Front-shielded, coplanar waveguide, direct-fed, cavity-backed slot antennas are described. Various implementations form an antenna unit capable of millimeter waveform and/or microwave waveform transmissions. A bottom shielding structure of the antenna unit defines a cavity, where various implementations include one or more dampening structures within the cavity. Some implementations includes a slot antenna within the cavity defined by the bottom shielding structure, such as a coplanar waveguide (CPW) direct-fed slot antenna, to form a cavity-backed slot antenna. Some implementations connect a top shielding structure to the bottom shielding structure to encase the slot antenna. In one or more implementations, the top shielding structure includes aperture windows to allow waveforms within a frequency range from about between 600 Megahertz (MHz) to 72 Gigahertz (GHz). and radiated by the slot antenna to radiate outward from the antenna unit.

The disclosed structures and methods are directed to antenna systems configured to transmit and receive a wireless signal in and from different directions. A switchable lens antenna has excitation ports radiating radio-frequency (RF) wave into a parallel-plate waveguide structure, and a frequency selective structure (FSS). The antenna presented herein is configured to operate in two modes depending on an initial steering angle of the RF wave propagating in the parallel-plate waveguide structure. When the initial steering angle is about or less than a threshold steering angle, FSS is OFF due to its stubs being electrically disconnected from the parallel-plate waveguide structure. When the initial steering angle is higher than the threshold, FSS is ON with stubs being electrically connected to the parallel-plate waveguide structure. When ON, FSS provides phase variance to the RF wave propagating in the parallel-plate waveguide structure and increases steering angle of the RF wave.

A coupler comprising a silicon substrate with one or more double slot radiators configured to transmit or receive an RF signal, a slot balun circuit configured to isolate the RF signal, and a grounded coplanar waveguide configured to propagate the RF signal in a horizontal direction. The coupler can be included on an integrated chip with a second coupler and the chip can be positioned over two waveguides such that each coupler is positioned within the center of each waveguide aperture.

A system for EMNZ metamaterial-based direct antenna modulation. The system includes a signal generator, a metamaterial switch and an antenna. The signal generator may is configured to generate a microwave signal. The metamaterial switch is configured to generate a modulated microwave signal from the microwave signal. The modulated microwave signal is generated by selectively passing the microwave signal through the metamaterial switch. The metamaterial switch includes a first conductive plate and a first loaded conductive plate. The first loaded conductive plate includes a second conductive plate and a first monolayer graphene. The first monolayer graphene includes a first tunable conductivity. The first monolayer graphene is positioned between the first conductive plate and the second conductive plate. An effective permittivity of the metamaterial switch is configured to be adjusted to a predetermined value. The effective permittivity of the metamaterial switch is adjusted responsive to tuning the first tunable conductivity.

Apparatuses and methods are provided for a capacitor including two more plates. The capacitor includes one or more teeth cut in an edge of at least one plate of the two or more plates. The one or more teeth extends from the edge of the at least one plate to a point at a length into the at least one plate. Other aspects are described.

Increasing demand for communications systems for facilitating communications such as communications satellites leads to continuously increasing frequency bands of the signal for communication and the quantity of beams carrying the signals may make it more and more difficult to have a significant number of mechanical and electrical components concentrated in a location in proximity to the array while maintaining antenna efficiency. Provided is a direct radiating array (“DRA”) antenna for transmitting or receiving an electromagnetic radio frequency (“RF”) signal of at least one predetermined signal frequency band and a method of assembly that overcomes at least some of the disadvantages of existing direct radiating array systems and methods. The DRA antenna comprising a plurality of radiating elements, a plurality of RF signal chain paths and a beamforming network board having a plurality of electrical ports for electrically connecting to the plurality of RF signal chain paths.

An electronic device of various embodiments of the present disclosure may include: a display, a side bezel including at least one conductive portion, and a printed circuit board disposed inside the side bezel. The printed circuit board may include an interposer, and a first printed circuit board and a second printed circuit board electrically connected through the interposer. The first printed circuit board may include a first fill-cut area, and the second printed circuit board may include a second fill-cut area corresponding to the first fill-cut area, and a ground or feeding unit comprising a conductive feed of an antenna using the conductive portion may be disposed in the first fill-cut area or the second fill-cut area.

A semiconductor package includes a semiconductor chip comprising an active surface and an inactive surface facing each other. At least one antenna module is arranged adjacent to the semiconductor chip. The at least one antenna module comprises a main antenna and a sub-antenna. A redistribution structure is disposed on the semiconductor chip and the at least one antenna module. The redistribution structure electrically connects the active surface of the semiconductor chip to the at least one antenna module. A molding member surrounds the semiconductor chip and the at least one antenna module. The inactive surface of the semiconductor chip and the main antenna are exposed from the molding member, and the sub-antenna is covered by the molding member.

Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.

An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.