Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Provided is a method for populating printed circuit boards, which includes the steps of acquiring jobs, in each case relating to populating printed circuit boards of a printed circuit board type on the pick-and-place line, and associated probabilities by a job is to be executed in each case, assigning printed circuit board types of the jobs to set-up families, determining for each set-up family the characteristic number which comprises the sum of probabilities of those jobs, the printed circuit board types of which are comprised by the set-up family, optimizing the assignment in such a way that the characteristic numbers of different set-up families are as different as possible, providing a set-up from one of the determined set-up families on the pick-and-place line, and populating printed circuit boards on the pick-and place line.

A temporary storage and reflow frame substrate system includes a substrate frame, a substrate loading and unloading station, a first conveying unit, and a second conveying unit. The substrate frame is suitable for loading the substrate. The substrate loading and unloading station includes a robotic arm, a feeding and discharging unit and a returning unit, the substrate frame is suitable for connecting to the feeding and discharging unit and the returning unit, the robotic arm is suitable to place the substrate into or remove the substrate from the substrate frame. The first conveying unit is connected to the feeding and discharging unit and is suitable for conveying the substrate frame. The second conveying unit is connected between the first conveying unit and the returning unit, in order to return the substrate frame to the returning unit, thereby loading and unloading the substrate at the substrate loading and unloading station.

A component mounting machine includes a board conveyance device, a component supply device, a component transfer device which includes a mounting head and a head driving mechanism, and a mounting order control device. The component mounting machine partitions a long printed circuit board of a length exceeding a mounting station into a plurality of mounting areas, sequentially positions each mounting area in the mounting station, and mounts the electronic components. The mounting order control device performs control to change the mounting order of the electronic components.

A method of surface mounting micro-devices includes adhering a first plurality of micro-devices on a donor substrate to a transfer surface with an adhesive layer, removing the first plurality of micro-devices from donor substrate while the first plurality of micro-devices remain adhered to the transfer surface, positioning the transfer surface relative to a destination substrate so that a subset of the plurality of micro-devices on the transfer surface abut a plurality of receiving positions on the destination substrate, the subset including one or more micro-devices but less than all of micro-devices of the plurality of micro-devices, selectively neutralizing one or more of regions of the adhesive layer on the transfer surface corresponding to the subset of micro-device to light to detach the subset of micro-devices from the adhesive layer, and separating the transfer surface from the destination substrate such that the subset of micro-devices remain on the destination substrate.

In embodiments, a PCB reflow process may be carried out by the components of an automated system working together to separate PCBs from reflow carriers and transport the reflow carriers back to a previous station of the PCB reflow system. The automated reflow carrier recycling system that is described herein may include a clip unlocking mechanism, a PCB pickup mechanism, a shifter, one or more lifters, and one or more overhead conveyors.

An apparatus that couples a first substrate and a second substrate of an electrowetting display panel, the apparatus comprising a first chuck provided with a first support surface and a second chuck provided with a second support surface opposite to the first support surface and positioned beneath the first chuck. The second support surface is smaller than the first support surface and is positioned in a plane parallel to a plane that includes the first support surface.

Provided is an electronic component supply system determining the types of electronic components installed on component pallets at a time when the electronic components are installed on the component pallets for installation, which determines the types of the electronic components installed on the component pallets based on planned multiple jobs continuously performed by multiple electronic component mounting machines to which the component pallets are attached and an execution order for the jobs such that the number of the component pallets exchanged during job switching is minimized.

Methods, systems, and apparatuses provide power from multiple input power sources to adjacent outputs efficiently and reliably. Aspects of the disclosure provide a power distribution unit (PDU) that includes a number of power outputs including first and second adjacent power outputs. The PDU includes a printed circuit board having a first conducting layer electrically interconnected to a first power input connection and the first power output, a second conducting layer that is at least partially above the first conducting layer and in facing relationship thereto. The second conducting layer is electrically insulated from the first conducting layer and electrically interconnected with a second power input connection and the second power output, the first and second power outputs thereby connected to different power inputs.