H01L2221/00

CONDUCTIVE TEST PROBE
20180003738 · 2018-01-04 · ·

A conductive probe may include a probe body for communicating with a circuit tester or a jumper. The probe body may be formed of metal and may have a free end. A probe tip may be mounted to the end of the probe body. The probe tip may be formed of thorium-tungsten. The probe tip may be configured for contacting a circuit node.

MEMS COMPONENT HAVING A HIGH INTEGRATION DENSITY
20180013055 · 2018-01-11 ·

A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.

Electromigration testing of interconnect analogues having bottom-connected sensory pins

A system for electromigration testing is disclosed. The system includes a conductive member, a cap layer of insulative material over at least a portion of a top surface of the conductive member, a cathode conductively connected to a first end of the conductive member; an anode conductively connected to a second end of the conductive member, and a current source conductively connected to the cathode and the anode. A plurality of sensory pins are disposed along a length of the conductive member between the first end and the second end of the conductive member. The sensory pins are conductively connected to a bottom surface of the conductive member. At least one measurement device is conductively connected to at least one sensory pin of the plurality of sensory pins. The at least one measurement device determines a resistance of at least one portion of the conductive member.

CONTACTLESS READABLE PROGRAMMABLE TRANSPONDER TO MONITOR CHIP JOIN

A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

Static electricity distribution measuring apparatus and static electricity distribution measuring method

A static electricity distribution measuring apparatus (1) according to the present disclosure measures the static electricity distribution on a measurement surface of a measurement target (200), and is provided with: an array antenna (2) that receives electric fields generated from each of a plurality of areas (211) on the measurement surface through vibration; a vibrator (3) that vibrates the measurement target (200) or the array antenna (2); a measurer (4) that measures at least one from among intensity, frequency and phase of the electric fields in each of the plurality of areas (211) received by the array antenna (2); a calculator (5) that calculates an amount of static electricity for each of the plurality of areas (211) based on measurement results by the measurer (4); and a drawer (6) that draws the static electricity distribution on the measurement surface based on the amount of static electricity in each of the plurality of areas (211). The array antenna (2) has a plurality of antenna elements (21) respectively corresponding to the plurality of areas (211).

Magnetic sensor and magnetic encoder

A magnetic sensor is provided with first and second magnetoresistive effect elements that can detect an external magnetic field. The first and second magnetoresistive effect elements include at least magnetization direction change layers where a direction of magnetization is changed according to an external magnetic field. The width W1 of a magnetization direction change layer in an initial magnetization direction of the magnetization direction change layer of the first magnetoresistive effect element, and the width W2 of a magnetization direction change layer in an initial magnetization direction of the magnetization direction change layer of the second magnetoresistive effect element have a relationship shown by formula (1) below. Sensitivity of the first magnetoresistive effect element to the external magnetic field is higher than that of the second magnetoresistive effect element.
W1>W2  (1)

PROBE CARD HAVING REPLACEABLE PROBE MODULE AND ASSEMBLING METHOD AND PROBE MODULE REPLACING METHOD OF THE SAME
20170315149 · 2017-11-02 ·

A probe card includes a substrate module having an installation hole and a first stair-shaped structure provided on two stairs thereof with a first connection surface and a first transmission surface having a first contact pad, a probe module having a probe and a second stair-shaped structure provided on two stairs thereof with a second connection surface and a second transmission surface having a second contact pad electrically connected with the probe, and a pressing member. The probe module is disposed in the installation hole so that the first and second connection surfaces are connected and the first and second transmission surfaces are opposite. The pressing member is detachably pressed on the probe module to press the second connection surface against the first connection surface and make the first and second contact pads electrically connected.

Alloy material, contact probe, and connection terminal

An alloy material includes: a composition containing 17 at % to 25 at % of silver (Ag), 30 at % to 45 at % of palladium (Pd), and 30 at % to 53 at % of copper (Cu) in a composition range of a ternary alloy of Ag, Pd, and Cu; and at least one of manganese (Mn), tin (Sn), silicon (Si), antimony (Sb), titanium (Ti) and magnesium (Mg) added to the composition in a range of 4.5 at % or less, and the Mn in a range of 0.5 at % to 3.5 at %, the Sn in a range of 1 at % to 2 at %, the Si in a range of 0.5 at % to 2 at %, the Sb in a range of 0.5 at % to 3 at %, the Ti in a range of 0.5 at % to 2 at %, and the Mg in a range of 0.5 at % to 3.5 at % are added to the composition.

CURRENT DETECTING DEVICE AND CURRENT DETECTING RESISTOR
20170307658 · 2017-10-26 · ·

Provided is a current detecting device comprising a current detecting resistor including a pair of electrodes and a resistive element; a pair of lands on which the current detecting resistor is adapted to be mounted; connection portions adapted to connect the two electrodes and the two lands, respectively; and a pair of wires connected to the two respective electrodes and adapted to detect a voltage. Positions where the two wires are connected to the two respective electrodes are located in regions on a further inner side than inner ends of the connection portions.

METHOD FOR FOREIGN OBJECT DETECTION FOR AN INDUCTION CHARGING DEVICE AND INDUCTION CHARGING DEVICE
20170302111 · 2017-10-19 · ·

A method for foreign object detection for an induction charging device is described, including an oscillator circuit, in particular, for a hand-held power tool, a resonance frequency and an associated actual quality of the oscillator circuit being detected and the actual quality is subsequently compared to a setpoint quality as a function of the resonance frequency and a decision is made about the presence of a foreign object based on a defined setpoint quality range. The method provides that an upper limit and/or a lower limit of the setpoint quality range and the profile of the actual quality are adapted to one another. Also described is an induction charging device including an oscillator circuit and a control and regulating unit for carrying out the method.