A wiring substrate includes a first metal plate and a second electrode. The first metal plate includes a first electrode, a wiring, and a mount portion for an electronic component. The mount portion includes an upper surface of the wiring. The second electrode is joined to an upper surface of the first electrode. The first electrode is solid. The second electrode is solid.

A semiconductor device is provided, which includes a semiconductor chip; a first current input/output portion that is electrically connected to the semiconductor chip; a second current input/output portion that is electrically connected to the semiconductor chip; three or more conducting portions provided with the semiconductor chip, between the first current input/output portion and the second current input/output portion; and a current path portion having a path through which current is conducted to each of the three or more conducting portions, wherein the current path portion includes a plurality of slits.

A device package and a method of forming a device package are described. The device package includes a dielectric on a conductive pad, and a first via on a first seed on a top surface of the conductive pad. The device package further includes a conductive trace on the dielectric, and a second via on a second seed layer on the dielectric. The conductive trace connects to the first via and the second via, where the second via connects to an edge of the conductive trace opposite from the first via. The dielectric may include a photoimageable dielectric or a buildup film. The device package may also include a seed on the dielectric prior to the conductive trace on the dielectric, and a second dielectric on the dielectric, the conductive trace, and the first and second vias, where the second dielectric exposes a top surface of the second via.

An electronic device includes one or more multinode pads having two or more conductive segments spaced from one another on a semiconductor die. A conductive stud bump is selectively formed on portions of the first and second conductive segments to program circuitry of the semiconductor die or to couple a supply circuit to a load circuit. The multinode pad can be coupled to a programming circuit in the semiconductor die to allow programming a programmable circuit of the semiconductor die during packaging. The multinode pad has respective conductive segments coupled to the supply circuit and the load circuit to allow current consumption or other measurements during wafer probe testing in which the first and second conductive segments are separately probed prior to stud bump formation.

A group of contact pads (20EB) formed on a lower surface (20B) at a connection end of a board portion of an optical module board (20) includes, in order from the endmost end, a contact pad (20B1) conducting to a ground line (G), contact pads (20B2) and (20B3) conducting to transmission-side high-speed signal lines (S), a contact pad (20B4) conducting to the ground line (G), contact pads (20B5, 20B6, and 20B7) conducting to low-speed signal lines (S), a contact pad (20B8) conducting to the ground line (G), contact pads (20B9 and 20B10) conducting to receiving-side high-speed signal lines (S), and a contact pad (20B11) conducting to the ground line (G). Fixed terminal portions of a plurality of contact terminals (32ai) connected to the contact pads (20B2 and 20B3) conducting to the transmission-side high-speed signal lines (S) and the contact pads (20B9 and 20B10) conducting to the receiving-side high-speed signal lines (S) in a host connector (30) are electrically connected to conductive paths (16THL, 16RHL), which are continuous with high-speed signal lines formed on a plane shared with electrode portions (16BE2, 16BE3, 16BE9, and 16BE10) via the electrode portions (16BE2, 16BE3, 16BE9, and 16BE10) of a printed wiring board (16).

A cartomizer assembly of an electronic cigarette which is formed from automated assembly compatible parts comprises a container assembly including a container and a heater coil surrounding a wick in an airflow space of the container. The entire coil of the heater coil is inside the container and the heater coil is configured to heat liquid on the wick to generate an aerosol mist during a vaporization process. A liquid storage space is in liquid communication with the wick and is operable to supply liquid to the wick. The heater, the wick, and the container are shaped such that the heater and wick can be dropped into the container during automated assembly thereof and be directed to and located at a desired location in the container.

A lead frame is made of conductive material, and includes an interconnecting web portion and a plurality of unit lead frames. Each unit lead frame includes a die pad and a plurality of leads. The die pad has a die-attach section disposed below an upper surface of the interconnecting web portion, and a plurality of extension sections bent at an angle from a periphery of the die-attach section and projecting to the interconnecting web portion. The die pad is formed with a plurality of grooves formed at an underside of junctions of the die-attach section and the extension sections. The leads extend from the interconnecting web portion toward and are spaced apart from the die pad.

The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.

According to one aspect, embodiments of the invention provide a system for monitoring a load center including a plurality of current sensors, a communication bus, a plurality of sensor circuits, a power module configured to be coupled to a load center input line and to receive input AC power from the input line, a collector, and a cable configured to be coupled between the power module and the collector, wherein the power module is further configured to provide power to the plurality of sensor circuits via the communication bus, provide power to the collector via the cable, measure at least one of voltage, frequency and phase of input AC power and provide signals related to the measured voltage, frequency or phase to the collector via the cable, receive current measurement signals from the plurality of sensor circuits and provide the received current measurement signals to the collector via the cable.

According to one aspect, embodiments of the invention provide a system for monitoring a load center including a plurality of current sensors, a communication bus, a plurality of sensor circuits, a power module configured to be coupled to a load center input line and to receive input AC power from the input line, a collector, and a cable configured to be coupled between the power module and the collector, wherein the power module is further configured to provide power to the plurality of sensor circuits via the communication bus, provide power to the collector via the cable, measure at least one of voltage, frequency and phase of input AC power and provide signals related to the measured voltage, frequency or phase to the collector via the cable, receive current measurement signals from the plurality of sensor circuits and provide the received current measurement signals to the collector via the cable.