Patent classifications
H01P11/00
Deposition antenna apparatus and methods
Space- and cost-efficient antenna apparatus and methods of making and using the same. In one embodiment, the antenna is formed using a deposition process, whereby a conductive fluid or other material is deposited directly on one or more interior components of a host device (e.g., cellular phone or tablet computer). The antenna can be formed in a substantially three-dimensional “loop” shape, and obviates several costly and environmentally unfriendly processing steps and materials associated with prior art antenna manufacturing approaches.
Deposition antenna apparatus and methods
Space- and cost-efficient antenna apparatus and methods of making and using the same. In one embodiment, the antenna is formed using a deposition process, whereby a conductive fluid or other material is deposited directly on one or more interior components of a host device (e.g., cellular phone or tablet computer). The antenna can be formed in a substantially three-dimensional “loop” shape, and obviates several costly and environmentally unfriendly processing steps and materials associated with prior art antenna manufacturing approaches.
Bandpass filter and method of fabricating the same
The invention provides a bandpass filter, comprising: a substrate with a plurality of dielectric layers; a plurality of resonators; and a plurality of ground layers each having one slot arranged on; wherein the plurality of resonators are arrayed vertically each on respective one of the plurality of dielectric layers alternately without any of offsets, and each of the plurality of ground layers is between adjacent dielectric layers. Adjacent slots are arranged in opposite sides of the ground layers. The invention also provides a method of fabricating the bandpass filter.
Tunable resonator device and method of making same
Techniques and mechanisms for providing a tunable RF resonator device. In an embodiment, a patterned layer of an adhesive material is disposed on a side of a panel comprising a substrate and a metal layer. A membrane is aligned between the panel and another panel. A laminate is formed with the first panel, the second panel and the membrane, where an intermediate layer of the laminate includes a first portion comprising a liquid crystal channel, and a second portion comprising adhesive material disposed in interstices of the membrane. In another embodiment, the second portion forms at least part of a boundary to the liquid crystal channel.
Terminal connection comprising an HF conductor, in particular for a coaxial cable, and method for producing said terminal connection
A terminal connection comprises an HF conductor and a terminal apparatus. The terminal apparatus comprises an HF conductor receiving element comprising an HF conductor receiving hole. At least one solder deposit is arranged between the HF conductor and the HF conductor receiving element of the terminal apparatus to establish an electrically conductive connection. There is also an insertion sleeve comprising a receiving opening into which the HF conductor is inserted. The insertion sleeve is inserted into the HF conductor receiving hole in the HF conductor receiving element via an insertion opening on the plug-in side. The insertion sleeve is undeformable and/or is formed from a dielectric. It may also be adapted, in terms of the circumferential lateral face thereof, to an inner face of the HF conductor receiving hole. It may also comprise a receiving channel, which is used for receiving the at least one solder deposit.
Wideband antenna design for wide-scan low-profile phased arrays
An antenna cell for a wide-scan low-profile phased array system includes an antenna layer including one or more stacked conductive radiators configured to receive electromagnetic waves. The antenna cell also includes a feed layer that includes multiple rectangular slots and one or more feed structures. Each rectangular slot may excite an orthogonal polarization. The feed structures are positioned perpendicular to one another, and each of the feed structures includes a feed fork that includes a set of open-circuit stubs and is configured to tune antenna performance.
Methods And Devices For Protecting Antenna Components From Contaminants
Sealing portions of an orthomode transducer or another antenna component is accomplished by forming first and second receptacles or channels in one half or portion of the transducer and inserting first and second type of compressible sealing components into the receptacles. Upon attaching additional portions of the transducer the compressible sealing components may be compressed, but the compression is limited to an amount within a compression range to maintain a seal.
Methods And Devices For Protecting Antenna Components From Contaminants
Sealing portions of an orthomode transducer or another antenna component is accomplished by forming first and second receptacles or channels in one half or portion of the transducer and inserting first and second type of compressible sealing components into the receptacles. Upon attaching additional portions of the transducer the compressible sealing components may be compressed, but the compression is limited to an amount within a compression range to maintain a seal.
Structures for registration error compensation
Metallization layer structures for reduced changes in radio frequency characteristics due to registration error and associated methods are provided herein. An example resonator includes a first conductive layer defining an error limiting feature and a second conductive layer. The resonator further includes at least one communication feature configured to electrically couple the first conductive layer and the second conductive layer at a communication position. The error limiting feature is configured to reduce changes in radio frequency characteristics of the resonator due to registration error. Methods of manufacturing resonators are also provided herein.
Manufacturing method for a magnetic material core-embedded resin multilayer board
An antenna device includes a resin multilayer board in which a plurality of resin sheets are stacked, and a coil conductor provided in the resin multilayer board. A plurality of line portions of the coil conductor are provided on a lower surface of the resin sheet. When a magnetic material core is preliminarily pressure-bonded to the resin sheet, the magnetic material core is fractured along the line portions and cracks occur. Thus, the resin sheet with the magnetic material core in which the cracks have been formed is fully pressure-bonded together with the other resin sheets.