Patent classifications
H05H1/00
Depositing of material by spraying precursor using supercritical fluid
Embodiments relate to surface treating a substrate, spraying precursor onto the substrate using supercritical carrier fluid, and post-treating the substrate sprayed with the precursor to form a layer with nanometer thickness of material on the substrate. A spraying assembly for spraying the precursor includes one or more spraying modules and one or more radical injectors at one or more sides of the spraying module. A differential spread mechanism is provided between the spraying module and the radical injectors to inject spread gas that isolates the sprayed precursor and radicals generated by the radical injectors. As relative movement between the substrate and the spraying assembly is made, portions of the substrate is exposed to first radicals, sprayed with precursors either one of the spraying modules or both spraying modules using supercritical carrier fluid, and then exposed to second radicals again.
Depositing of material by spraying precursor using supercritical fluid
Embodiments relate to surface treating a substrate, spraying precursor onto the substrate using supercritical carrier fluid, and post-treating the substrate sprayed with the precursor to form a layer with nanometer thickness of material on the substrate. A spraying assembly for spraying the precursor includes one or more spraying modules and one or more radical injectors at one or more sides of the spraying module. A differential spread mechanism is provided between the spraying module and the radical injectors to inject spread gas that isolates the sprayed precursor and radicals generated by the radical injectors. As relative movement between the substrate and the spraying assembly is made, portions of the substrate is exposed to first radicals, sprayed with precursors either one of the spraying modules or both spraying modules using supercritical carrier fluid, and then exposed to second radicals again.
Device for providing multiple surface treatments to three-dimensional objects prior to printing and system using the device
A surface treatment system includes a holder configured to secure an object within the holder and a surface treatment device that is configured to treat a surface of the object within the holder with two types of surface treatments. The device is capable of producing a plasma or a flame at its nozzle for surface treatment. By controlling the materials supplied to the device and the way in which is operated, either a flame or plasma is produced. Thus, the surface treatment system is capable of treating a wide range of materials for printing by a direct-to-object printer.
Damage prediction method and semiconductor processing system
[Object] To predict the damage distribution of a workpiece caused by ions and light from plasma more accurately within a practical computation time. [Solution] Provided is a damage prediction method including: using an operation apparatus to calculate, from fluxes of ions and light generated by plasma, fluxes of ions and light propagated through a pattern of a workpiece including a processing object, on the basis of the pattern; calculating, from the fluxes of ions and light propagated through the pattern, fluxes of ions and light arriving at a surface of the processing object, by ray tracing; and calculating, from the fluxes of ions and light arriving at the surface of the processing object, a damage distribution of the processing object.
CARRIER AND JIG
A carrier includes a jig and a case. The jig is configured to hold at least one consumable to be loaded into or unloaded from a container. The case is configured to store the jig and the consumable held by the jig.
Air Leak Detection In Plasma Processing Apparatus With Separation Grid
Plasma processing apparatus and associated methods for detecting air leak are provided. In one example implementation, the plasma processing apparatus can include a processing chamber to process a workpiece, a plasma chamber separated from the processing chamber by a separation grid, and an inductive coupling element to induce an oxygen plasma using a process gas in the plasma chamber. The plasma processing apparatus can detect afterglow emission strength from reaction between nitric oxide (NO) and oxygen radical(s) in a process space downstream to an oxygen plasma to measure nitrogen concentrations due to presence of air leak.
Liquid treatment device
A liquid treatment device includes a rod-shaped first electrode; a plate-shaped second electrode configured from a metal containing copper or iron; and a treatment vessel in which introduced liquid swirls, and generates a gas phase in a swirl flow of the liquid. A plasma is generated by applying a pulse voltage to the generated gas phase, and a negative DC voltage is applied between the first electrode and the second electrode serving as a cathode and an anode, respectively. Under the applied negative voltage, the plate-like second electrode generates copper ions or iron ions, and the copper or iron ions undergo Fenton's reaction with the hydrogen peroxide generated by the plasma so that liquid can be efficiently treated.
Systems and methods for lowering the reduction of iron ore energy
A method of reducing metal oxides in a plasma arc torch comprising a cathode and an anode. The method comprises collecting a set of metallic oxide ore and filtering the set of ore based on a particle size. The method further comprises preprocessing the filtered ore with the application of a heat gradient or an electric current. The preprocessed ore is mixed with a composition of reduction gases. The mixture is injected into the plasma arc torch to form a post-plasma mixture. The method further comprises collecting the post-plasma mixture and analyzing the post-plasma mixture. The method also comprises separating the post-plasma mixture into a set of slag and a set of liquid.
FLEXIBLE ION GENERATOR DEVICE
A flexible ion generator device that includes a dielectric layer having a first end, a second end, a first side, a second side, a top side, and a bottom side, at least one trace positioned on the dielectric layer and having a plurality of emitters engaged to the at least one trace. A plurality of lights disposed on the dielectric layer.
Laser surface treatment and spectroscopic analysis system
Systems, methods, and devices of the various embodiments may enable simultaneous preparation of a substrate for adhesive bonding and detection of minute contaminants on the substrate. Various embodiments may enable detection of contaminants on a surface of a substrate while the surface of the substrate is being prepared for adhesive bonding by laser ablation. Various embodiments may provide an integrated laser treatment and measurement system.