Patent classifications
H04R31/00
MEMS TRANSDUCER WITH INCREASED PERFORMANCE
The invention relates to a MEMS transducer comprising a vibratable membrane for generating or receiving pressure waves in a fluid in a vertical direction, wherein the vibratable membrane is supported by a carrier and the vibratable membrane exhibits two or more vertical sections which are formed parallel to the vertical direction and comprise at least one layer of actuator material. The end of the vibratable membrane is preferably connected to an electrode, such that the two or more vertical sections can be induced to vibrate horizontally by driving the at least one electrode, or such that an electrical signal can be generated at the at least one electrode when the two or more vertical sections are induced to vibrate horizontally.
Method for forming semiconductor device
A method for forming a MEMS device includes following operations. A first semiconductor layer is formed over a substrate. A plurality of first pillars are formed over the first layer. A second layer is formed over the first pillars and the first layer. A plurality of second pillars are formed over the second layer. A third layer is formed over the second pillars and the second layer.
Acoustic receiver and method of making same
An acoustic receiver includes a first receiver subassembly having bottom housing plate with at least a portion of a motor fastened thereto, and a second receiver subassembly having a closed-ended housing wall with at least one open end that is fastened to the bottom housing plate. A method of making and assembling the components is also described.
Acoustic receiver and method of making same
An acoustic receiver includes a first receiver subassembly having bottom housing plate with at least a portion of a motor fastened thereto, and a second receiver subassembly having a closed-ended housing wall with at least one open end that is fastened to the bottom housing plate. A method of making and assembling the components is also described.
Speaker diaphragm, speaker, speaker diaphragm manufacturing method, electronic device, and mobile body apparatus
A speaker diaphragm includes an edge formed from an elastomer, and a diaphragm body that is to be joined to the edge. A joint between the edge and the diaphragm body includes a melting portion between the edge and the diaphragm body.
Speaker panel
The present application provides a method of manufacturing a resonant panel (200) of a flat panel loudspeaker. The method comprises: pressing a resonant panel blank between a first pressing surface (302) and a second pressing surface of a press, whereby to form the resonant panel (200) of the flat panel loudspeaker. The second pressing surface substantially opposes the first pressing surface (302). The first pressing surface (302) comprises at least one tool relief region (306, 312, 314, 316, 318), whereby to form at least one corresponding respective panel relief region (206, 212, 214, 216, 218) in a surface of the resonant panel (200).
PIEZOELECTRIC ACOUSTIC SENSOR AND METHOD FOR MANUFACTURE THEREOF
This application discloses example piezoelectric acoustic sensors and methods for manufacturing the piezoelectric acoustic sensor, and belongs to the field of electronic technologies. In one example, the piezoelectric acoustic sensor includes an anchoring unit, a piezoelectric unit, a support unit, and a hollow-out mechanical part. A back cavity is formed in the anchoring unit. The piezoelectric unit is configured to convert a sound signal that enters the back cavity into an electrical signal. The support unit covers the anchoring unit and the piezoelectric unit. The hollow-out mechanical part is connected between the anchoring unit and the piezoelectric unit, and is embedded in the support unit.
PIEZOELECTRIC ACOUSTIC SENSOR AND METHOD FOR MANUFACTURE THEREOF
This application discloses example piezoelectric acoustic sensors and methods for manufacturing the piezoelectric acoustic sensor, and belongs to the field of electronic technologies. In one example, the piezoelectric acoustic sensor includes an anchoring unit, a piezoelectric unit, a support unit, and a hollow-out mechanical part. A back cavity is formed in the anchoring unit. The piezoelectric unit is configured to convert a sound signal that enters the back cavity into an electrical signal. The support unit covers the anchoring unit and the piezoelectric unit. The hollow-out mechanical part is connected between the anchoring unit and the piezoelectric unit, and is embedded in the support unit.
PIEZOELECTRIC MICROPHONE WITH ENHANCED ANCHOR
A piezoelectric microelectromechanical systems (MEMS) microphone is provided comprising a substrate including walls defining a cavity and at least one of the walls defining an anchor region, a piezoelectric film layer supported by the substrate at the anchor region; an electrode disposed over the piezoelectric film layer and adjacent the anchor region and including an edge adjacent the anchor region having two straight portions and a protruding portion between the two straight portions, and the wall of the cavity that defines the anchor region including an indent corresponding in shape to the protruding portion of the electrode. A method of manufacturing such a MEMS microphone is also provided.
Audio driver and power supply unit architecture
This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.