Disclosed herein are methods for controlling light fixtures comprising unique color light sources with independently controllable luminous flux, comprising controlling a luminous flux of each of the light sources, wherein a spectral distribution of light emitted from the light sources upon being controlled according to settings within a plurality of setting is different between settings, and a color of light emitted from the light sources is similar or identical between settings. The methods may improve color rendering where a certain color of emitted light is required, e.g., where a certain prop or costume is better illuminated with one setting compared to another setting, drawing attention to certain objects in a scene, e.g., by choosing a setting which makes a certain object stand out, and/or providing an intriguing optical effect, e.g., by shifting between settings, which makes certain objects appear to change color while others appear to keep same color.

An infrared heating mechanism and device are provided. The infrared heating mechanism includes infrared heating tubes, wherein a plurality of reflection plates are disposed at intervals in a length direction of the infrared heating tubes, and mounting holes corresponding to the infrared heating tubes are provided on the reflection plates so that the reflection plates are sleeved on side walls of the infrared heating tubes.

A reactor system designed to provide accurate monitoring of wafer temperatures during deposition steps. The reactor system includes a pyrometer mounting assembly supporting and positioning three or more pyrometers (e.g., infrared (IR) pyrometers) relative to the reaction chamber to measure a center wafer temperature and an edge wafer temperature as well as reaction chamber temperature. The pyrometer mounting assembly provides a small spot size or temperature sensing area with the edge pyrometer to accurately measure edge wafer temperatures. A jig assembly, and installation method for each tool setup, is provided for use in achieving accurate alignment of the IR pyrometer sensing spot (and the edge pyrometer) relative to the wafer, when the pyrometer mounting assembly is mounted upon a lamp bank in the reactor system or in tool setup. The wafer edge temperature sensing with the reactor system assembled with proper alignment ensures accurate and repeatable measurement of wafer temperatures.

Systems and methods for reducing contamination of one or more arc lamps are provided. One example implementation is directed to a millisecond anneal system. The millisecond anneal system includes a processing chamber for thermally treating a substrate using a millisecond anneal process. The system further includes one or more arc lamps. Each of the one or more arc lamps is coupled to a water loop for circulating water through the arc lamp during operation of the arc lamp. The system includes a reagent injection source configured to introduce a reagent, such as nitrogen gas, into water circulating through the arc lamp during operation of the arc lamp.

An infrared heating mechanism and device are provided. The infrared heating mechanism includes infrared heating tubes, wherein a plurality of reflection plates are disposed at intervals in a length direction of the infrared heating tubes, and mounting holes corresponding to the infrared heating tubes are provided on the reflection plates so that the reflection plates are sleeved on side walls of the infrared heating tubes.

A system and method for monitoring and operating one or more light emitting devices is disclosed. In one example, light intensity within a dual elliptical reflecting chamber is sensed and operation of a fiber curing system is adjusted in response to an amount of sensed light energy.

A semiconductor fabrication system includes a wafer carrier configured to carry a wafer thereon. A radiation source is positioned above the wafer carrier. The radiation source is configured to emit thermal radiation. A plurality of reflectors is positioned above, and aligned with, an edge region of the wafer. The reflectors each have a reflective coating configured to reflect the thermal radiation. A plurality of separately-controllable motors is coupled to the reflectors, respectively. The motors are each configured to cause its respective reflector to rotate in a counterclockwise direction or a clockwise direction so as to redirect the thermal radiation back toward the edge region of the wafer. A controller is communicatively coupled to the plurality of motors. The controller is configured to control each of the motors separately to cause each motors to rotate independently of other motors.

A system and method for monitoring and operating one or more light emitting devices is disclosed. In one example, light intensity within a dual elliptical reflecting chamber is sensed and operation of a fiber curing system is adjusted in response to an amount of sensed light energy.

Systems and methods for reducing contamination of one or more arc lamps are provided. One example implementation is directed to a millisecond anneal system. The millisecond anneal system includes a processing chamber for thermally treating a substrate using a millisecond anneal process. The system further includes one or more arc lamps. Each of the one or more arc lamps is coupled to a water loop for circulating water through the arc lamp during operation of the arc lamp. The system includes a reagent injection source configured to introduce a reagent, such as nitrogen gas, into water circulating through the arc lamp during operation of the arc lamp.

Systems and methods for reducing contamination of one or more arc lamps are provided. One example implementation is directed to a millisecond anneal system. The millisecond anneal system includes a processing chamber for thermally treating a substrate using a millisecond anneal process. The system further includes one or more arc lamps. Each of the one or more arc lamps is coupled to a water loop for circulating water through the arc lamp during operation of the arc lamp. The system includes a reagent injection source configured to introduce a reagent, such as nitrogen gas, into water circulating through the arc lamp during operation of the arc lamp.