H05K7/00

Devices and accessories employing a living hinge
11606873 · 2023-03-14 · ·

A device incorporating both a magnet and a living hinge may be employed to construct cases to protect electronic devices and to function as a closure for cases and lidded containers. Such cases often can be bent three 360° allowing the cases to be either closed protecting devices therein are closed upon themselves allowing the case to function to secure an electronic device to a substrate such as an article of clothing. The devices of the disclosure can also be used to organize and hold loose items together.

Hinge configuration for an electronic device
11474560 · 2022-10-18 · ·

Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). The electronic device may also include a base portion and a lid portion coupled to the base portion at a hinge configured such that the base portion and the lid portion can rotate between an open configuration of the electronic device and a closed configuration of the electronic device. The lid portion can include at least one segment that is to raise at least a portion of the base portion in response to a rotation toward the open configuration (e.g., opening the lid portion to access a touchpad or a keyboard of the electronic device, or to see a display of the electronic device).

Electronic device

An electronic device having a novel structure is provided. A battery is provided in each component of an electronic device, whereby the electronic device includes two batteries. The electronic device including the two batteries and a display portion that can be called a flexible display and has a plurality of foldable portions is provided as a novel device.

Thermal management for head-worn computer

Aspects of the present invention relate to thermal management systems for head-worn computers.

Extractable structure for housing electronic components

The invention relates to a structure (1) for housing electronic apparatuses (10) such as boards (11) and the like, wherein the apparatuses are arranged in a container with a drawer (40) insertable and extractable with respect to a frame (20) of the structure (1). On the back wall of the drawer (40) and on the frame (20) connectors (53, 54) are provided which are coupled directly and automatically when the drawer is inserted.

Cascode power electronic device packaging method and packaging structure thereof
11476242 · 2022-10-18 · ·

The present invention provides a packaging method and a packaging structure for a cascode power electronic device, in which a hetero-multiple chip scale package is used to replace the traditional die bonding and wire bonding packaging method. The cascode power electronic device can reduce the inductance resistance and thermal resistance of the connecting wires and reduce the size of the package; and increase the switching frequency of power density. The chip scale package of the present invention uses more than one gallium nitride semiconductor die, more than one diode, and more than one metal oxide semiconductor transistor. The package structure can use TO-220, quad flat package or other shapes and sizes; the encapsulation process of the traditional epoxy molding compounds can be used in low-power applications; and the encapsulation process of ceramic material can be used in high-power applications.

System for a remote, active phase-transition cooling system utilizing a solid-state modular connector system as a method for heat-transport

An active phase change cooling system and modular connector for heat transportation consisting of: two heat exchangers, a compressor, a flow limiting orifice, a heat source surface transfer component, a heat transfer plate to deliver heat to the heat exchanger and a modular connectors bridging the gap between the heat source and the heat exchanger. Packaged in a mostly sealed environment where heat is delivered to the fluid and via directed air flow, excess heat is exhausted to the external environment.

Electronic assemblies having embedded passive heat pipes and associated method
11632854 · 2023-04-18 · ·

An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

Cage and electronic device for add-on card
11632870 · 2023-04-18 · ·

The disclosure relates to a cage and an electrical device having the same, where the cage is configured to accommodate at least one expansion card and includes a cage body, a rail, and at least one holder. The cage body is configured to accommodate the at least one expansion card. The rail is fixed on the cage body. The rail has a groove configured for an insertion of the at least one expansion card. The at least one holder is movably disposed on the cage body. Part of the at least one holder is removably located in the groove. The at least one holder is configured to block the at least one expansion card in the groove.

Functional substrates for printed electronic devices

A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.