According to one embodiment, a semiconductor device includes chips and a first selection circuit. Each of the chips has at least first and second vias for transmitting at least first and second address signals, wherein these chips are stacked to be electrically connected via the first and second vias. The first selection circuit is provided in each chip, and includes a logic circuit that selects a chip based on at least the first and second address signals, and supplies a result of operating the first and second address signals to the subsequent chip.

According to one embodiment, a semiconductor device includes chips and a first selection circuit. Each of the chips has at least first and second vias for transmitting at least first and second address signals, wherein these chips are stacked to be electrically connected via the first and second vias. The first selection circuit is provided in each chip, and includes a logic circuit that selects a chip based on at least the first and second address signals, and supplies a result of operating the first and second address signals to the subsequent chip.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.

A gate driver for a high-side NMOS power transistor in a DC/DC boost converter includes first and second switches coupled in series between an output pin and the gate of the high-side transistor. A third switch is coupled between the gate and a switch-node between the high-side and low-side transistors, the switch node also being coupled to an input pin. Fourth and fifth switches are coupled in series between the output pin and a clamp pin. Sixth and seventh switch are coupled in series between the output pin and a ground pin. First and second bootstrap capacitors have respective first terminals coupled to a first node between the first and second switches. The first capacitor has a second terminal coupled to a node between the fourth and fifth switches; the second capacitor has a second terminal coupled to a node between the sixth and seventh switches.

A gate driver for a high-side NMOS power transistor in a DC/DC boost converter includes first and second switches coupled in series between an output pin and the gate of the high-side transistor. A third switch is coupled between the gate and a switch-node between the high-side and low-side transistors, the switch node also being coupled to an input pin. Fourth and fifth switches are coupled in series between the output pin and a clamp pin. Sixth and seventh switch are coupled in series between the output pin and a ground pin. First and second bootstrap capacitors have respective first terminals coupled to a first node between the first and second switches. The first capacitor has a second terminal coupled to a node between the fourth and fifth switches; the second capacitor has a second terminal coupled to a node between the sixth and seventh switches.

A method and an electronic circuit are disclosed. The method includes driving a transistor device in an on-state by applying a drive voltage higher than a threshold voltage of the transistor device to a drive input, and adjusting a voltage level of the drive voltage based on a load signal that represents a current level of a load current through the transistor device, wherein the current level is an actual current level or an expected current level of the load current.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.