The present disclosure relates to the field of sensor manufacturing technology, particularly discloses a method for manufacturing a micro-sensor body, comprising the steps of S1: applying a wet colloidal material on a substrate to form a colloidal layer, and covering a layer of one-dimensional nanowire film on the surface of the colloidal layer to form a sensor embryo; S2: drying the colloidal layer of the sensor embryo to an extent that the colloidal layer cracks into a plurality of colloidal islands, a portion of the one-dimensional nanowire film contracting into a contraction diaphragm adhered to the surface of the colloidal islands while the other portion of the one-dimensional nanowire film being stretched into a connection structure connected between the adjacent contraction diaphragms. By the method for manufacturing a micro-sensor body of the present disclosure, the contraction diaphragms and connection structures formed by stretching the one-dimensional nanowire film are connected stably, which enhances the stability of the sensor devices; and the cracking manner renders it easy to obtain a large-scale of sensor bodies with connection structure arrays in stable suspension.

A metal workpiece, such as a wheel, and a method of providing an enhanced corrosion resistant surface coating on an exposed surface of a metal or alloy substrate (such as magnesium). A corrosion resistance basecoat is formed, including generating an oxide layer, and applying a first primer coating onto at least a portion of the oxide layer. The method may further include identifying highest corrosion prone areas on the substrate and designing a support rack that avoids contact with these corrosion prone areas. The method also includes forming a topcoat over at least a portion of the basecoat, by applying a second primer coating onto at least a portion of the first primer coating and depositing a sputtered metallic film onto the second primer coating using a physical vapor deposition technique. A clear coat layer may be applied over the metallic film.

A metal workpiece, such as a wheel, and a method of providing an enhanced corrosion resistant surface coating on an exposed surface of a metal or alloy substrate (such as magnesium). A corrosion resistance basecoat is formed, including generating an oxide layer, and applying a first primer coating onto at least a portion of the oxide layer. The method may further include identifying highest corrosion prone areas on the substrate and designing a support rack that avoids contact with these corrosion prone areas. The method also includes forming a topcoat over at least a portion of the basecoat, by applying a second primer coating onto at least a portion of the first primer coating and depositing a sputtered metallic film onto the second primer coating using a physical vapor deposition technique. A clear coat layer may be applied over the metallic film.

A method for producing a tool coated with a hard coating, the method including the following steps: applying a TiAlN coating layer onto a substrate with a first magnetron sputtering process and applying a Ti.sub.xSi.sub.1-xN coating layer onto the TiAlN layer with a second magnetron sputtering process, where x is smaller than or equal to 0.85 and preferably between and including 0.80 and 0. 70 whereas the second magnetron sputtering process is performed with power densities greater than 100 W/cm.sup.2 and as such is a HIPIMS process.

A target sputtering device includes: a back plate; and a plurality of electromagnetic coil units uniformly distributed underneath the back plate and insulated with each other, wherein the plurality of electromagnetic coil units are configured to generate a magnetic field, which is movable relative to the back plate and orthogonal to the back plate, in a preset period. There is further disclosed a method for sputtering a target using the above-described target sputtering device.

An ophthalmic lens comprising an antireflective stack which strongly reduces reflection in the UV range and in the visible range. The antireflective stack comprises composite high index layers comprising zirconium oxide and another metal oxide.

A sputtering target, which has a component composition including: 30.0-67.0 atomic % of Ga; and the Cu balance containing inevitable impurities, wherein the sputtering target is a sintered material having a structure in which θ phases made of Cu—Ga alloy are dispersed in a matrix of the γ phases made of Cu—Ga alloy, is provided.

A semiconductor manufacturing device has a cooling pad with a plurality of movable pins. The cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway. Each of the plurality of springs is disposed under a respective movable pin. A substrate includes an electrical component disposed over a surface of the substrate. The substrate is disposed over the cooling pad with the electrical component oriented toward the cooling pad. A force is applied to the substrate to compress the springs. At least one of the movable pins contacts the substrate. A cooling fluid is disposed through the fluid pathway.

A semiconductor manufacturing device has a cooling pad with a plurality of movable pins. The cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway. Each of the plurality of springs is disposed under a respective movable pin. A substrate includes an electrical component disposed over a surface of the substrate. The substrate is disposed over the cooling pad with the electrical component oriented toward the cooling pad. A force is applied to the substrate to compress the springs. At least one of the movable pins contacts the substrate. A cooling fluid is disposed through the fluid pathway.

According to an embodiment, a processing apparatus includes a generator mount, a first-object mount, and a first collimator. A particle generator capable of emitting particles is placed on the generator mount. A first object is placed on the first-object mount. The first collimator is placed between the generator mount and the first-object mount, and has first walls and second walls. In the first collimator, the first walls and the second walls form first through holes extending in a first direction from the generator mount to the first-object mount. Each of the second walls is provided with at least one first passage.