The present disclosure relates to a stable copper-based core-shell nanoparticle and its process of manufacture. Further, the present disclosure relates to the use of the copper-based core-shell nanoparticles as plasmonic photocatalysts in photocalysis and hydrogen production.

The present disclosure relates to a stable copper-based core-shell nanoparticle and its process of manufacture. Further, the present disclosure relates to the use of the copper-based core-shell nanoparticles as plasmonic photocatalysts in photocalysis and hydrogen production.

A rare earth regenerator material particle and a regenerator material particle group having a high long-term reliability, and a superconducting magnet, an examination apparatus, a cryopump and the like using the same are provided. A rare earth regenerator material particle contains a rare earth element as a constituent component, and in the particle, a peak indicating a carbon component is detected in a surface region by an X-ray photoelectron spectroscopy analysis.

While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 μm and a crystallite diameter Dx.sub.(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.

While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 μm and a crystallite diameter Dx.sub.(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.

A metal contact of a residential circuit breaker with ordered ceramic microparticles is provided. The metal contact comprises an electrical contact material comprising a metal alloy and ceramic particles to form a metal matrix composite material. Both materials the metal alloy and the ceramic particles are present together as a metal compound but without forming an alloy. The metal compound is a matrix and reinforcement being the ceramic particles such that first the ceramic particles has a sintering step to get a homogeneous preform for the metal compound being porous with a controlled size obtained by pressing a particle size of about few micrometers of the ceramic particles and then a liquid metal infiltration step to provide a homogenous distribution of the metal alloy and the ceramic particles in a three-dimensional open porous arrangement and the homogenous distribution results in ordered microstructures.

A metal contact of a residential circuit breaker with ordered ceramic microparticles is provided. The metal contact comprises an electrical contact material comprising a metal alloy and ceramic particles to form a metal matrix composite material. Both materials the metal alloy and the ceramic particles are present together as a metal compound but without forming an alloy. The metal compound is a matrix and reinforcement being the ceramic particles such that first the ceramic particles has a sintering step to get a homogeneous preform for the metal compound being porous with a controlled size obtained by pressing a particle size of about few micrometers of the ceramic particles and then a liquid metal infiltration step to provide a homogenous distribution of the metal alloy and the ceramic particles in a three-dimensional open porous arrangement and the homogenous distribution results in ordered microstructures.

The disclosed process is capable of depositing thin layers of a wide variety of metals onto powders of magnesium, aluminum, and their alloys. A material is provided that comprises particles containing a reactive metal coated with a noble metal that has a less-negative standard reduction potential than the reactive metal. The coating has a thickness from 1 nanometer to 100 microns, for example. A method of forming an immersion deposit on a reactive metal comprises: combining a reactive metal, an ionic liquid, and a noble metal salt; depositing the noble metal on the reactive metal by a surface-displacement reaction, thereby generating the immersion deposit on the reactive metal; and removing the ionic liquid from the immersion deposit. The material may be present in an article or object (e.g., a sintered part) containing from 0.25 wt % to 100 wt % of a coated reactive metal as disclosed herein.

The disclosed process is capable of depositing thin layers of a wide variety of metals onto powders of magnesium, aluminum, and their alloys. A material is provided that comprises particles containing a reactive metal coated with a noble metal that has a less-negative standard reduction potential than the reactive metal. The coating has a thickness from 1 nanometer to 100 microns, for example. A method of forming an immersion deposit on a reactive metal comprises: combining a reactive metal, an ionic liquid, and a noble metal salt; depositing the noble metal on the reactive metal by a surface-displacement reaction, thereby generating the immersion deposit on the reactive metal; and removing the ionic liquid from the immersion deposit. The material may be present in an article or object (e.g., a sintered part) containing from 0.25 wt % to 100 wt % of a coated reactive metal as disclosed herein.

This application relates to semiconductor manufacturing, and more particularly to an interconnect structure for semiconductors with an ultra-fine pitch and a forming method thereof. The forming method includes: preparing copper nanoparticles using a vapor deposition device, where coupling parameters of the vapor deposition device are adjusted to control an initial particle size of the copper nanoparticles; depositing the copper nanoparticles on a substrate; invertedly placing a chip with copper pillars as I/O ports on the substrate; and subjecting the chip and the substrate to hot-pressing sintering to enable the bonding.