A water-dispersed pressure-sensitive adhesive composition of the present invention includes a water-dispersible polymer, a carboxylic acid copolymer thickener, a polyacrylic acid thickener, and water. A ratio of the carboxylic acid copolymer thickener in the solid content of the water-dispersed pressure-sensitive adhesive composition is 0.1% by mass or more and 1.5% by mass or less. A ratio of the polyacrylic acid thickener in the solid content of the adhesive composition is 1% by mass or more and 3.7% by mass or less. A pressure-sensitive adhesive sheet of the present invention has a pressure-sensitive adhesive layer formed from the water-dispersed pressure-sensitive adhesive composition.

A water-dispersed pressure-sensitive adhesive composition of the present invention includes a water-dispersible polymer, a carboxylic acid copolymer thickener, a polyacrylic acid thickener, and water. A ratio of the carboxylic acid copolymer thickener in the solid content of the water-dispersed pressure-sensitive adhesive composition is 0.1% by mass or more and 1.5% by mass or less. A ratio of the polyacrylic acid thickener in the solid content of the adhesive composition is 1% by mass or more and 3.7% by mass or less. A pressure-sensitive adhesive sheet of the present invention has a pressure-sensitive adhesive layer formed from the water-dispersed pressure-sensitive adhesive composition.

Provided is a coating for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

A multicomponent adhesive composition comprises a composition A and a composition B. Composition A comprises at least one silyl polymer comprising at least one hydrolyzable alkoxysilane group and at least one tackifying resin. Composition B comprises at least one catalyst and at least one compound C chosen from a compound C1 with a number-average molecular mass ranging from 300 g/mol to 500 000 g/mol; and a compound C2 with a vapor pressure at 20° C. of greater than or equal to 0.08 kPa; and mixtures thereof. The composition A:composition B mass ratio ranges from 99.98:0.02 to 60:40. The total content of catalyst ranges from 0.01% to 10% relative to the total weight of said adhesive composition.

The present invention relates to a battery pack to which a thin-film label can be easily attached, and a label attaching method thereof. Disclosed in one embodiment is a battery pack comprising: a battery cell having an electrode assembly accommodated in a case; and an external film, which has a label attached to at least one surface of the case and directly attached to the case, a step difference compensation tape attached to the upper surface of the label and positioned on one side of the label, and a protective film attached to the upper surface of the label and extending to the upper part of the step difference compensation tape, wherein the protective film is attached so as to be detachable from the label.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

The invention relates to a sealant antifog composition for polyester films comprising anionic and non-ionic surfactants in a mixture of amorphous and (semi)crystalline polyesters. The invention also relates to a multi-layer film comprising a sealant layer having the above composition, to the use of said films in food packaging and to the packages obtained therefrom.

The invention relates to a sealant antifog composition for polyester films comprising anionic and non-ionic surfactants in a mixture of amorphous and (semi)crystalline polyesters. The invention also relates to a multi-layer film comprising a sealant layer having the above composition, to the use of said films in food packaging and to the packages obtained therefrom.

An adhesive composition and a polarizing plate including an adhesive layer formed using the same are disclosed herein. In some embodiments, an adhesive composition includes 3-ethyl-3-(2-ethylhexyloxy)methyloxetane, 3-ethyl-3-hydroxymethyloxetane, 3,3′-oxybis(methylene)bis(3-ethyloxetane), an acryl-based compound, an aromatic epoxy compound, and an alicyclic epoxy compound, wherein the 3-ethyl-3-(2-ethylhexyloxy)methyloxetane is present in an amount of 20 parts by weight to 40 parts by weight, the 3-ethyl-3-hydroxymethyloxetane is present in 2 parts by weight to 8 parts by weight, the 3,3′-oxybis(methylene)bis(3-ethyloxetane) is present in 2 parts by weight to 8 parts by weight, the acryl-based compound is present in 5 parts by weight to 20 parts by weight, the aromatic epoxy compound is present in 7 parts by weight to 40 parts by weight, and the alicyclic epoxy compound is present in 10 parts by weight to 50 parts by weight, based on 100 parts by weight of the adhesive composition.