An apparatus, including methods of construction and use, for super-fine pitch integrated circuit testing is disclosed. The apparatus includes a substrate of one or more redistribution layers (RDLs), a plurality of vertical interconnect access (via) columns, a material that backs the substrate, and another material that protects the plurality of via columns. Semiconductor wafer fabrication processes are used to fabricate the apparatus, effective to enable the apparatus to test one or more IC die having pad pitch spacing of less than 50 um.

A probe member for inspection according to an exemplary embodiment includes: a contact portion formed of a first metal with a sharp point on one side to contact an object to be inspected and a body portion formed of a second metal on the other side of the contact portion, wherein the body portion includes a concave portion formed on a side and having a second diameter smaller than a first diameter of the contact portion, and the contact portion and the body portion are formed through a separate process to form a boundary surface therebetween.

A probe member for inspection according to an exemplary embodiment includes: a contact portion formed of a first metal with a sharp point on one side to contact an object to be inspected and a body portion formed of a second metal on the other side of the contact portion, wherein the body portion includes a concave portion formed on a side and having a second diameter smaller than a first diameter of the contact portion, and the contact portion and the body portion are formed through a separate process to form a boundary surface therebetween.

The disclosure relates to a method of fabricating a test socket that supports a probe stretchable in a longitudinal direction. The method of fabricating a test socket includes forming a coupling block by joining an insulating member of an insulating material to one surface of a base member of a conductive material, forming a probe accommodating hole for accommodating the probe in the coupling block and a first support hole for supporting one end portion of the probe, forming a second support hole in a cover member of an insulating material for supporting the other end portion of the probe, inserting the probe into the probe accommodating hole so that the one end portion of the probe is supported by the first support hole, and joining the cover member to the other surface of the base member so that the other end portion of the probe is supported by the second support hole.

The disclosure relates to a method of fabricating a test socket that supports a probe stretchable in a longitudinal direction. The method of fabricating a test socket includes forming a coupling block by joining an insulating member of an insulating material to one surface of a base member of a conductive material, forming a probe accommodating hole for accommodating the probe in the coupling block and a first support hole for supporting one end portion of the probe, forming a second support hole in a cover member of an insulating material for supporting the other end portion of the probe, inserting the probe into the probe accommodating hole so that the one end portion of the probe is supported by the first support hole, and joining the cover member to the other surface of the base member so that the other end portion of the probe is supported by the second support hole.

A test socket is provided. The test socket includes a conductive body having a first surface configured to face a printed circuit board (PCB) and a second surface configured to face an integrated circuit (IC) chip. The conductive body defines a signal cavity and a ground cavity that extend from the first surface to the second surface. The test socket further includes a signal probe disposed in the signal cavity. The signal probe is configured to electrically connect to a signal conductor of the PCB and to a signal pad of the IC chip. The test socket further includes a ground probe disposed in the ground cavity. The ground probe is configured to electrically connect to a ground conductor of the PCB and to a ground pad of the IC chip. The conductive body is configured to be electrically connected to the ground conductor of the PCB.

A test socket is provided. The test socket includes a conductive body having a first surface configured to face a printed circuit board (PCB) and a second surface configured to face an integrated circuit (IC) chip. The conductive body defines a signal cavity and a ground cavity that extend from the first surface to the second surface. The test socket further includes a signal probe disposed in the signal cavity. The signal probe is configured to electrically connect to a signal conductor of the PCB and to a signal pad of the IC chip. The test socket further includes a ground probe disposed in the ground cavity. The ground probe is configured to electrically connect to a ground conductor of the PCB and to a ground pad of the IC chip. The conductive body is configured to be electrically connected to the ground conductor of the PCB.

An apparatus and method for the manufacturing and use in a semiconductor test system is disclosed. The apparatus includes a signal probe and a dielectric sleeve surrounding the signal probe. A method includes forming a mold to receive a component of a contactor assembly, inserting the component into the mold, and forming a dielectric sleeve in at least one of the one or more signal probe holes through an injection molding process. The component includes one or more signal probe holes.

An apparatus and method for the manufacturing and use in a semiconductor test system is disclosed. The apparatus includes a signal probe and a dielectric sleeve surrounding the signal probe. A method includes forming a mold to receive a component of a contactor assembly, inserting the component into the mold, and forming a dielectric sleeve in at least one of the one or more signal probe holes through an injection molding process. The component includes one or more signal probe holes.

A device for handling a test contact in which the device includes a contact head provided with a test contact receptacle at its contact end, the test contact receptacle having a positioning unit having at least two, preferably three, positioning surfaces for coming into positioning contact with a test contact and for positioning the test contact relative to the contact end of the contact head. The at least one positioning surface of the positioning unit being formed as a base contact surface and at least one more positioning surface of the positioning unit being formed as an edge contact surface. Furthermore, a manufacturing system is also provided for manufacturing a test contact arrangement for testing semiconductor components.