Disclosed is a stainless steel having excellent surface electrical conductivity for a fuel cell separator. According to an embodiment of the disclosed stainless steel having excellent surface electrical conductivity for a fuel cell separator, a value of the following surface oxide atomic ratio (1) may be 0.5 or less, as measured on the surface of a stainless steel containing 15 wt % or more of Cr by X-ray angle-resolved photoemission spectroscopy using an Al-Kα X-ray source under the condition where a take-off angle of photoelectrons is from 12° to 85°.

[00001]$\begin{array}{cc}\frac{\begin{array}{c}\mathrm{sum}\mathrm{of}\mathrm{atomic}\mathrm{concentrations}\left(\mathrm{at}\%\right)\\ \mathrm{of}\mathrm{metal}\mathrm{elements}\mathrm{in}\mathrm{metal}\mathrm{oxide}\left(\mathrm{MO}\right)\end{array}}{\begin{array}{c}\mathrm{sum}\mathrm{of}\mathrm{atomic}\mathrm{concentrations}\left(\mathrm{at}\%\right)\\ \mathrm{of}\mathrm{metal}\mathrm{elements}\mathrm{in}\mathrm{total}\mathrm{oxides}\mathrm{and}\mathrm{hydroxides}\end{array}}& \left(1\right)\end{array}$

The metal oxide (MO) includes a mixed oxide: M represents an alloying element other than Cr and Fe or a combination thereof in the matrix; and O represents oxygen. The total oxides and hydroxides include a Cr oxide, a Cr hydroxide, an Fe oxide, an Fe hydroxide, and the metal oxide (MO).

The present invention relates to systems and methods for cleaning materials, such as flooring and upholstery. In some cases, the systems and methods use an electrolytic cell to electrolyze a solution comprising sodium carbonate, sodium bicarbonate, sodium acetate, sodium percarbonate, potassium carbonate, potassium bicarbonate, and/or any other suitable chemical to generate electrolyzed alkaline water and/or electrolyzed oxidizing water. In some cases, the cell comprises a recirculation loop that recirculates anolyte through an anode compartment of the cell. In some cases, the cell further comprises a senor and a processor, where the processor is configured to automatically change an operation of the cell, based on a reading from the sensor. In some cases, a fluid flows past a magnet before entering the cell.

In some additional cases, fluid from the cell is conditioned by being split into multiple conduits that run in proximity to each other. Additional implementations are described.

The present invention relates to systems and methods for cleaning materials, such as flooring and upholstery. In some cases, the systems and methods use an electrolytic cell to electrolyze a solution comprising sodium carbonate, sodium bicarbonate, sodium acetate, sodium percarbonate, potassium carbonate, potassium bicarbonate, and/or any other suitable chemical to generate electrolyzed alkaline water and/or electrolyzed oxidizing water. In some cases, the cell comprises a recirculation loop that recirculates anolyte through an anode compartment of the cell. In some cases, the cell further comprises a senor and a processor, where the processor is configured to automatically change an operation of the cell, based on a reading from the sensor. In some cases, a fluid flows past a magnet before entering the cell.

In some additional cases, fluid from the cell is conditioned by being split into multiple conduits that run in proximity to each other. Additional implementations are described.

Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. The front surface of the cleaning disk includes a corrosion resistant conductive material to form electrical connections to deposits on the cup's surfaces. The disk is sealed in the cup and submerged into a plating solution. A reverse current is then applied to the front conductive surface of the disk to initiate deplating of the deposits. Sealing compression in the cup may change during cleaning to cause different deformation of the lip seal and to form new electrical connections to the deposits. The proposed cleaning may be applied to remove deposits formed during electroplating of alloys, in particular, tin-silver alloys widely used for semiconductor and wafer level packaging.

Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. The front surface of the cleaning disk includes a corrosion resistant conductive material to form electrical connections to deposits on the cup's surfaces. The disk is sealed in the cup and submerged into a plating solution. A reverse current is then applied to the front conductive surface of the disk to initiate deplating of the deposits. Sealing compression in the cup may change during cleaning to cause different deformation of the lip seal and to form new electrical connections to the deposits. The proposed cleaning may be applied to remove deposits formed during electroplating of alloys, in particular, tin-silver alloys widely used for semiconductor and wafer level packaging.

The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.

A method for investigating an electrolyte solution for processing a component, particularly a component or a component material of an aircraft engine, by near infrared spectroscopy.

A silver-plated product having a higher hardness and more excellent wear resistance than those of conventional silver-plated products, and a method for producing the same. In a method for producing a silver-plated product by forming a surface layer of silver on a base material by electroplating at a current density in a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzimidazole (such as 2-mercaptobenzmimidazole or 2-mercaptobenzimidazole sulfonic acid sodium salt dihydrate), the ratios of the concentrations of silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and the imidazole to the current density during the silver-plating (or the ratios of the concentrations of silver potassium cyanide or silver cyanide and the imidazole to the current density during the silver plating, and the concentration of potassium cyanide or sodium cyanide) are set to be predetermined ranges, respectively.

Devices for eliminating radioactive contamination of radioactive waste by providing adaptive processing of the decontamination solution for reuse. The plant for electrochemical decontamination of metal radioactive waste includes a pipe equipped with shut-off valves, a radioactive waste processing module that comprises a unit for electrochemical decontamination connected by a ventilation channel to the ventilation module and pipe for decontamination solution supply and discharge equipped with shut-off valves. The plant is equipped with a decontamination solution preparation module connected with a pipe for decontamination solution supply and discharge, at least one pump, while the module for decontamination solution receiving is equipped with devices for cleaning and pH correction of decontamination solution, and the unit for electrochemical decontamination of metal radioactive waste, the module for decontamination solution receiving and the decontamination solution preparation module are equipped with pH measurement elements.

A silver-plated product which has more excellent minute sliding abrasion resistance property than that of conventional silver-plated products, and a method for producing the same. The silver-plated product is produced by electroplating a base material 10 of copper or a copper alloy to form an underlying plating layer 12 of nickel or a nickel alloy, a first silver-plating layer of silver (lower silver-plating layer) 14, a zinc-plating layer 16 of zinc serving as an intermediate plating layer, and a second silver-plating layer of silver (upper silver-plating layer) 18 serving as a surface layer, in this order from the base material 10.