A load control device may include a semiconductor switch, a control circuit, and first and second terminals adapted to be coupled to a remote device. The load control device may include a first switching circuit coupled to the second terminal, and a second switching circuit coupled between the first terminal and the second terminal. The control circuit may be configured to render the first switching circuit conductive to conduct a charging current from an AC power source to a power supply of the remote device during a first time period of a half-cycle of the AC power source, and further configured to render the first and second switching circuits conductive and non-conductive to communicate with the remote device via the second terminal during a second time period of the half-cycle of the AC power source.

Methods of operating a memory device are disclosed. A method may include receiving a write command, and in response to the write command, performing a write operation without precharging a local input/output line subsequent to receipt of the write command and prior to performing the write operation. Another method may include receiving a read command, performing a read operation in response to the read command, and receiving an additional command without precharging the local input/output line subsequent to performing the read operation and prior to receiving the additional command. Memory devices and systems are also disclosed.

A memory device can comprise an array of memory cells comprising a plurality of vertically stacked tiers of memory cells, a respective plurality of horizontal access lines coupled to each of the plurality of tiers, and a plurality of vertical sense lines coupled to each of the plurality of tiers. The array of memory cells can further comprise a plurality of multiplexors each coupled to a respective vertical sense line and configured to electrically couple the respective vertical sense line to a horizontal sense line. The memory device can also comprise a semiconductor under the array (SuA) circuitry, comprising a plurality of sense amplifiers, each sense amplifier coupled to a respective subset of the plurality of multiplexors.

Some embodiments include an integrated assembly having digit lines supported by a base and extending along a first direction. A shield-connection-line is supported by the base and extends along the first direction. Transistor active regions are over the digit lines. Each of the active regions includes a channel region between an upper source/drain region and a lower source/drain region. The lower source/drain regions are coupled with the digit lines. Capacitors are coupled with the upper source/drain regions. Wordlines extend along a second direction which crosses the first direction. The wordlines include gate regions adjacent the channel regions. Shield lines extend along the second direction. The shield lines are above the digit lines and are coupled with the shield-connection-line.

Methods of operating a memory device are disclosed. A method may include receiving a write command, and in response to the write command, performing a write operation without precharging a local input/output line subsequent to receipt of the write command and prior to performing the write operation. Another method may include receiving a read command, performing a read operation in response to the read command, and receiving an additional command without precharging the local input/output line subsequent to performing the read operation and prior to receiving the additional command. Memory devices and systems are also disclosed.

A data storage circuit for storing data from volatile memory in response to a power loss, the data storage circuit including an input for receiving a power loss signal in response to a power loss from at least one power source, an input configured to receive data from a volatile memory, a single block of non-volatile matrix of memory cells and a driver circuit coupled to said single row of non-volatile matrix of memory cells. The driver circuit is configured to write data to and read data from said single block of non-volatile matrix of memory cells. The single block of non-volatile matrix of memory cells can be provided as a single row electrically erasable programmable read only memory (EEPROM).

Some embodiments include an integrated assembly having digit lines supported by a base and extending along a first direction. A shield-connection-line is supported by the base and extends along the first direction. Transistor active regions are over the digit lines. Each of the active regions includes a channel region between an upper source/drain region and a lower source/drain region. The lower source/drain regions are coupled with the digit lines. Capacitors are coupled with the upper source/drain regions. Wordlines extend along a second direction which crosses the first direction. The wordlines include gate regions adjacent the channel regions. Shield lines extend along the second direction. The shield lines are above the digit lines and are coupled with the shield-connection-line.

According to certain aspects, a memory subsystem is coupled to a memory controller of a host computer system via an interface. The memory subsystem comprises dynamic random access memory elements and a memory subsystem controller. During a normal memory read or write operation, the memory subsystem controller is configured to receive address and command signals associated with the memory read or write operations and to control the dynamic random access memory elements in accordance with the address and command signals. The memory subsystem controller is further configured to output via the open drain output a parity error signal in response to a parity error having occurred during the memory read or write operation. During an initialization operation, the memory subsystem controller is configured to output via the open train output a signal related to one or more parts of initialization operation sequences.

A memory device may include a memory cell array including a plurality of memory cells, and an internal operation circuit configured to perform a test operation in a test mode using a parallel bit operation of simultaneously comparing a plurality of bits and also perform an internal operation including a comparison operation with respect to external data in a normal mode other than the test mode using the parallel bit operation.

A load control device may include a semiconductor switch, a control circuit, and first and second terminals adapted to be coupled to a remote device. The load control device may include a first switching circuit coupled to the second terminal, and a second switching circuit coupled between the first terminal and the second terminal. The control circuit may be configured to render the first switching circuit conductive to conduct a charging current from an AC power source to a power supply of the remote device during a first time period of a half-cycle of the AC power source, and further configured to render the first and second switching circuits conductive and non-conductive to communicate with the remote device via the second terminal during a second time period of the half-cycle of the AC power source.