be provided with the contact probe. The contact probe has a first contact terminal that contacts a solder ball of a device under test and a second contact terminal that contacts a land of a printed substrate, and a coil spring for urging contact terminals so as to separate the first and the second terminals. The first contact terminal is constituted by a first contact element formed by a rod-shaped metal member, and the second contact terminal is constituted by two second contact elements formed by a plate-shaped metal member and which clamp the first contact element in frictional contact with a part of the first contact element.

Proposed are an anodic aluminum oxide mold made of an anodic aluminum oxide film, a manufacturing method thereof, a half-finished probe product, a manufacturing method thereof, a probe card, and a manufacturing method thereof.

A semiconductor probe includes multiple metal layers. An oxide layer is disposed between each adjacent pair of the metal layer. A via for connecting at least one pair of the metal layers. At least one protection layer 150 is disposed at an external side of the metal layer.

A cantilever-type probe with multiple metallic coatings is disclosed. The cantilever-type probe includes at least one probe pin. A first metallic coating is disposed upon a tip of the probe pin, and a second metallic coating is disposed upon a root of the probe pin. The second metallic coating is in contact with the first metallic coating and comprises a softer (more flexible) metal than the first metallic coating.

Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the carrier plates. In other words, the carrier plates are purely mechanical in function. This configuration can significantly reduce probe array fabrication time relative to sequential placement of individual probes on the space transformer. Multiple probe carrier plates can be populated with probes in parallel, and the final sequential assembly of carrier plates onto the space transformer has a greatly reduced operation count. Deviations of the space transformer from flatness can be compensated for.

Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the carrier plates. In other words, the carrier plates are purely mechanical in function. This configuration can significantly reduce probe array fabrication time relative to sequential placement of individual probes on the space transformer. Multiple probe carrier plates can be populated with probes in parallel, and the final sequential assembly of carrier plates onto the space transformer has a greatly reduced operation count. Deviations of the space transformer from flatness can be compensated for.

A system comprises: a contactor having a first surface, a second surface, a first hole, a second hole parallel to the first hole, and a third hole parallel to the first hole; a first signal pin held in the first hole of the contactor, extending to at least the second surface of the contactor, and extending to at least the first surface of the contactor; a first short ground pin held in the second hole of the contactor, extending to at least the second surface of the contactor, and extending within the first surface of the contactor; and a ground pin held in the third hole of the contactor, extending to at least the second surface of the contactor, and extending to at least the first surface of the contactor.

A system comprises: a contactor having a first surface, a second surface, a first hole, a second hole parallel to the first hole, and a third hole parallel to the first hole; a first signal pin held in the first hole of the contactor, extending to at least the second surface of the contactor, and extending to at least the first surface of the contactor; a first short ground pin held in the second hole of the contactor, extending to at least the second surface of the contactor, and extending within the first surface of the contactor; and a ground pin held in the third hole of the contactor, extending to at least the second surface of the contactor, and extending to at least the first surface of the contactor.

A system, method and apparatus for measuring carrier lifetime of a device comprises subjecting a test device to a voltage via a voltage source associated with the test system, disconnecting the test device from the voltage source, measuring the voltage as a function of time, measuring the current as a function of time, and determining a carrier lifetime of the test piece according to the slope of the measured voltage and the measured current.

A system, method and apparatus for measuring carrier lifetime of a device comprises subjecting a test device to a voltage via a voltage source associated with the test system, disconnecting the test device from the voltage source, measuring the voltage as a function of time, measuring the current as a function of time, and determining a carrier lifetime of the test piece according to the slope of the measured voltage and the measured current.