A laminate structure comprising a tape and a molded component is provided. The tape comprises a substrate having a first surface and an opposing second surface, wherein a first adhesive coating is disposed on the first surface of the substrate. The molded component is positioned adjacent and bonded to the first adhesive coating of the tape, wherein the molded component includes a polymer composition that contains a liquid crystalline polymer. The peel strength between the tape and the molded component is about 0.55 pounds-force per inch more as determined in accordance with ASTM D3167-10 (2017).

The present invention aims to provide an adhesive tape for semiconductor device production which exhibits excellent chip component separability and can reduce adhesive deposits on chip components. Provided is an adhesive tape for semiconductor device production, including: a substrate; an ablation layer; a barrier layer; and a first adhesive layer in this order.

Provided is a process for producing a surface-metalized polymer article, comprising: (a) preparing a graphene dispersion comprising multiple graphene sheets and an optional conductive filler dispersed in a first liquid medium, which is an adhesive monomer or contains a liquid adhesive monomer, oligomer or polymer dissolved in a solvent; (b) bringing a polymer article into a graphene deposition zone, wherein the graphene dispersion is sprayed, painted, coated, cast, or printed to deposit graphene sheets and optional conductive filler to a surface of the polymer article; and (c) moving the graphene-coated polymer article into a metallization chamber which accommodates a plating solution therein for plating a layer of a desired metal onto the graphene-coated polymer article to obtain a surface-metalized polymer article and retreating the surface-metalized polymer article from the metallization chamber.