A manufacturing method of a deposition mask includes a resin-layer forming step of forming a resin layer on one surface of a substrate by applying a resin solution to the surface of the substrate, a step of forming a non-contact area, which is not in contact with the surface of the substrate in the resin layer, by removing at least a part of the substrate, a step of bringing the resin layer into contact with a liquid or heating the resin layer after the non-contact area has been formed in the resin layer, and a resin-layer processing step of forming an opening in the resin layer by processing the resin layer after the step of bringing the resin layer into contact with the liquid or heating the resin layer.

Systems for depositing coatings onto surfaces of molds and other articles are generally provided. In some embodiments, a system is adapted and arranged to cause gaseous species to flow parallel to a filament array. In some embodiments, a system comprises one or more mold supports that are translatable.

Systems for depositing coatings onto surfaces of molds and other articles are generally provided. In some embodiments, a system is adapted and arranged to cause gaseous species to flow parallel to a filament array. In some embodiments, a system comprises one or more mold supports that are translatable.

A substrate cleaning apparatus that cleans a processing target substrate by blasting the gas clusters to the processing target substrate. The apparatus includes: a chamber configured to accommodate the processing target substrate; a rotary stage configured to rotatably support the processing target substrate in the chamber; an blasting unit configured to blast the gas clusters to the processing target substrate supported by the rotary stage; a driving unit configured to scan a gas cluster-blasted position on the processing target substrate; an exhaust port configured to evacuate the chamber; and a control mechanism configured to control a scattering direction of particles by controlling a rotation direction of the processing target substrate by the rotary stage and a scanning direction of the gas cluster-blasted position, thereby suppressing re-adhesion of the particles to the processing target substrate.

A film deposition apparatus includes a vacuum chamber and a turntable provided in the vacuum chamber. A concave portion is formed in a surface of the turntable to accommodate a substrate therein, and a pedestal portion is provided to support a location inside a periphery of the substrate in the concave portion. At least one communication passage is formed in a wall portion of the concave portion to cause a first space around the pedestal portion in the concave portion to be in communication with a second space outside the turntable provided in an end area of the concave portion located opposite to a first center of the turntable when seen from a second center of the concave portion. An exhaust opening is provided to evacuate the vacuum chamber.

The present invention provides a technique for performing film formation at low cost without causing a short-circuit between sputtered films formed on opposite surfaces of a film-formation target substrate. According to the present invention, in a substrate-holder conveyance mechanism 3, a substrate holder 11 is conveyed by a first conveyance portion so that the substrate holder 11 passes through a first film formation region; film formation is performed by sputtering on a first surface of a film-formation target substrate 50 held by the substrate holder 11; the substrate holder 11 is conveyed from the first conveyance portion to a second conveyance portion in such a manner as to make a turn with the up/down orientation of the substrate holder 11 maintained; the substrate holder 11 is conveyed by the second conveyance portion in a direction opposite to the direction of conveyance by the first conveyance portion so that the substrate holder 11 passes through a second film formation region; and film formation is performed by sputtering on a second surface of the film-formation target substrate 50. The substrate holder 11 has openings 14 and 15 through which first and second surfaces of the film-formation target substrate 50 are exposed, and includes a shield portion 16 for shielding an edge portion of the film-formation target substrate 50 from a film formation material supplied from a second sputtering source.

The present invention provides a technique for performing film formation at low cost without causing a short-circuit between sputtered films formed on opposite surfaces of a film-formation target substrate. According to the present invention, in a substrate-holder conveyance mechanism 3, a substrate holder 11 is conveyed by a first conveyance portion so that the substrate holder 11 passes through a first film formation region; film formation is performed by sputtering on a first surface of a film-formation target substrate 50 held by the substrate holder 11; the substrate holder 11 is conveyed from the first conveyance portion to a second conveyance portion in such a manner as to make a turn with the up/down orientation of the substrate holder 11 maintained; the substrate holder 11 is conveyed by the second conveyance portion in a direction opposite to the direction of conveyance by the first conveyance portion so that the substrate holder 11 passes through a second film formation region; and film formation is performed by sputtering on a second surface of the film-formation target substrate 50. The substrate holder 11 has openings 14 and 15 through which first and second surfaces of the film-formation target substrate 50 are exposed, and includes a shield portion 16 for shielding an edge portion of the film-formation target substrate 50 from a film formation material supplied from a second sputtering source.

The present invention relates to a device for holding, positioning and/or moving an object, with a base and with a carrier movable relative to the base, at least one magnetic bearing for generating a bearing or holding force between the base and the carrier, wherein the carrier is contactlessly supported on the base via the magnetic bearing, at least one drive acting contactlessly between base and carrier for the displacement of the carrier along the base in at least one transport direction, wherein the drive comprises a linear motor with at least one slider and one stator, which are arranged on the base and on the carrier and which, aside from a displacement force acting along the transport direction, are configured to create a counter-force between base and carrier which counteracts the bearing or holding force.

The present invention relates to a device for holding, positioning and/or moving an object, with a base and with a carrier movable relative to the base, at least one magnetic bearing for generating a bearing or holding force between the base and the carrier, wherein the carrier is contactlessly supported on the base via the magnetic bearing, at least one drive acting contactlessly between base and carrier for the displacement of the carrier along the base in at least one transport direction, wherein the drive comprises a linear motor with at least one slider and one stator, which are arranged on the base and on the carrier and which, aside from a displacement force acting along the transport direction, are configured to create a counter-force between base and carrier which counteracts the bearing or holding force.

Disclosed is a method and apparatus for forming a coating layer using a physical vapor deposition apparatus equipped with a sputtering apparatus and an arc ion plating apparatus, comprising: a first coating step of forming a Mo coating layer on a base material using a the sputtering apparatus and a Mo target and Ar gas; a nitrating step of forming a nitride film forming condition using an arc ion plating apparatus and Ar gas and N.sub.2 gas; a second coating step of forming a nano composite coating layer of CrMoN using the Mo target and Ar gas of the sputtering apparatus and the Ar gas, N.sub.2 gas and a Cr source of the arc ion plating apparatus at the same time; and a multi-coating step of forming a multi-layer having alternating CrMoN nano composite coating layers and Mo coating layers by revolving the base material around a central pivot.