An object is to obtain a power conversion device that can suppress the generation of noise due to coupling and achieve the size reduction of a substrate. In a power conversion device, a main circuit wire for connecting main circuit components to form a main circuit includes a first main circuit wire and a second main circuit wire wired so as to be separated from each other on a substrate. A control wire is wired between the first main circuit wire and the second main circuit wire so as to be insulated therefrom, and the first main circuit wire and the second main circuit wire are connected to each other via the main circuit component placed so as to be separated from the control wire in the thickness direction of the substrate.

The invention relates to an inverter, notably configured to be on-board an automobile vehicle, comprising: power components configured to convert DC electrical energy into AC electrical energy so as to supply an electric motor, notably configured to drive the vehicle, a casing housing the components of the inverter and comprising a first part forming a first housing, housing said power components and a second part forming a second housing, housing filtering components configured to filter DC electrical energy supplied to the power components, notably from a battery of the vehicle,
said second casing part being formed at least in part by a set-back with respect to said first part from an outer face of the casing comprised in the first part.

A mounting base can comprise: a group of mounting areas, each mounting area of the group of mounting areas comprising: a respective mechanical connector member of a group of respective mechanical connector members for attaching to a complementary mechanical connector member on each direct-current to direct-current (DC/DC) converter unit of the group of DC/DC converter units, and a respective electrical connector of a group of respective electrical connectors for attaching to a complementary electrical connector on each DC/DC converter unit of the group of DC/DC converter units, a group of electrical conductors attached to the group of respective electrical connectors in each mounting area, and attached to a main connector on the mounting base for connecting to a high-voltage (HV) connector of a main HV supply, and a cooling channel extending in heat conducting contact with the group of mounting areas.

A vehicle includes a vehicle body, a vehicle seat, an inverter and an inverter cover. The vehicle body defines a vehicle interior. The vehicle seat is disposed on a floor of the vehicle interior. The inverter has a housing fixed to the floor of the vehicle interior at a location underneath the vehicle seat. The inverter cover is detachably attached to the inverter housing.

A power module (1) includes a group of at least three rectangular electrical power components (11, 12, 13, 14, 23, 24, 25, 26) arranged on a substrate (2), wherein in that at least one side (31) of at least one of the rectangular electrical power components (11, 14) is not orthogonal or parallel to a line (3) that passes through the geometric centres of the remaining rectangular electrical power components (12, 13) of the group.

An object of the present invention is to provide a power conversion device configured to attain suppression of heat concentration and miniaturization of the device. The power conversion device 40 includes a power module 17 for converting dc power into ac power, a first circuit substrate (power circuit substrate) 16 including a capacitor 31 for smoothing the dc power, and a casing 20 for storing the power module 17 and the first circuit substrate 16. Either the first circuit substrate 16 or the power module 17 is disposed on an inner surface 20bb of a side wall 20b having an outer wall surface 20ba of the casing 20, and the other is disposed on a predetermined inner wall surface 20a of the casing 20 to form an angle with the inner surface 20bb.

An inverter apparatus of a mobility has a structure in which a power module and a cooler are stacked so that an overall size of the inverter apparatus is reduced, and the cooler is pressed by a cover so that the cooler and the power module are in contact with each other, increasing the cooling performance of the cooler.

A power converter includes semiconductor modules, a capacitor, a circuit board, a casing, a busbar and a shield layer. The capacitor is electrically connected to the semiconductor modules. The casing accommodates the circuit board, the semiconductor modules and the capacitor. The busbar has an input terminal portion, an output terminal portion and an electric pathway connecting the input terminal portion and the output terminal portion. The electric pathway is connected to at least one of electronic components including the semiconductor modules and the capacitor. The busbar has a built-in portion incorporated into the casing. The shield layer is electrically conductive and provided on an inner surface or an outer surface of the casing such that the shield layer covers the built-in portion.

A power converter includes a semiconductor modules, a capacitor, a housing, a shield layer and a collar member. The capacitor is electrically connected to the semiconductor modules. The housing houses at least the semiconductor modules and the capacitor. The shield layer is electrically conductive and provided on and covers at least one of inner and outer surfaces of the housing. The collar member is electrically conductive and integrated with the housing. The collar member is configured to allow a fastener to be inserted through the collar member such that the housing is fixed to a vehicle-side member via the fastener. The collar member is electrically conductively joined to the shield layer.

A power semiconductor module has a substrate that has an electrically non-conductive insulating layer and a first metal layer on the insulating layer and forms conductor tracks, with power semiconductor components arranged on the first metal layer and electrically connected to the first metal layer and having a DC voltage connection device that has a first, second and third flat conductor connection element that are arranged on an end region of the power semiconductor module and that are electrically conductively connected to the first metal layer. During operation, the first and second flat conductor connection elements have a first electrical polarity and the third flat conductor connection element has a second electrical polarity.