A method of installing a vent to protect an open port of a micro-electrical mechanical system (MEMS) device, the vent being of the type comprising an environmental barrier membrane attached to a carrier and the vent further being attached to a liner, the method comprising the steps of: (a) feeding the vent to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head; (b) detaching the vent from said liner using the die ejectors; (c) picking up the vent with at least one of the vacuum head and the gripper head of the die attach machine; (d) disposing the vent over the open port of the MEMS device; and (e) securing the vent over the open port of the MEMS device.

Methods for fabricating stamps and systems for patterning a substrate, and devices resulting from those methods are provided.

A thermal regulation system includes a sensor, one or more temperature adjusting devices, and a filler provided in a space between the sensor and at least one of the one or more temperature adjusting devices. The one or more temperature adjusting devices are (1) in thermal communication with the sensor, and (2) configured to adjust a temperature of the sensor from an initial temperature to a predetermined temperature at a rate of temperature change that meets or exceeds a threshold value.

Provided are package-on-package (POP)-type semiconductor packages including a lower package having a first size and including a lower package substrate in which a lower semiconductor chip is, an upper redistribution structure on the lower package substrate and the lower semiconductor chip, and alignment marks. The packages may also include an upper package having a second size smaller than the first size and including an upper package substrate and an upper semiconductor chip. The upper package substrate may be mounted on the upper redistribution structure of the lower package and electrically connected to the lower package, and the upper semiconductor chip may be on the upper package substrate. The alignment marks may be used for identifying the upper package, and the alignment marks may be below and near outer boundaries of the upper package on the lower package.

A fluid device composite member includes: a silicone member that includes a body part which is made of silicone and which has a flow-path-defining section for defining a flow path on one surface of the body part, and that includes barrier layer having hydrophilicity or hydrophobicity disposed in at least a portion of the flow-path-defining section; and a resin substrate disposed on another surface of the body part opposite to the one surface. This method for manufacturing the fluid device composite member includes a layered body manufacturing step in which a liquid silicone material is placed on a surface of the resin substrate, and the liquid silicone material is cured at a temperature of 100° C. or less to obtain a layered body in which a silicone cured product is bonded to the resin substrate.

A system and method (referred to as the system) fabricates controllable atomic assemblies in two and three dimensions. The systems identify by a non-invasive imager, a local atomic structure, distribution of vacancies, and dopant atoms and modify, by a microscopic modifier, the local atomic structure, via electron beam irradiation. The systems store, by a knowledge base, cause-and-effect relationships based on a non-invasive imaging and electron scans. The systems detect, by detectors, changes in the local atomic structure induced by the electron irradiation; and fabricate, a modified atomic structure by a beam control software and feedback.

A method of manufacturing a microfluidic architecture having at least one channel disposed therein. Steps can include pouring an uncured polymeric material into a mould to produce a first layer; at least partially curing the first layer; and forming the at least one channel by disposing a support material on the first layer; pouring an uncured polymeric material onto the first layer to form a second layer to thereby encapsulate the support material; and at least partially curing the second layer such that the first layer and second layer together form the microfluidic architecture; wherein the support material undergoes a phase change during the process of forming the at least one channel. The phase change of the support material enables the material to be more easily disposed and/or removed after formation of the channel.

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

A method of transferring a micro device using a micro device transfer head is provided. The micro device transfer head includes a base arm, a first side arm and a second side arm, and the micro device is fabricated on a substrate. The method includes moving the first side arm within a sensing range of the micro device, charging the first side arm for drawing the micro device away from the substrate to move towards a space between the first side arm and the second side arm, and shortening a distance between the first side arm and the second side arm for clamping the micro device.

The present invention relates to a process and apparatus for the preparation of a bonded substrate. More particularly, the present invention relates to a PDMS bonding apparatus. More specifically, the present invention relates to a PDMS bonding apparatus which uses plasma to bond PDMS to a substrate.

The present invention discloses a PDMS bonding apparatus and process for using said apparatus, the apparatus comprising: a process chamber (100) forming a sealed processing space (S) for bonding of PDMS (polydimethylsiloxane); a first support (200) installed in the process chamber (100) and which supports the PDMS (1); a second support (300) installed in the process chamber (100) opposing the first support (200) and which supports a bonding object (2) which is bonded to the PDMS (1); a gas injection unit (400) which ejects process gas between the first support (200) and the second support (300), and; a plasma generator (500) which creates a plasma atmosphere within the process chamber (100).