A wafer test machine is disclosed. The wafer test machine comprises a main body having a chamber defined therein, wherein a probe card is disposed at an upper portion of the chamber; a chuck for fixing a wafer in the chamber; a moving unit for moving the chuck in the chamber, thus making a contact between the probe card and the wafer; and a laser cleaning apparatus for cleaning the probe card in the chamber using a laser beam, when the probe card does not contact the wafer.

Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.

Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.

A multi-layer eddy current probe has a large number of flat spiral coils which are arranged in different coil layers of a multi-layer arrangement, wherein a respective insulating layer which is composed of electrically insulating material is arranged between adjacent coil layers of the multi-layer arrangement. Each of the flat coils has an inner terminal and an outer terminal. Selected terminals of selected flat coils of different coil layers are electrically connected to one another by way of vias. The flat coils form at least one coil group which has at least three flat coils which are arranged one above the other in different layers, wherein the inner terminals of the at least three flat coils of the coil group are electrically conductively connected by means of a common inner via.

A multi-layer eddy current probe has a large number of flat spiral coils which are arranged in different coil layers of a multi-layer arrangement, wherein a respective insulating layer which is composed of electrically insulating material is arranged between adjacent coil layers of the multi-layer arrangement. Each of the flat coils has an inner terminal and an outer terminal. Selected terminals of selected flat coils of different coil layers are electrically connected to one another by way of vias. The flat coils form at least one coil group which has at least three flat coils which are arranged one above the other in different layers, wherein the inner terminals of the at least three flat coils of the coil group are electrically conductively connected by means of a common inner via.

A probe card for testing of electronic devices comprises a testing head with plural contact probes inserted into guide holes of an upper guide and a lower guide, and a space transformer, each of the contact probes having a first terminal portion projecting from the lower guide with a first length and ending with a contact tip adapted to abut onto a respective contact pad of a device to be tested, and a second terminal portion projecting from the upper guide with a second length and ending with a contact head adapted to abut onto a contact pad of the space transformer. The probe card comprises a spacer element interposed between the space transformer and the upper guide and removable to adjust the first length of the first terminal portion by changing the second length of the second terminal portion and approaching the upper guide and the space transformer.

Provided is a conical nano-carbon material functionalized needle tip, formed by assembling a nano-carbon material with a material of a needle tip by means of a covalent bond; and the material of the needle tip is a metal selected from one or more of tungsten, iron, cobalt, nickel and titanium. Further provided is a method for preparing the conical nano-carbon material functionalized needle tip. The conical nano-material functionalized needle tip has an outstanding interface formed by metal-carbide covalent bonds, and the orientation of the conical nano-material is matched with the axial direction of the metal needle tip (illustrated in FIG. 6). The proposed preparation method affords a robust interface and avoids the potential pollution to the nano-material caused during the deposition of fixing materials, such as carbon or platinum or the like, in other preparation methods.

Provided is a conical nano-carbon material functionalized needle tip, formed by assembling a nano-carbon material with a material of a needle tip by means of a covalent bond; and the material of the needle tip is a metal selected from one or more of tungsten, iron, cobalt, nickel and titanium. Further provided is a method for preparing the conical nano-carbon material functionalized needle tip. The conical nano-material functionalized needle tip has an outstanding interface formed by metal-carbide covalent bonds, and the orientation of the conical nano-material is matched with the axial direction of the metal needle tip (illustrated in FIG. 6). The proposed preparation method affords a robust interface and avoids the potential pollution to the nano-material caused during the deposition of fixing materials, such as carbon or platinum or the like, in other preparation methods.

Embodiments of the invention include a tool and method for automatically replacing defective pogo pins for use in testing a semiconductor package. Aspects of the invention include a nozzle tip and a pin management valve assembly coupled to the nozzle tip. The pin management valve assembly is actuatable to couple an open pin management valve or a partially closed pin management valve to the nozzle tip. The open pin management valve includes a first diameter and the partially closed pin management valve includes a second diameter. A vacuum reservoir is coupled to the pin management valve assembly and a vacuum management valve is positioned between the pin management valve assembly and the vacuum reservoir. The vacuum management valve is actuatable between an open and closed position.

Embodiments of the invention include a tool and method for automatically replacing defective pogo pins for use in testing a semiconductor package. Aspects of the invention include a nozzle tip and a pin management valve assembly coupled to the nozzle tip. The pin management valve assembly is actuatable to couple an open pin management valve or a partially closed pin management valve to the nozzle tip. The open pin management valve includes a first diameter and the partially closed pin management valve includes a second diameter. A vacuum reservoir is coupled to the pin management valve assembly and a vacuum management valve is positioned between the pin management valve assembly and the vacuum reservoir. The vacuum management valve is actuatable between an open and closed position.