C08G8/00

Modified novolak phenolic resin, making method, and resist composition

A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.

Modified novolak phenolic resin, making method, and resist composition

A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.

METHODS FOR PREPARING AND COLLECTING POLYAROMATIC COMPOUNDS, AND PRODUCTS COMPRISING POLYAROMATIC COMPOUNDS

Disclosed are methods for preparing and collecting a polyaromatic compound. Also disclosed are products comprising a polyaromatic compound.

METHODS FOR PREPARING AND COLLECTING POLYAROMATIC COMPOUNDS, AND PRODUCTS COMPRISING POLYAROMATIC COMPOUNDS

Disclosed are methods for preparing and collecting a polyaromatic compound. Also disclosed are products comprising a polyaromatic compound.

Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board
09765173 · 2017-09-19 · ·

There are provided a compound containing a phenolic hydroxyl group which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product, a phenolic resin including the same, a curable composition and a cured product thereof, and a semiconductor sealing material. The compound containing a phenolic hydroxyl group has a dinaphthofuran skeleton, in which each of the two naphthylene skeletons has a hydroxyl group on an aromatic nucleus thereof.

Processes for preparing calixarenes

This invention relates to a process for preparing a calixarene compound by reacting a phenolic compound and an aldehyde in the presence of at least one nitrogen-containing base as a catalyst to form the calixarene compound. The invention also relates to processes for high-yield, high solid-content production of a calixarene compound, with high selectivity toward a high-purity calix[8]arene compound, without carrying out a recrystallization step.

Preparation of polymeric resins and carbon materials

The present application is directed to methods for preparation of carbon materials. The carbon materials comprise enhanced electrochemical properties and find utility in any number of electrical devices, for example, as electrode material in ultracapacitors or batteries.

COMPOUND, RESIN, COMPOSITION AND PATTERN FORMATION METHOD
20210070727 · 2021-03-11 ·

The present invention provides a compound represented by following formula (0):

##STR00001##

Resist underlayer film forming composition

There is provided a novel resist underlayer film forming composition comprising a polymer having a repeating structural unit of formula (1a) and/or (1b): ##STR00001##
[wherein two R.sup.1s are each independently a C.sub.1-10 alkyl group, a C.sub.2-6 alkenyl group, an aromatic hydrocarbon group, a halogen atom, a nitro group, or an amino group, two R.sup.2s are each independently a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.2-6 alkenyl group, an acetal group, an acyl group, or a glycidyl group, R.sup.3 is an aromatic hydrocarbon group optionally having a substituent or a heterocyclic group, R.sup.4 is a hydrogen atom, a phenyl group, or a naphthyl group, two ks are each independently 0 or 1, m is an integer of 3 to 500, p is an integer of 3 to 500, X is a benzene ring, and two C(CH.sub.3).sub.2 groups bonded to the benzene ring are in a meta position or a para position], and a solvent.