The invention relates to a film containing a special polycarbonate or copolycarbonate of the formula (Ia), (I-2), (I-3) or (I-4) and to the use of the film in a security document and in a layer structure.

Components for articles of footwear and athletic equipment including a foam are provided. The foam portion of the components and articles include a composition which includes a thermoplastic copolyester, the composition having a foam structure. A polymer layer is provided on at least on surface of the foam portion. The polymer layer can control or reduce the water uptake of the foam portion. Methods of making the compositions, foams, and components are provided, as well as methods of making an article of footwear including one of the foam components. In some aspects, the foams and foam components can be made by injection molding, or injection molding followed by compression molding.

A resin sheet is provided having low dielectric properties, and a circuit board material using such a sheet. The resin sheet includes a resin layer containing a cyclic polyolefin resin copolymer having a crystal melting peak temperature of less than 100° C., the resin sheet having a dielectric loss tangent at 12 GHz of less than 0.005.

A molded product having both small specific gravity and high stiffness and also suffering few sink marks is described along with a method for the production thereof, where the molded product includes a porous body (A) integrated with an injection molded body (B), the porous body (A) having an apparent density of 0.05 to 0.8 g/cm.sup.3, the average thickness (tA) of the porous body (A) and the average thickness (tB) of the injection molded body (B) satisfying the relation tA≥3×tB, and the injection molded body (B) covering at least one face of the porous body (A).

A method for producing a molding compound having improved surface properties is provided. The method relates to, in particular, a molding compound comprising a polycarbonate and at least one reinforcing filler, preferably selected from the group including titanium dioxide (TiO.sub.2), talc (Mg.sub.3Si.sub.4O.sub.10(OH).sub.2), dolomite CaMg[CO.sub.3].sub.2, kaolinite Al.sub.4[(OH).sub.8|Si.sub.4O.sub.10] and wollastonite Ca.sub.3[Si.sub.3O.sub.9], preferably selected from the group including titanium dioxide (TiO.sub.2) and talc (Mg.sub.3Si.sub.4O.sub.10(OH).sub.2). The total amount of reinforcing filler is 3 to 20 wt. %, preferably 4.5 to 15 wt. %, each relative to the total mass of the molding compound, the molding compound having improved properties being produced using at least one master batch produced according to the method.

The use of a composition including a mixture of at least one non-reactive thermoplastic polymer of Tg >40° C., especially >100° C., in particular >120° C., and at least one reactive thermoplastic prepolymer, with a fibrous material, for the preparation of a fibrous material impregnated with the composition, the composition having an initial melt viscosity during the impregnation, as measured in plate-plate rheology under 1 Hz and 2% strain, at a temperature of 300° C., of less than the viscosity of the same composition devoid of reactive prepolymer, measured under the same conditions, and/or a ductility, after in situ polymerization of the reactive thermoplastic prepolymer in the composition during the impregnation and after the impregnation, that is at least equivalent to the ductility of the same composition devoid of non-reactive thermoplastic polymer, and of which said reactive thermoplastic prepolymer is polymerized to the same number-average molecular mass (Mn).

Embodiments of the present disclosure generally relate to housings for, e.g., memory devices and electronic devices, and to processes for forming such housings. In an embodiment, an article for housing at least a portion of an electronic device is provided. The article includes a first component comprising a thermoplastic and a biodegradable filler or polymer, and a second component disposed on at least a portion of the first component, the second component comprising a plurality of layers. The article has a scratch visibility load of about 200 gms or more, an electrostatic discharge static voltage of about 100 V or less, a thermal conductivity of about 0.28 W/mK or more, or combinations thereof.

Polymers are disclosed that incorporate portions of secondary or tertiary polyamide segments connected with polyisocyanates. These polymers have enhanced matting properties. The enhanced matting properties are from creating an inherently matt surface from the polymer without the use of any separate fine particle size matting additives. Conventional matting agents such as fine particle size silica usually results in loss of physical properties such as haze development and porosity in the coating from the matting agent. Composites and hybrids of these polymers and other polyamides, polyurethane with vinyl polymers (acrylates) are also disclosed and claimed.

A glass fiber reinforced polycarbonate composite material, a preparation method and an application thereof; the material includes the following components: component A: 40 parts to 90 parts of a polycarbonate; component B: 1.5 parts to 50 parts of a polysiloxane block copolymer; component C: 5 parts to 60 parts of a glass fiber; component D: 0.1 parts to 30 parts of a phosphorus-containing compound; and component E: 0.01 parts to 30 parts of a polyolefin compound.

A transparent static-dissipative polycarbonate (PC) resin composition includes the following components: 70-95 parts by weight of PC resin, 5-30 parts by weight of antistatic agent masterbatch and 0.5-1.5 parts by weight of a transesterification inhibitor. The antistatic agent masterbatch includes the following components by mass percentage: 40-60% of an antistatic agent, 0.5-1.6% of a transesterification accelerator, 1-3% of an assistant cross-linkinger, and the balance of PC resin. A method for preparing the transparent static-dissipative PC resin composition includes the following steps: (I) preparing the components of the transparent static-dissipative PC resin composition according to the formulation, and mixing the components evenly to obtain a premix; and (II) adding the premix into a twin-screw extruder, melting, extruding, cooling and pelletizing, to obtain a target product.