This patent document provides implementations and examples of circuits and devices based on low-energy consumption semiconductor structures exhibiting multi-valued states. In one aspect, a semiconductor device is configured to comprise: a multi-layer structure forming a magnetoelectric or multiferroic system to include a ferromagnetic, magnetostrictive layer that exhibits a biaxial magnetic anisotropy and an underlying metal structure exhibits a spin Hall effect to provide a conversion between electrical energy and magnetic energy with more than two distinctive magnetic states.

The present disclosure relates to a tunable magnonic crystal device comprising a spin wave waveguide, a magnonic crystal structure in or on the spin wave waveguide, and a magneto-electric cell operably connected to the magnonic crystal structure. The magnonic crystal structure is adapted for selectively filtering a spin wave spectral component of a spin wave propagating through the spin wave waveguide so as to provide a filtered spin wave. The magneto-electric cell comprises an electrode for receiving a control voltage, and adjusting the control voltage controls a spectral parameter of the spectral component of the spin wave via an interaction, dependent on the control voltage, between the magneto-electric cell and a magnetic property of the magnonic crystal structure.

A magnetoresistive effect device includes a magnetoresistive effect element first and second ports, a signal line, an inductor, and a direct current input terminal. The first port, the magnetoresistive effect element, and the second port are connected in series in this order via the signal line. The inductor is connected to one of the signal line between the magnetoresistive effect element and the first port and the signal line between the magnetoresistive effect element and the second port and is capable of being connected to ground. The direct-current input terminal is connected to the other of the above signal lines. A closed circuit including the magnetoresistive effect element, the signal line, the inductor, the ground, and direct-current input terminal is capable of being formed. The magnetoresistive effect element is arranged so that direct current flows in a direction from a magnetization fixed layer to a magnetization free layer.

According to embodiments there is provided a magneto-resistive sensor module. The sensor module may comprise: an integrated circuit; magneto-resistive sensor elements arranged as a bridge circuit monolithically integrated on the integrated circuit; and a stress buffer layer arranged between the integrated circuit and the magneto-resistive sensor element. There is also a provided a method of manufacturing the magneto-resistive sensor module.

A fabrication method of three-dimensional programmable memory includes: 1) forming a base structure; 2) trenching the base structure; 3) setting the preset memory structure layer by layer onto the inner wall of strip trench; 4) filling the core medium in the cavity of the strip trench to form core medium layer; 5) setting the isolation trenches and isolation trench holes to isolate the left-right fingers and memory units, respectively, where the isolation trenches encroach at least one memory medium layer at the strip trench, and form a curve by connecting with the strip trenches from end to end. The isolation holes are set at the strip trenches to divide the strip into at least three independent memory bodies and encroach the medium layers of the base structure near the long sides of the strip trenches; and 6) filling the isolation trenches and holes with insulating medium.

A test apparatus tests a wafer under test on which devices under test each including magnetoresistive memory or a magnetic sensor are formed. In a test process, the wafer under test is mounted on a stage. In the test process, a magnetic field application apparatus applies a magnetic field B.sub.EX to the wafer under test. A test probe card is used in the test process. Multiple magnetization detection units are formed on a diagnostic wafer. In a diagnostic process of the test apparatus, the diagnostic wafer is mounted on the stage instead of the wafer under test. Each magnetization detection unit is capable of measuring a magnetic field B.sub.EX generated by the magnetic field application apparatus. In the diagnostic process, the diagnostic probe card is used instead of the test probe card.

The test apparatus tests a wafer under test on which devices under test each including magnetoresistive memory or a magnetic sensor are formed. In a test process, the wafer under test is mounted on a stage. A test probe card is configured such that it can make probe contact with the wafer under test in the test process. A wafer connection HiFix is arranged between the test probe card and a test head. A magnetic field application apparatus is provided to the wafer connection HiFix. In the test process, the magnetic field application apparatus applies a magnetic field B.sub.EX to the wafer under test.

An apparatus including a spin to charge conversion node; and a charge to spin conversion node, wherein an input to the spin to charge conversion node produces an output at the charge to spin conversion node. An apparatus including a magnet including an input node and output node, the input node including a capacitor operable to generate magnetic response in the magnet and the output node including at least one spin to charge conversion material. A method including injecting a spin current from a first magnet; converting the spin current into a charge current operable to produce a magnetoelectric interaction with a second magnet; and changing a direction of magnetization of the second magnet in response to the magnetoelectric interaction. A method including injecting a spin current from an input node of a magnet; and converting the spin current into a charge current at an output node of the magnet.

A spin orbit torque-based spintronics device that includes a ferromagnet layer having a first surface and a second surface opposed to each other, a metal layer and a spacer layer covering the first surface and the second surface of the ferromagnet layer, respectively, and an dielectric layer covering either the metal layer or the spacer layer. Also disclosed are two related spin orbit torque-based spintronics devices and methods of using these three spintronics devices.

A skyrmion driving method that utilizes electric current to make it possible to perform driving ON-OFF control at high speed and to suppress the influence of an inertial effect so that the driving control can be performed further logically. The skyrmion is driven based on a driving amount proportional to a time-integrated value of an electric current density j(t) (Am.sup.−2) at a clock time t for a location R(t) of the skyrmion at the clock time t and on a driving amount that is in accordance with a diffusive motion due to thermal fluctuation and increases as a Gilbert attenuation constant increases.