Patent classifications
H01G13/00
Winder
A winder includes a winding mechanism, a chamber, a vacuum pump, a conveying route and a product case. The winding mechanism winds a belt-shaped raw film around a winding core, the belt-shaped raw film being composed of a plurality of electrodes and a plurality of separating films. The chamber houses the winding mechanism. The vacuum pump sucks air into the chamber. The conveying route has a sealed outer space outside the chamber, an inner space of the chamber leading to the outer space in the conveyance route. The product case is disposed in the conveying route to house a plurality of winding products each formed by winding the raw film with use of the winding mechanism.
CAPACITOR ASSEMBLY PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A capacitor assembly package structure and a method of manufacturing the same are provided. The capacitor assembly package structure includes a capacitor unit, an insulative package body, a conductive connection layer and an electrode unit. The capacitor unit includes a plurality of capacitors, and each capacitor includes a positive portion and a negative portion. The insulative package body partially encloses the capacitors, and the positive portion has a positive lateral surface exposed from a first lateral surface of the insulative package body. The conductive connection layer is electrically connected to the negative portion. The electrode unit includes a first electrode structure and a second electrode structure. The first electrode structure encloses a first portion of the insulative package body and electrically connects to the positive portion, and the second electrode structure encloses a second portion of the insulative package body and electrically connects to the conductive connection layer.
ELECTRONIC COMPONENT MANUFACTURING METHOD AND APPARATUS
An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).
Process for production of multilayer electronic component
A process for production of a multilayer electronic component having an element body wherein a functional part and a conductor part are laminated, using an ejection device wherein ink is electrically charged at an ejection part by applying a voltage and the electrically charged ink is ejected from the ejection part by an electrostatic attraction force, and including a first step of forming a green functional part by using a first ink including a functional particle as the ink, a second step of forming a green conductor part by using a second ink including a conductive particle as the ink, a step of forming a green multilayer body by repeating the first step and the second step, and a step of treating the green multilayer body to obtain the element body.
Process for production of multilayer electronic component
A process for production of a multilayer electronic component having an element body wherein a functional part and a conductor part are laminated, using an ejection device wherein ink is electrically charged at an ejection part by applying a voltage and the electrically charged ink is ejected from the ejection part by an electrostatic attraction force, and including a first step of forming a green functional part by using a first ink including a functional particle as the ink, a second step of forming a green conductor part by using a second ink including a conductive particle as the ink, a step of forming a green multilayer body by repeating the first step and the second step, and a step of treating the green multilayer body to obtain the element body.
Method of manufacturing capacitor component having external electrodes with reduced thickness
A capacitor component includes a body having a first surface and a second surface opposing each other and including a multilayer structure in which a plurality of dielectric layers are stacked and first and second internal electrodes are alternately disposed with respective dielectric layers interposed therebetween and exposed to the first surface and the second surface, respectively, first and second metal layers covering the first surface and the second surface and connected to the first and second internal electrodes, respectively, first and second ceramic layers covering the first and second metal layers, and first and second external electrodes covering the first and second ceramic layers and connected to the first and second metal layers to be electrically connected to the first and second internal electrodes, respectively.
VACUUM-CAPACITOR METHOD AND APPARATUS
An apparatus and associated method for an energy-storage device (e.g., a capacitor) having a plurality of electrically conducting electrodes including a first electrode and a second electrode separated by a non-electrically conducting region, and wherein the non-electrically conducting region further includes a non-uniform permittivity (K) value. In some embodiments, the method includes providing a substrate; fabricating a first electrode on the substrate; and fabricating a second electrode such that the second electrode is separated from the first electrode by a non-electrically conducting region, wherein the non-electrically conducting region has a non-uniform permittivity (K) value. The capacitor devices will find benefit for use in electric vehicles, of all kinds, uninterruptible power supplies, wind turbines, mobile phones, and the like requiring wide temperature ranges from several hundreds of degrees C. down to absolute zero, consumer electronics operating in a temperature range of −55 degrees C. to 125 degrees C.
VACUUM-CAPACITOR METHOD AND APPARATUS
An apparatus and associated method for an energy-storage device (e.g., a capacitor) having a plurality of electrically conducting electrodes including a first electrode and a second electrode separated by a non-electrically conducting region, and wherein the non-electrically conducting region further includes a non-uniform permittivity (K) value. In some embodiments, the method includes providing a substrate; fabricating a first electrode on the substrate; and fabricating a second electrode such that the second electrode is separated from the first electrode by a non-electrically conducting region, wherein the non-electrically conducting region has a non-uniform permittivity (K) value. The capacitor devices will find benefit for use in electric vehicles, of all kinds, uninterruptible power supplies, wind turbines, mobile phones, and the like requiring wide temperature ranges from several hundreds of degrees C. down to absolute zero, consumer electronics operating in a temperature range of −55 degrees C. to 125 degrees C.
Winding apparatus and method
A winding apparatus is disclosed for winding material around a core of flat shape rotated around a rotation axis carried by a crank that is in turn carried by another crank, the three rotation axes of the core and of the two cranks being motorized independently by respective electric cams, with three distinct laws of motion programmed to cancel the variations in position and speed of the material entering the core. The winding apparatus is used for the production of electric energy storage devices.
METHOD OF MANUFACTURING MULTILAYER CHIP COMPONENT
In a method of manufacturing a multilayer chip component according to an aspect of the present disclosure, a two-dimensional code is formed in each of green chips divided in a dividing step. In the two-dimensional code, a substrate ID identifying a laminate substrate and an individual body ID identifying an individual multilayer chip component are associated with each other. Therefore, it is possible to accurately and quickly discern which laminate substrate a multilayer chip component is manufactured from by reading the two-dimensional code of the multilayer chip component, and thus high traceability can be achieved.