C09D185/00

RESIN COMPOSITION FOR HARD COATING, AND HARD-COATING FILM COMPRISING CURED FORM OF SAME AS COATING LAYER

This invention relates to a resin composition for a hard coating, including a siloxane resin configured such that compounds including an alkoxysilane and an alkoxy metal compound are chemically bound, and to a hard coating film including a hard coating layer formed using the resin composition.

RESIN COMPOSITION FOR HARD COATING, AND HARD-COATING FILM COMPRISING CURED FORM OF SAME AS COATING LAYER

This invention relates to a resin composition for a hard coating, including a siloxane resin configured such that compounds including an alkoxysilane and an alkoxy metal compound are chemically bound, and to a hard coating film including a hard coating layer formed using the resin composition.

Light- or heat-curing method and curable resin composition

An object of the present invention is to provide a light- or heat-curing method by which a cured product (crosslinked product or resin) can be prepared in a simple method even in a case where filler is contained in a large amount; a curable resin composition which is used in the curing method; and the like. The present invention provides a light- or heat-curing method containing a step 1 of obtaining (E) a condensate having constitutional units of Si—O—Al and/or Si—O—Si, obtained from aluminum derived from an aluminum alkoxide and a silane derived from a silane coupling agent having a mercapto group, from (A) a compound that is formed of a salt of a carboxylic acid and an amine and has a carbonyl group generating a radical and a carboxylate group generating a base through decarboxylation by irradiation with light or heating, the (B) aluminum alkoxide, the (C) silane coupling agent having a mercapto group, and (D) water, and a step 2 of performing a reaction among the (E) condensate, (H) a compound having two or more polymerizable unsaturated groups, and (I) filler under the conditions of irradiation with light or heating in the presence of the (A) compound; a curable resin composition which is used in the curing method; and the like.

Light- or heat-curing method and curable resin composition

An object of the present invention is to provide a light- or heat-curing method by which a cured product (crosslinked product or resin) can be prepared in a simple method even in a case where filler is contained in a large amount; a curable resin composition which is used in the curing method; and the like. The present invention provides a light- or heat-curing method containing a step 1 of obtaining (E) a condensate having constitutional units of Si—O—Al and/or Si—O—Si, obtained from aluminum derived from an aluminum alkoxide and a silane derived from a silane coupling agent having a mercapto group, from (A) a compound that is formed of a salt of a carboxylic acid and an amine and has a carbonyl group generating a radical and a carboxylate group generating a base through decarboxylation by irradiation with light or heating, the (B) aluminum alkoxide, the (C) silane coupling agent having a mercapto group, and (D) water, and a step 2 of performing a reaction among the (E) condensate, (H) a compound having two or more polymerizable unsaturated groups, and (I) filler under the conditions of irradiation with light or heating in the presence of the (A) compound; a curable resin composition which is used in the curing method; and the like.

Nonaqueous sol-gel for adhesion enhancement of water-sensitive materials

The present disclosure provides methods for forming sol-gels, sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one method of forming a sol-gel includes mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture. The method includes mixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture.

DISPERSION

A dispersion containing a fluorine-containing polymer and a liquid medium. The fluorine-containing polymer includes a repeating unit derived from a fluorine-containing monomer (a) having a Q value of 2.0 or more and comprising a fluoroalkyl group, and a repeating unit derived from a chloride monomer (b) that is at least one selected from vinyl chloride and vinylidene chloride. Further, the dispersion has a concentration of unreacted chloride monomer (b) of 2.0 ppm or less.

DISPERSION

A dispersion containing a fluorine-containing polymer and a liquid medium. The fluorine-containing polymer includes a repeating unit derived from a fluorine-containing monomer (a) having a Q value of 2.0 or more and comprising a fluoroalkyl group, and a repeating unit derived from a chloride monomer (b) that is at least one selected from vinyl chloride and vinylidene chloride. Further, the dispersion has a concentration of unreacted chloride monomer (b) of 2.0 ppm or less.

Nonaqueous sol-gel for adhesion enhancement of water-sensitive materials

The present disclosure provides methods for forming sol-gels, sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one method of forming a sol-gel includes mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture. The method includes mixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture.

NONAQUEOUS SOL-GEL FOR ADHESION ENHANCEMENT OF WATER-SENSITIVE MATERIALS
20230033110 · 2023-02-02 ·

The present disclosure provides methods for forming sol-gels, sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one method of forming a sol-gel includes mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture. The method includes mixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture.

INORGANIC SOLID OBJECT PATTERN MANUFACTURING METHOD AND INORGANIC SOLID OBJECT PATTERN

A method of producing an inorganic solid pattern is described that includes: a step of coating an inorganic solid with a composition containing a polymetalloxane and an organic solvent; a step of heating the coating film obtained in the coating step, at a temperature of 100° C. or more and 1000° C. or less to form a heat-treated film; a step of forming a pattern of the heat-treated film; and a step of patterning the inorganic solid by etching using the pattern of the heat-treated film as a mask.