A complex electronic component includes: an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes: first and second discharging electrodes having a gap disposed therebetween; a blocking layer disposed between the first and second discharging electrodes; and a discharging layer which is disposed to cover an upper portion of the blocking layer and is in contact with top surfaces of the first and second discharging electrodes.

A complex electronic component includes: an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes: first and second discharging electrodes having a gap disposed therebetween; a blocking layer disposed between the first and second discharging electrodes; and a discharging layer which is disposed to cover an upper portion of the blocking layer and is in contact with top surfaces of the first and second discharging electrodes.

A three dimensional (3D) multiplexer structure may include a first two dimensional (2D) inductor capacitor (LC) filter layer. The first 2D LC filter layer may include a first 2D spiral inductor and a first capacitor(s). The 3D multiplexer structure may also include a second 2D LC filter layer. The second 2D LC filter layer may include a second 2D spiral inductor and a second capacitor(s) stacked directly on and communicably coupled to the first 2D LC filter.

A three dimensional (3D) multiplexer structure may include a first two dimensional (2D) inductor capacitor (LC) filter layer. The first 2D LC filter layer may include a first 2D spiral inductor and a first capacitor(s). The 3D multiplexer structure may also include a second 2D LC filter layer. The second 2D LC filter layer may include a second 2D spiral inductor and a second capacitor(s) stacked directly on and communicably coupled to the first 2D LC filter.

A technique relates to a superconducting microwave device. A left-handed resonator include at least one unit cell. A non-linear dispersive medium is connected to the left-handed resonator, such that one end of the left-handed resonator is connected to the non-linear dispersive medium and an opposite end of the left-handed resonator is connected to a port. The left-handed resonator and the non-linear dispersive medium are configured to output a quantum signal in a squeezed state.

A technique relates to a superconducting microwave device. A left-handed resonator include at least one unit cell. A non-linear dispersive medium is connected to the left-handed resonator, such that one end of the left-handed resonator is connected to the non-linear dispersive medium and an opposite end of the left-handed resonator is connected to a port. The left-handed resonator and the non-linear dispersive medium are configured to output a quantum signal in a squeezed state.

Electronic devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a barium-strontium-titanium-tungsten-silicon oxide.

Electronic devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a barium-strontium-titanium-tungsten-silicon oxide.

A power supply converter and a method for manufacturing the same are provided. The power supply converter includes an inductance component and a power component, wherein the inductance component includes: a first magnetic substrate, provided with a first via, the first magnetic substrate including a first surface and a second surface, and a first pin being provided on the first surface; a second magnetic substrate, provided with a second via, and having a second surface provided with a second pin; an inductance coil, provided between the first surface and the second surface and having a first end and a second end formed at the vias and connected to the first and second pin, respectively; and a filling part, at least partly filling the vias, wherein the power component and the inductance component are stacked, are in contact and are coupled to each other.

A power supply converter and a method for manufacturing the same are provided. The power supply converter includes an inductance component and a power component, wherein the inductance component includes: a first magnetic substrate, provided with a first via, the first magnetic substrate including a first surface and a second surface, and a first pin being provided on the first surface; a second magnetic substrate, provided with a second via, and having a second surface provided with a second pin; an inductance coil, provided between the first surface and the second surface and having a first end and a second end formed at the vias and connected to the first and second pin, respectively; and a filling part, at least partly filling the vias, wherein the power component and the inductance component are stacked, are in contact and are coupled to each other.