A film-forming device disclosed is a film-forming device for forming a film on a metal foil having a porous portion on a main surface thereof by a gas phase method, and includes a film-forming region in which the film is formed on the metal foil, conveyors to provided downstream of the film-forming region and drawing the metal foil from the film-forming region, and a control unit that controls the stress applied to the metal foil from the conveyors to 21 N/mm.sup.2 or less. This provides a film-forming device which does not cause defects easily on a film-forming target metal foil.

An element body has an exposed surface including a selective surface material which is to be coated with the coating material and a non-selected surface material which is not to be coated with the coating material. The selected surface material has different material properties than the non-selected surface material. The element body is coated with the coating material by applying a surface modifier only on the surface of the selected surface material and thereafter coating the surface of the selected surface material to which the surface modifier has been applied with the coating material.

An element body has an exposed surface including a selective surface material which is to be coated with the coating material and a non-selected surface material which is not to be coated with the coating material. The selected surface material has different material properties than the non-selected surface material. The element body is coated with the coating material by applying a surface modifier only on the surface of the selected surface material and thereafter coating the surface of the selected surface material to which the surface modifier has been applied with the coating material.

A capacitor assembly includes a capacitor having ends. A terminal covers less than an area of one end. A wire bond has opposing ends with one end being coupled to the terminal and is configured to break connection with a circuit when an electrical current through the wire bond reaches a fusing current. An energy storage module includes at least two capacitor assemblies. The wire bond of one capacitor is electrically connected to the second terminal of an adjacent capacitor. An energy storage assembly includes two energy storage modules stacked one on top of the other. A pulse forming network includes conductors and at least two energy storage modules. A method of making a module includes charging each of the capacitors, removing each capacitor that fails, connecting one end of a wire bond to one terminal and connecting the other end to an adjacent capacitor or to a conductor.

A capacitor assembly includes a capacitor having ends. A terminal covers less than an area of one end. A wire bond has opposing ends with one end being coupled to the terminal and is configured to break connection with a circuit when an electrical current through the wire bond reaches a fusing current. An energy storage module includes at least two capacitor assemblies. The wire bond of one capacitor is electrically connected to the second terminal of an adjacent capacitor. An energy storage assembly includes two energy storage modules stacked one on top of the other. A pulse forming network includes conductors and at least two energy storage modules. A method of making a module includes charging each of the capacitors, removing each capacitor that fails, connecting one end of a wire bond to one terminal and connecting the other end to an adjacent capacitor or to a conductor.

A capacitor unit and a manufacturing process thereof are provided. The manufacturing process includes: providing a carrier; forming a metallic layer on the carrier, defining a plurality of metallic blocks in the metallic layer, and forming a middle stacking structure on each of the metallic blocks, wherein the middle stacking structure includes a first capacitance conductive layer, a second capacitance conductive layer, and a capacitance insulation layer located between the first and second capacitance conductive layers, wherein the first capacitance conductive layer is electrically connected to the corresponding one of the metallic blocks; and removing the carrier to expose the metallic blocks so as to form a plurality of independent capacitor units, so as to fabricate double sided capacitor units with high capacitance.

A capacitor unit and a manufacturing process thereof are provided. The manufacturing process includes: providing a carrier; forming a metallic layer on the carrier, defining a plurality of metallic blocks in the metallic layer, and forming a middle stacking structure on each of the metallic blocks, wherein the middle stacking structure includes a first capacitance conductive layer, a second capacitance conductive layer, and a capacitance insulation layer located between the first and second capacitance conductive layers, wherein the first capacitance conductive layer is electrically connected to the corresponding one of the metallic blocks; and removing the carrier to expose the metallic blocks so as to form a plurality of independent capacitor units, so as to fabricate double sided capacitor units with high capacitance.

A capacitor element and a method of manufacturing the same are provided. The method includes steps of: providing a metal foil having an oxide layer formed on an outer surface of the metal foil; forming a surrounding barrier layer onto the oxide layer so as to divide the outer surface of the oxide layer into a first part outer surface and a second part outer surface separated from each other; forming a base layer onto the oxide layer so as to partially encapsulate the oxide layer; cleaning the base layer by a cleaning solution and then drying the base layer; forming a conductive polymer layer onto the base layer; and forming a conductive paste layer onto the conductive polymer layer.

An electronic component includes an electronic component main body including a body and an external electrode disposed on the body. The body includes a dielectric layer and an internal electrode. The electronic component further includes a coating portion including a coating layer, disposed on an external surface of the electronic component main body, and a plurality of projections disposed on the coating layer.

An electronic component conveying tape includes an elongated carrier tape including recessed storage portions at regular intervals in a length direction, and each storing an electronic component, and an elongated cover tape attached to one surface in a thickness direction of the carrier tape to cover openings of the storage portions. The carrier tape is made of paper, and fibers included in the carrier tape are sloped toward the thickness direction relative to the length direction.