A device for handling a test contact in which the device includes a contact head provided with a test contact receptacle at its contact end, the test contact receptacle having a positioning unit having at least two, preferably three, positioning surfaces for coming into positioning contact with a test contact and for positioning the test contact relative to the contact end of the contact head. The at least one positioning surface of the positioning unit being formed as a base contact surface and at least one more positioning surface of the positioning unit being formed as an edge contact surface. Furthermore, a manufacturing system is also provided for manufacturing a test contact arrangement for testing semiconductor components.

A probe chip consisting of multiple probes integrated on a single substrate. The layout of the probes could be designed to match specific features on the device under test. The probes are spring-loaded to allow for reversible deformation during contacting of the device under test. The probe chip provides for detailed electrical and mechanical testing of integrated circuits (IC).

A probe chip consisting of multiple probes integrated on a single substrate. The layout of the probes could be designed to match specific features on the device under test. The probes are spring-loaded to allow for reversible deformation during contacting of the device under test. The probe chip provides for detailed electrical and mechanical testing of integrated circuits (IC).

The invention relates to a punched part for producing an electrical resistor, in particular a current measuring resistor, comprising a resistor element (9) consisting of a low-resistance resistive material (for example Manganin) and two electrical connection parts (10, 11) consisting of a conductor material (for example copper), wherein the resistor element (9) is arranged between the two electrical connection parts (10, 11) in the direction of current flow in such a way that the electrical current flows through the resistor element (9). In accordance with the invention, the punched part additionally has a landing area (14) for providing an integrated circuit (16) on the landing area (14) of the punched part. Furthermore, the invention comprises a current sensor comprising such a punched part and a corresponding production method.

A prober in which a probe head can be easily replaced is provided. A prober 10 includes a main body 12; a stage 11 provided within the main body 12 and configured to place a wafer W thereon; a card 16 provided within the main body 12 to face the stage 11; and a probe head holder 24 provided within the main body 12 and configured to be moved toward the card 16. The card 16 includes a probe head 30 which is detachably attached to the card 16 and has a multiple number of probe needles 35, and the probe head holder 24 is moved toward the card 16 while holding the probe head 30 thereon.

A prober in which a probe head can be easily replaced is provided. A prober 10 includes a main body 12; a stage 11 provided within the main body 12 and configured to place a wafer W thereon; a card 16 provided within the main body 12 to face the stage 11; and a probe head holder 24 provided within the main body 12 and configured to be moved toward the card 16. The card 16 includes a probe head 30 which is detachably attached to the card 16 and has a multiple number of probe needles 35, and the probe head holder 24 is moved toward the card 16 while holding the probe head 30 thereon.

A microelectromechanical probe has tail, head and body portions, and includes a pinpoint layer having a planarized top surface where a structural layer having first and second sides, a cutting face and a front terminal surface adjoining the first and second sides is disposed. The cutting face descends from the top surface of the structural layer toward the pinpoint layer to the front terminal surface. The front terminal surface extends from a front end of the cutting face to the top surface of the pinpoint layer. The pinpoint layer has a pinpoint protruding over the front terminal surface and located at the head portion. Within the head portion, the pinpoint layer is greater in hardness and less in electrical conductivity than the structural layer. The probe makes small probing marks, is highly recognizable in an automatic pinpoint recognition process, and can be conveniently installed.

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). To prevent rotation of the pins in the pin guide, a walled recess in the bottom of the pin guide engages flanges on the pins. In another embodiment, the pin guide maintains rotational alignment by being fitted around the pin profile or having projections abutting the pin. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). To prevent rotation of the pins in the pin guide, a walled recess in the bottom of the pin guide engages flanges on the pins. In another embodiment, the pin guide maintains rotational alignment by being fitted around the pin profile or having projections abutting the pin. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

The invention relates to a device for the placing and contacting of a test contact (15) of a test contact arrangement arranged on a contact carrier (19), wherein the device features a contact head (10) having at least one transmission channel for transmitting thermal energy and transferring a vacuum, wherein the contact head is provided with a test contact receptacle (11) at its contact end in the area of a channel mouth, wherein the test contact receptacle has a receiving gap (14) formed between two parallel receiving cheeks (12, 13) for receiving the test contact and connected with the transmission channel, wherein the receiving cheeks have contact surfaces (21) at their contact ends for contacting a solder deposit arranged (20) on the contact carrier, in order to produce a heat conducting contact with the solder material of the solder deposit.